JPS55117299A - Method of fabricating printed circuit board by noovoltage copper plating - Google Patents

Method of fabricating printed circuit board by noovoltage copper plating

Info

Publication number
JPS55117299A
JPS55117299A JP2448679A JP2448679A JPS55117299A JP S55117299 A JPS55117299 A JP S55117299A JP 2448679 A JP2448679 A JP 2448679A JP 2448679 A JP2448679 A JP 2448679A JP S55117299 A JPS55117299 A JP S55117299A
Authority
JP
Japan
Prior art keywords
noovoltage
circuit board
printed circuit
copper plating
fabricating printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2448679A
Other languages
Japanese (ja)
Other versions
JPS6349397B2 (en
Inventor
Mineo Kawamoto
Kanji Murakami
Youichi Matsuda
Motoyo Wajima
Yasusada Morishita
Toyofusa Yoshimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2448679A priority Critical patent/JPS55117299A/en
Publication of JPS55117299A publication Critical patent/JPS55117299A/en
Publication of JPS6349397B2 publication Critical patent/JPS6349397B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2448679A 1979-03-05 1979-03-05 Method of fabricating printed circuit board by noovoltage copper plating Granted JPS55117299A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2448679A JPS55117299A (en) 1979-03-05 1979-03-05 Method of fabricating printed circuit board by noovoltage copper plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2448679A JPS55117299A (en) 1979-03-05 1979-03-05 Method of fabricating printed circuit board by noovoltage copper plating

Publications (2)

Publication Number Publication Date
JPS55117299A true JPS55117299A (en) 1980-09-09
JPS6349397B2 JPS6349397B2 (en) 1988-10-04

Family

ID=12139508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2448679A Granted JPS55117299A (en) 1979-03-05 1979-03-05 Method of fabricating printed circuit board by noovoltage copper plating

Country Status (1)

Country Link
JP (1) JPS55117299A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59119786A (en) * 1982-12-27 1984-07-11 イビデン株式会社 Method of electrolessly plating copper for printed circuit board
JPS60254788A (en) * 1984-05-31 1985-12-16 日立エーアイシー株式会社 Method of producing printed circuit board
JPS60254787A (en) * 1984-05-31 1985-12-16 日立コンデンサ株式会社 Method of producing printed circuit board
JPS63166973A (en) * 1986-12-27 1988-07-11 Sankyo Kasei Kk Production of formed article such as circuit board
US4865877A (en) * 1986-11-08 1989-09-12 Matsushita Electric Works, Ltd. Method for roughening ceramic substrate surface and method for manufacturing printed circuit board using surface-roughened ceramic substrate
WO2004031447A1 (en) * 2002-10-07 2004-04-15 Tokyo Electron Limited Method of electroless plating
JP2008174817A (en) * 2007-01-22 2008-07-31 C Uyemura & Co Ltd Method for forming displacement tin alloy plated film, displacement tin alloy plating bath, and method for maintaining plating performance

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59119786A (en) * 1982-12-27 1984-07-11 イビデン株式会社 Method of electrolessly plating copper for printed circuit board
JPH0376599B2 (en) * 1982-12-27 1991-12-05 Ibiden Co Ltd
JPS60254788A (en) * 1984-05-31 1985-12-16 日立エーアイシー株式会社 Method of producing printed circuit board
JPS60254787A (en) * 1984-05-31 1985-12-16 日立コンデンサ株式会社 Method of producing printed circuit board
US4865877A (en) * 1986-11-08 1989-09-12 Matsushita Electric Works, Ltd. Method for roughening ceramic substrate surface and method for manufacturing printed circuit board using surface-roughened ceramic substrate
JPS63166973A (en) * 1986-12-27 1988-07-11 Sankyo Kasei Kk Production of formed article such as circuit board
WO2004031447A1 (en) * 2002-10-07 2004-04-15 Tokyo Electron Limited Method of electroless plating
JP2008174817A (en) * 2007-01-22 2008-07-31 C Uyemura & Co Ltd Method for forming displacement tin alloy plated film, displacement tin alloy plating bath, and method for maintaining plating performance

Also Published As

Publication number Publication date
JPS6349397B2 (en) 1988-10-04

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