JPS623898Y2 - - Google Patents
Info
- Publication number
- JPS623898Y2 JPS623898Y2 JP1982192443U JP19244382U JPS623898Y2 JP S623898 Y2 JPS623898 Y2 JP S623898Y2 JP 1982192443 U JP1982192443 U JP 1982192443U JP 19244382 U JP19244382 U JP 19244382U JP S623898 Y2 JPS623898 Y2 JP S623898Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- insertion hole
- wire insertion
- wall surface
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 40
- 230000037431 insertion Effects 0.000 claims description 26
- 238000003780 insertion Methods 0.000 claims description 26
- 239000011810 insulating material Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 1
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
【考案の詳細な説明】
本考案は回路素子等を気密に封入する気密パツ
ケージの気密端子の構造に関するものである。[Detailed Description of the Invention] The present invention relates to the structure of an airtight terminal of an airtight package that airtightly encapsulates circuit elements and the like.
気密パツケージは、第１図に示すように方形等
の形状の枠体１に穿設されたリード線挿通孔２に
リード線３を挿通し、ガラス等の絶縁材４で気密
に封着した気密端子Ｔの前記リード線３の先端に
回路素子等（図示せず）を接続し、気密端子Ｔの
開放面をベースＢ及びキヤツプＣで被い、回路素
子等を気密に封入するものである。 As shown in Fig. 1, the airtight package is an airtight package in which a lead wire 3 is inserted into a lead wire insertion hole 2 formed in a rectangular frame 1, and the lead wire 3 is hermetically sealed with an insulating material 4 such as glass. A circuit element or the like (not shown) is connected to the tip of the lead wire 3 of the terminal T, and the open surface of the airtight terminal T is covered with a base B and a cap C to airtightly encapsulate the circuit element or the like.
前述のような気密端子Ｔは、方形等の枠体１を
有し、リード線挿通孔２が前記枠体１の壁面に穿
設されているが、従来、リード線挿通孔２の設け
られている壁面１ａの厚さａと、リード線挿通孔
２の穿設されていない壁面１ｂの厚さｂは同一寸
法であつた。すなわち、リード線挿通孔２の穿設
されている壁面１ａは、リード線挿通孔２が穿設
されているため強度が劣ることになると共に、リ
ード線３を前記リード線挿通孔２に絶縁材４で封
着するため、リード線２の抜落を防止し、かつ封
着部の気密性を確保しなければならない。このた
めある程度の厚さが要求される。しかし、壁面１
ｂはリード線挿通孔２が穿設していないため、壁
面１ｂの強度は、壁面１ａと同一の厚さでは充分
すぎると言う事態となる。 The airtight terminal T as described above has a frame 1 having a rectangular shape or the like, and a lead wire insertion hole 2 is formed in the wall surface of the frame 1. Conventionally, the lead wire insertion hole 2 has not been provided. The thickness a of the wall surface 1a in which the lead wire insertion hole 2 was formed was the same as the thickness b of the wall surface 1b in which the lead wire insertion hole 2 was not formed. That is, the wall surface 1a in which the lead wire insertion hole 2 is formed has inferior strength because the lead wire insertion hole 2 is formed therein, and the lead wire 3 is inserted into the lead wire insertion hole 2 using an insulating material. 4, it is necessary to prevent the lead wire 2 from falling off and to ensure airtightness of the sealed portion. For this reason, a certain degree of thickness is required. However, wall 1
Since the lead wire insertion hole 2 is not formed in the wall 1b, the strength of the wall surface 1b is more than sufficient if it has the same thickness as the wall surface 1a.
本考案は前述の点に鑑みなされたものであり、
リード線挿通孔２の形成されている壁面と形成さ
れていない壁面の厚さを変化せしめることにより
気密端子Ｔの価格の低減を図らんとするものであ
る。 This invention was made in view of the above points,
The purpose is to reduce the cost of the airtight terminal T by varying the thickness of the wall surface where the lead wire insertion hole 2 is formed and the wall surface where the lead wire insertion hole 2 is not formed.
したがつて本考案による気密端子Ｔは、方形等
の枠体の壁面にリード線挿通孔を設け、このリー
ド線挿通孔にリード線を挿通し、絶縁材で気密に
封着した気密端子において、リード線挿通孔の設
けられていない枠体壁面の厚さをリード線挿通孔
の設けられている枠体壁面よりも薄くしたことを
特徴とするものである。 Therefore, the airtight terminal T according to the present invention is an airtight terminal in which a lead wire insertion hole is provided in the wall surface of a rectangular frame, the lead wire is inserted into the lead wire insertion hole, and the airtight terminal is hermetically sealed with an insulating material. It is characterized in that the thickness of the frame wall surface where the lead wire insertion holes are not provided is thinner than the thickness of the frame wall surface where the lead wire insertion holes are provided.
本考案の一実施例を図面を参照し説明する。 An embodiment of the present invention will be described with reference to the drawings.
第２図は本考案の一実施例の斜視図であり、第
１図と同一の符号は同一のものを示す。 FIG. 2 is a perspective view of an embodiment of the present invention, and the same reference numerals as in FIG. 1 indicate the same parts.
第２図に示したように、本考案による一実施例
の気密端子Ｔは、方形の気密端子本体となる枠体
１を有し、対面する前記枠体１の壁面１ａ，１ａ
にリード線挿通孔２が穿設されている。このリー
ド線挿通孔２に、リード線３は挿通され、絶縁材
４で気密に封着されている。 As shown in FIG. 2, an airtight terminal T according to an embodiment of the present invention has a frame 1 serving as a rectangular airtight terminal body, and facing wall surfaces 1a, 1a of the frame 1.
A lead wire insertion hole 2 is bored in the. A lead wire 3 is inserted through the lead wire insertion hole 2 and hermetically sealed with an insulating material 4.
本考案によれば、リード線挿通孔２が穿設され
ていない壁面１ｂ，１ｂの厚さb′はリード線挿通
孔２が形成され、リード線３が封着されている壁
面１ａの厚さa′よりも薄くなつている。これは、
リード線３が封着されている壁面１ａ，１ａはリ
ード線３の封着強度等を考慮し、厚めにしなけれ
ばならないが、リード線３が封着されていない壁
面１ｂ，１ｂは、リード線２の封着強度、封着部
の気密性を考慮する必要がなく、枠体１自体の強
度のみを配慮すれば足りるからである。すなわ
ち、従来のように壁面１ａと１ｂの厚さを同一寸
法とする必面はなく、所望の枠体１の強度を充た
す厚さまで薄くすることができる。 According to the present invention, the thickness b' of the wall surfaces 1b and 1b in which the lead wire insertion hole 2 is not formed is the thickness of the wall surface 1a in which the lead wire insertion hole 2 is formed and the lead wire 3 is sealed. It is thinner than a′. this is,
The wall surfaces 1a, 1a to which the lead wire 3 is sealed must be made thicker considering the sealing strength of the lead wire 3, etc., but the wall surfaces 1b, 1b to which the lead wire 3 is not sealed must be made thicker. This is because there is no need to consider the sealing strength of 2 and the airtightness of the sealed portion, and it is sufficient to consider only the strength of the frame 1 itself. That is, it is not necessary that the wall surfaces 1a and 1b have the same thickness as in the conventional case, but it is possible to reduce the thickness to a value that satisfies the desired strength of the frame 1.
以上説明したように、本考案による気密端子に
よれば、リード線を封着していない壁面の厚さを
薄くしたため、気密端子のリード線封着強度、気
密性を損うことなく、軽量化できると共に、コス
トの低減を図ることができると言う利点がある。 As explained above, according to the airtight terminal of the present invention, the thickness of the wall surface to which the lead wires are not sealed is reduced, so the weight is reduced without impairing the lead wire sealing strength and airtightness of the airtight terminal. This has the advantage that it is possible to reduce costs.
第１図は従来の気密端子の斜視図、第２図は本
考案による気密端子の一実施例の斜視図である。
１……枠体、２……リード線挿通孔、３……リ
ード線、４……絶縁材、１ａ……リード線挿通孔
の設けられた壁面、１ｂ……リード線挿通孔の設
けられていない壁面、Ｂ……ベース、Ｃ……キヤ
ツプ、Ｔ……気密端子。
FIG. 1 is a perspective view of a conventional hermetic terminal, and FIG. 2 is a perspective view of an embodiment of the hermetic terminal according to the present invention. DESCRIPTION OF SYMBOLS 1... Frame body, 2... Lead wire insertion hole, 3... Lead wire, 4... Insulating material, 1a... Wall surface provided with lead wire insertion hole, 1b... Lead wire insertion hole provided. No wall surface, B...Base, C...Cap, T...Airtight terminal.
Claims (1)
孔を設け、このリード線挿通孔にリード線を挿通
して絶縁材で封着した気密端子において、リード
線挿通孔の設けられていない枠体壁面の厚さをリ
ード線挿通孔の設けられている枠体壁面の厚さよ
り薄くしたことを特徴とする気密端子。 A frame without a lead wire insertion hole in an airtight terminal in which a lead wire insertion hole is provided on the wall surface of the frame that becomes the airtight terminal body, and the lead wire is inserted into the lead wire insertion hole and sealed with an insulating material. An airtight terminal characterized in that the thickness of the wall surface is thinner than the thickness of the wall surface of the frame body in which the lead wire insertion hole is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19244382U JPS59134279U (en) | 1982-12-20 | 1982-12-20 | airtight terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19244382U JPS59134279U (en) | 1982-12-20 | 1982-12-20 | airtight terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59134279U JPS59134279U (en) | 1984-09-07 |
| JPS623898Y2 true JPS623898Y2 (en) | 1987-01-28 |
Family
ID=30414150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19244382U Granted JPS59134279U (en) | 1982-12-20 | 1982-12-20 | airtight terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59134279U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5312293A (en) * | 1976-07-21 | 1978-02-03 | Seiko Instr & Electronics Ltd | Crystal vibrator |
| JPS57152154A (en) * | 1981-03-16 | 1982-09-20 | Fuji Denka:Kk | Structure of terminal part of air-tight sealing vessel |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5644093Y2 (en) * | 1974-11-20 | 1981-10-15 |
-
1982
- 1982-12-20 JP JP19244382U patent/JPS59134279U/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5312293A (en) * | 1976-07-21 | 1978-02-03 | Seiko Instr & Electronics Ltd | Crystal vibrator |
| JPS57152154A (en) * | 1981-03-16 | 1982-09-20 | Fuji Denka:Kk | Structure of terminal part of air-tight sealing vessel |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59134279U (en) | 1984-09-07 |
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