JPH0376599B2 - - Google Patents

Info

Publication number
JPH0376599B2
JPH0376599B2 JP57226758A JP22675882A JPH0376599B2 JP H0376599 B2 JPH0376599 B2 JP H0376599B2 JP 57226758 A JP57226758 A JP 57226758A JP 22675882 A JP22675882 A JP 22675882A JP H0376599 B2 JPH0376599 B2 JP H0376599B2
Authority
JP
Japan
Prior art keywords
substrate
plating
bath
electroless copper
copper plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57226758A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59119786A (ja
Inventor
Takakazu Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP22675882A priority Critical patent/JPS59119786A/ja
Publication of JPS59119786A publication Critical patent/JPS59119786A/ja
Publication of JPH0376599B2 publication Critical patent/JPH0376599B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP22675882A 1982-12-27 1982-12-27 プリント配線板の無電解銅めっき方法 Granted JPS59119786A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22675882A JPS59119786A (ja) 1982-12-27 1982-12-27 プリント配線板の無電解銅めっき方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22675882A JPS59119786A (ja) 1982-12-27 1982-12-27 プリント配線板の無電解銅めっき方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP1100289A Division JPH02191393A (ja) 1989-01-21 1989-01-21 プリント配線板の無電解銅めっき方法

Publications (2)

Publication Number Publication Date
JPS59119786A JPS59119786A (ja) 1984-07-11
JPH0376599B2 true JPH0376599B2 (en, 2012) 1991-12-05

Family

ID=16850148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22675882A Granted JPS59119786A (ja) 1982-12-27 1982-12-27 プリント配線板の無電解銅めっき方法

Country Status (1)

Country Link
JP (1) JPS59119786A (en, 2012)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9951433B2 (en) 2014-01-27 2018-04-24 Okuno Chemical Industries Co., Ltd. Conductive film-forming bath
US10036097B2 (en) 2012-12-21 2018-07-31 Okuno Chemical Industries Co., Ltd. Conductive coating film forming bath

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6063987A (ja) * 1983-09-17 1985-04-12 沖電気工業株式会社 印刷配線基板の製造方法
JPS61199692A (ja) * 1985-02-28 1986-09-04 日立コンデンサ株式会社 フルアデイテイブ配線板の製造方法
JPS6457799A (en) * 1987-08-28 1989-03-06 Nippon Sanmo Deying Ferrite with conductive metal film and manufacture thereof
JPH01238094A (ja) * 1988-03-18 1989-09-22 Elna Co Ltd プリント基板のメッキ方法
JPH02191393A (ja) * 1989-01-21 1990-07-27 Ibiden Co Ltd プリント配線板の無電解銅めっき方法
EP0747507B1 (en) 1994-12-27 2001-02-14 Ibiden Co., Ltd. Pretreatment solution for electroless plating, electroless plating bath and electroless plating method
JP4399984B2 (ja) 1998-03-13 2010-01-20 株式会社ニコン リニアモータ製造方法、リニアモータ、該リニアモータを備えたステージ装置、および露光装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55117299A (en) * 1979-03-05 1980-09-09 Hitachi Ltd Method of fabricating printed circuit board by noovoltage copper plating
JPS56163256A (en) * 1980-05-21 1981-12-15 Hitachi Ltd Plating method for printed wiring substrate having iron core
JPS57192099A (en) * 1981-05-22 1982-11-26 Hitachi Ltd Method of producing printed board
JPS58128790A (ja) * 1982-01-27 1983-08-01 株式会社日立製作所 プリント基板の製法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10036097B2 (en) 2012-12-21 2018-07-31 Okuno Chemical Industries Co., Ltd. Conductive coating film forming bath
US9951433B2 (en) 2014-01-27 2018-04-24 Okuno Chemical Industries Co., Ltd. Conductive film-forming bath

Also Published As

Publication number Publication date
JPS59119786A (ja) 1984-07-11

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