JPS55117299A - Method of fabricating printed circuit board by noovoltage copper plating - Google Patents
Method of fabricating printed circuit board by noovoltage copper platingInfo
- Publication number
- JPS55117299A JPS55117299A JP2448679A JP2448679A JPS55117299A JP S55117299 A JPS55117299 A JP S55117299A JP 2448679 A JP2448679 A JP 2448679A JP 2448679 A JP2448679 A JP 2448679A JP S55117299 A JPS55117299 A JP S55117299A
- Authority
- JP
- Japan
- Prior art keywords
- noovoltage
- circuit board
- printed circuit
- copper plating
- fabricating printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2448679A JPS55117299A (en) | 1979-03-05 | 1979-03-05 | Method of fabricating printed circuit board by noovoltage copper plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2448679A JPS55117299A (en) | 1979-03-05 | 1979-03-05 | Method of fabricating printed circuit board by noovoltage copper plating |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55117299A true JPS55117299A (en) | 1980-09-09 |
JPS6349397B2 JPS6349397B2 (en) | 1988-10-04 |
Family
ID=12139508
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2448679A Granted JPS55117299A (en) | 1979-03-05 | 1979-03-05 | Method of fabricating printed circuit board by noovoltage copper plating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55117299A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59119786A (en) * | 1982-12-27 | 1984-07-11 | イビデン株式会社 | Method of electrolessly plating copper for printed circuit board |
JPS60254788A (en) * | 1984-05-31 | 1985-12-16 | 日立エーアイシー株式会社 | Method of producing printed circuit board |
JPS60254787A (en) * | 1984-05-31 | 1985-12-16 | 日立コンデンサ株式会社 | Method of producing printed circuit board |
JPS63166973A (en) * | 1986-12-27 | 1988-07-11 | Sankyo Kasei Kk | Production of formed article such as circuit board |
US4865877A (en) * | 1986-11-08 | 1989-09-12 | Matsushita Electric Works, Ltd. | Method for roughening ceramic substrate surface and method for manufacturing printed circuit board using surface-roughened ceramic substrate |
WO2004031447A1 (en) * | 2002-10-07 | 2004-04-15 | Tokyo Electron Limited | Method of electroless plating |
JP2008174817A (en) * | 2007-01-22 | 2008-07-31 | C Uyemura & Co Ltd | Method for forming displacement tin alloy plated film, displacement tin alloy plating bath, and method for maintaining plating performance |
-
1979
- 1979-03-05 JP JP2448679A patent/JPS55117299A/en active Granted
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59119786A (en) * | 1982-12-27 | 1984-07-11 | イビデン株式会社 | Method of electrolessly plating copper for printed circuit board |
JPH0376599B2 (en) * | 1982-12-27 | 1991-12-05 | Ibiden Co Ltd | |
JPS60254788A (en) * | 1984-05-31 | 1985-12-16 | 日立エーアイシー株式会社 | Method of producing printed circuit board |
JPS60254787A (en) * | 1984-05-31 | 1985-12-16 | 日立コンデンサ株式会社 | Method of producing printed circuit board |
US4865877A (en) * | 1986-11-08 | 1989-09-12 | Matsushita Electric Works, Ltd. | Method for roughening ceramic substrate surface and method for manufacturing printed circuit board using surface-roughened ceramic substrate |
JPS63166973A (en) * | 1986-12-27 | 1988-07-11 | Sankyo Kasei Kk | Production of formed article such as circuit board |
WO2004031447A1 (en) * | 2002-10-07 | 2004-04-15 | Tokyo Electron Limited | Method of electroless plating |
JP2008174817A (en) * | 2007-01-22 | 2008-07-31 | C Uyemura & Co Ltd | Method for forming displacement tin alloy plated film, displacement tin alloy plating bath, and method for maintaining plating performance |
Also Published As
Publication number | Publication date |
---|---|
JPS6349397B2 (en) | 1988-10-04 |
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