JPH01127257U - - Google Patents
Info
- Publication number
- JPH01127257U JPH01127257U JP2363588U JP2363588U JPH01127257U JP H01127257 U JPH01127257 U JP H01127257U JP 2363588 U JP2363588 U JP 2363588U JP 2363588 U JP2363588 U JP 2363588U JP H01127257 U JPH01127257 U JP H01127257U
- Authority
- JP
- Japan
- Prior art keywords
- outer ring
- glass
- metal outer
- airtight terminal
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000008188 pellet Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Description
第1図は本考案に係る気密端子の一実施例を示
す要部側断面図、第2図は従来の整合封止型気密
端子の一具体例とその収容される半導体ペレツト
を示す側断面図、第3図と第4図は従来の圧縮封
止型気密端子の一具体例とその要部を示す各側断
面図、第5図は本考案の背景となる改良された従
来の圧縮封止型気密端子を示す要部側断面図であ
る。
7…金属外環、7a…リード挿通孔、7d…凹
部、8…リード、9…ガラス、9a…ガラス封着
上面、12…絶縁材。
Fig. 1 is a side sectional view of the main part showing one embodiment of the airtight terminal according to the present invention, and Fig. 2 is a side sectional view showing one specific example of the conventional matched sealing type airtight terminal and the semiconductor pellet accommodated therein. , Figures 3 and 4 are side sectional views showing a specific example of a conventional compression-sealed airtight terminal and its essential parts, and Figure 5 is an improved conventional compression-sealed terminal that is the background of the present invention. FIG. 3 is a side cross-sectional view of a main part of the molded airtight terminal. 7...Metal outer ring, 7a...Lead insertion hole, 7d...Recess, 8...Lead, 9...Glass, 9a...Glass sealing upper surface, 12...Insulating material.
Claims (1)
して気密的にガラス封着すると共に、ガラス封着
上面を金属外環上端面から凹入させた気密端子に
おいて、 上記ガラス封着上面と金属外環とで形成された
凹部内に絶縁材を充填したことを特徴とする気密
端子。[Scope of Claim for Utility Model Registration] An airtight terminal in which a lead is inserted into a metal outer ring having a lead insertion hole and hermetically sealed with glass, and the upper surface of the glass seal is recessed from the upper end surface of the metal outer ring, An airtight terminal characterized in that an insulating material is filled in the recess formed by the glass-sealed upper surface and the metal outer ring.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2363588U JPH01127257U (en) | 1988-02-23 | 1988-02-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2363588U JPH01127257U (en) | 1988-02-23 | 1988-02-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01127257U true JPH01127257U (en) | 1989-08-31 |
Family
ID=31242793
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2363588U Pending JPH01127257U (en) | 1988-02-23 | 1988-02-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01127257U (en) |
-
1988
- 1988-02-23 JP JP2363588U patent/JPH01127257U/ja active Pending
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