JPH0375537U - - Google Patents
Info
- Publication number
- JPH0375537U JPH0375537U JP13776789U JP13776789U JPH0375537U JP H0375537 U JPH0375537 U JP H0375537U JP 13776789 U JP13776789 U JP 13776789U JP 13776789 U JP13776789 U JP 13776789U JP H0375537 U JPH0375537 U JP H0375537U
- Authority
- JP
- Japan
- Prior art keywords
- glass
- glass layer
- package
- insulating base
- semiconductor elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Description
第１図は本考案のガラス封止型半導体素子収納
用パツケージの分解断面図、第２図は第１図のパ
ツケージを使用して形成された半導体装置の断面
図、第３図は従来のガラス封止型半導体素子収納
用パツケージの分解断面図である。
１……絶縁基体、２……蓋体、３……絶縁容器
、５ａ，５ｂ……封止用ガラス層、６……外部リ
ード端子。
Figure 1 is an exploded sectional view of the glass-sealed package for housing semiconductor elements of the present invention, Figure 2 is a sectional view of a semiconductor device formed using the package of Figure 1, and Figure 3 is a conventional glass-sealed package for housing semiconductor elements. FIG. 2 is an exploded cross-sectional view of a sealed semiconductor element storage package. DESCRIPTION OF SYMBOLS 1... Insulating base, 2... Lid, 3... Insulating container, 5a, 5b... Glass layer for sealing, 6... External lead terminal.
Claims (1)
体と蓋体とで外部リード端子を挟持し、前記ガラ
ス層を溶融一体化することにより半導体素子を内
部に気密封止するガラス封止型半導体素子収納用
パツケージにおいて、前記絶縁基体及び蓋体に被
着させたガラス層はその頂面が半径１．５mm以下
の円弧状を成し、且つ最大厚みが０．１０乃至０
．６０mmであることを特徴とするガラス封止型半
導体素子収納用パツケージ。 A glass-sealed type in which an external lead terminal is sandwiched between an insulating base and a lid whose main surfaces that face each other are covered with a glass layer, and the semiconductor element is hermetically sealed inside by melting and integrating the glass layer. In the package for storing semiconductor elements, the glass layer attached to the insulating base and the lid has a top surface in the shape of an arc with a radius of 1.5 mm or less, and a maximum thickness of 0.10 to 0.0 mm.
．． A glass-sealed package for storing semiconductor elements characterized by its 60mm diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13776789U JPH0375537U (en) | 1989-11-27 | 1989-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13776789U JPH0375537U (en) | 1989-11-27 | 1989-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0375537U true JPH0375537U (en) | 1991-07-29 |
Family
ID=31684910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13776789U Pending JPH0375537U (en) | 1989-11-27 | 1989-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0375537U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01234339A (en) * | 1988-03-11 | 1989-09-19 | Murata Mfg Co Ltd | Formation of glass film |
-
1989
- 1989-11-27 JP JP13776789U patent/JPH0375537U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01234339A (en) * | 1988-03-11 | 1989-09-19 | Murata Mfg Co Ltd | Formation of glass film |
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