JPS6210940Y2 - - Google Patents
Info
- Publication number
- JPS6210940Y2 JPS6210940Y2 JP1982019891U JP1989182U JPS6210940Y2 JP S6210940 Y2 JPS6210940 Y2 JP S6210940Y2 JP 1982019891 U JP1982019891 U JP 1982019891U JP 1989182 U JP1989182 U JP 1989182U JP S6210940 Y2 JPS6210940 Y2 JP S6210940Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- airtight
- crystal element
- base
- wire insertion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000013078 crystal Substances 0.000 claims description 17
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 15
- 238000003780 insertion Methods 0.000 claims description 10
- 230000037431 insertion Effects 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 5
- 239000011796 hollow space material Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
【考案の詳細な説明】
本考案は水晶素子を気密に封入する気密パツケ
ージの気密端子の改良、詳しくは、容易にかつ安
価に製造しえる。気密端子に関するものである。[Detailed Description of the Invention] The present invention improves the airtight terminal of an airtight package that hermetically encapsulates a crystal element, and more specifically, it can be easily and inexpensively manufactured. This relates to airtight terminals.
従来、水晶振動子、水晶発振子等の水晶素子を
気密に封入する気密パツケージは第１図に断面図
を示すように、接着用フランジ１を下端に有し、
リード線挿通孔２，２を設けた筒状部３を有する
ベース４の前記リード線挿通孔２，２にリード線
５，５を挿通すると共に前記筒状部３のアウター
側をガラス、合成樹脂、セラミツク等の絶縁材６
で封着した気密端子Ｔを有している。 Conventionally, an airtight package for airtightly enclosing a crystal element such as a crystal resonator or a crystal oscillator has an adhesive flange 1 at the lower end, as shown in a cross-sectional view in FIG.
Lead wires 5, 5 are inserted into the lead wire insertion holes 2, 2 of the base 4, which has a cylindrical portion 3 provided with lead wire insertion holes 2, 2, and the outer side of the cylindrical portion 3 is made of glass or synthetic resin. , ceramic and other insulating materials 6
It has an airtight terminal T sealed with.
さらに、前記リード線５，５のインナー側部分
に水晶素子７を接続すると共に、やはり下端に接
着用フランジ８を有する背高のキヤツプ９を前記
気密端子Ｔに、両者の接着用フランジ１及び８が
当接するように被せ、このフランジ１，８を接着
することにより水晶素子の封入された気密パツケ
ージとしていた。 Further, a crystal element 7 is connected to the inner side portions of the lead wires 5, 5, and a tall cap 9, which also has an adhesive flange 8 at the lower end, is connected to the airtight terminal T, and the adhesive flanges 1 and 8 are connected to the airtight terminal T. The flanges 1 and 8 were placed so that they were in contact with each other, and the flanges 1 and 8 were glued together to form an airtight package in which the crystal element was enclosed.
しかしながらこの種の気密パツケージＰは背高
であり、回路基板に接続する場合、このパツケー
ジＰのみが突出してしまうと言う欠点がある。 However, this type of airtight package P is tall and has the disadvantage that only the package P protrudes when connected to a circuit board.
このような欠点を除去するため、横方向にリー
ド線を伸長した水晶素子用気密パツケージP1も開
発されている。すなわち、第２図に示すようにプ
レート２０上に、リード線挿通孔２１を設けた複
数の側壁２２，２２……をそれぞれ銀ロウ付けな
どにより接着し、リード線挿通孔２１にリード線
２３，２３を挿通し、絶縁材２４で封着した後、
水晶素子２５に前記リード線２３のインナー側を
接着する。その後、上部を蓋（図示せず）により
覆い、接着し、気密パツケージP2とする。 In order to eliminate these drawbacks, an airtight package P1 for a crystal element in which lead wires are extended in the lateral direction has also been developed. That is, as shown in FIG. 2, a plurality of side walls 22, 22, . 23 and sealed with an insulating material 24,
The inner side of the lead wire 23 is bonded to the crystal element 25. Thereafter, the upper part is covered with a lid (not shown) and glued to form an airtight package P2 .
このような気密パツケージP2は水晶素子２５を
平面的に気密封入するので、前述の気密パツケー
ジP1のように回路基板において、かさばることが
なく、極めて有利である反面、側壁２２，２２…
…をそれぞれプレート２０に接着しなければなら
ないため手間がかかり、コスト高となると言う欠
点があつた。 Since such an airtight package P 2 airtightly encapsulates the crystal element 25 in a plane, it does not take up bulk on the circuit board unlike the airtight package P 1 described above, which is extremely advantageous.
. . must be adhered to the plate 20, which is time consuming and costly.
本考案はこのような欠点のない、水晶素子を気
密に封入する気密パツケージの気密端子を提供す
ることを目的とする。すなわち、水晶素子を平面
的に気密封入しえる安価な気密端子を提供するこ
とを目的とする。 The object of the present invention is to provide an airtight terminal for an airtight package that airtightly encapsulates a crystal element without such drawbacks. That is, an object of the present invention is to provide an inexpensive airtight terminal that can hermetically encapsulate a crystal element in a two-dimensional manner.
したがつて、本考案による水晶素子用気密端子
は、長尺の中空材を輪切りにして形成したベース
の周壁に設けられたリード線挿通孔にリード線を
挿通し、絶縁材で封着したことを特徴とするもの
である。 Therefore, the airtight terminal for a crystal element according to the present invention is made by inserting a lead wire into a lead wire insertion hole provided in the peripheral wall of a base made by cutting a long hollow material into rings, and sealing the lead wire with an insulating material. It is characterized by:
本考案の一実施例を図面に基づき説明する。 An embodiment of the present invention will be described based on the drawings.
本考案による気密端子の一実施例によれば、第
３図ａ，ｂに示すように、鉄ないしコバールの中
空材３０ａ，３０ｂを所望厚さに切断してベース
３１，３１を形成する。この中空材３０ａ，３０
ｂ断面形状は本実施例においては円形、正方形で
あるが、これに限定されるものではない。 According to an embodiment of the airtight terminal according to the present invention, as shown in FIGS. 3a and 3b, bases 31 and 31 are formed by cutting hollow iron or Kovar members 30a and 30b to a desired thickness. These hollow members 30a, 30
Although the cross-sectional shape b is circular or square in this embodiment, it is not limited to this.
このように切り出したベース３１の周壁３１０
にリード線挿通孔３２を穿設する（第４図）。も
ちろん、リード線挿通孔をあらかじめ穿設した中
空材を所定位置で切断し、リード線挿通孔の設け
られたベースを一工程で製造することもできる。
この実施例においてリード線挿通孔３２は２コで
あるが、これに限定されるものではない。たとえ
ば２以上設けることができる。 The peripheral wall 310 of the base 31 cut out in this way
A lead wire insertion hole 32 is bored in the (FIG. 4). Of course, it is also possible to manufacture the base provided with the lead wire insertion hole in one step by cutting a hollow member in which the lead wire insertion hole is previously formed at a predetermined position.
In this embodiment, there are two lead wire insertion holes 32, but the number is not limited to this. For example, two or more can be provided.
また第５図に示すように、ベース３１の切断面
３１１をコイニング加工等し、プロジエクシヨン
溶接用の突条３３，３３を設けることができる。
この突条３３，３３′はどちらか一方の切断面３
１１だけ設けてもよい。 Further, as shown in FIG. 5, the cut surface 311 of the base 31 may be subjected to coining processing or the like to provide protrusions 33, 33 for projection welding.
These protrusions 33, 33' are formed on one of the cut surfaces 3
Only 11 may be provided.
このようにプロジエクシヨン溶接用突条３３，
３３′を設けることによりプロジエクシヨン溶接
が容易になると言う利点がある。 In this way, the projection welding ridge 33,
Providing 33' has the advantage of facilitating projection welding.
前記のような加工を施したベース３１に設けら
れたリード線挿通孔３２，３２にリード線３４，
３４を挿通し、絶縁材３５，３５（たとえばガラ
ス）で前記リード線３４，３４を封着して気密端
子T1とする。 The lead wires 34 are inserted into the lead wire insertion holes 32, 32 provided in the base 31 processed as described above.
34 is inserted, and the lead wires 34, 34 are sealed with an insulating material 35, 35 (for example, glass) to form an airtight terminal T1 .
この気密端子T1のリード線３４，３４のイン
ナー側先端に水晶素子３６（第６図）を接続し、
切断面３１１，３１１に蓋（図示せず）を接着
し、気密パツケージとする。 A crystal element 36 (Fig. 6) is connected to the inner tips of the lead wires 34, 34 of this airtight terminal T1 ,
A lid (not shown) is adhered to the cut surfaces 311, 311 to form an airtight package.
本考案による気密端子によれば、水晶素子を平
面的に気密封入しえるばかりでなく、従来のよう
に、複数の側壁を銀ロウ付などにより複数回プレ
ートに接着する手間が省け、単に中空材を切断し
てベースを形成せしめるため、極めて容易に多数
の気密端子を製造しえる。したがつて、コストを
著しく安価にしえると言う利点がある。 According to the airtight terminal of the present invention, not only can a crystal element be hermetically sealed in a two-dimensional manner, but the conventional method of bonding multiple side walls to a plate multiple times using silver brazing, etc., can be avoided, and the terminal can simply be made of a hollow material. Since the base is formed by cutting the base, a large number of hermetic terminals can be manufactured very easily. Therefore, there is an advantage that the cost can be significantly reduced.
第１図は従来の気密パツケージの断面図、第２
図は従来の他の型式の気密パツケージの構造を示
す斜視図、第３図は本考案の一実施例の中空材及
びベースを示す斜視図、第４図は本考案の一実施
例の斜視図、第５図は他の実施例に用いるベース
の一部断面図、第６図は本考案による気密端子を
用いて水晶素子を封入する際の正面図である。
３０ａ，３０ｂ……中空材、３１……ベース、
３２……リード線挿通孔、３３……突条、３４…
…リード線、３５……絶縁材、３１０……周壁、
３１１……切断面。
Figure 1 is a sectional view of a conventional airtight package, Figure 2 is a sectional view of a conventional airtight package.
Figure 3 is a perspective view showing the structure of another type of conventional airtight package, Figure 3 is a perspective view showing the hollow member and base of an embodiment of the invention, and Figure 4 is a perspective view of an embodiment of the invention. , FIG. 5 is a partial sectional view of a base used in another embodiment, and FIG. 6 is a front view when a crystal element is encapsulated using the airtight terminal according to the present invention. 30a, 30b...Hollow material, 31...Base,
32...Lead wire insertion hole, 33...Protrusion, 34...
... Lead wire, 35 ... Insulating material, 310 ... Peripheral wall,
311...Cut surface.
Claims (1)
の周壁に設けられたリード線挿通孔にリード線
を挿通し、絶縁材により封着したことを特徴と
する水晶素子用気密端子。 ２ 前記ベースの切断面のいずれかまたは両面に
溶接用突条を設けたことを特徴とする実用新案
登録請求の範囲第１項による水晶素子用気密端
子。[Scope of Claim for Utility Model Registration] 1. A crystal characterized in that a lead wire is inserted into a lead wire insertion hole provided in the peripheral wall of a base formed by cutting a long hollow material into rings, and sealed with an insulating material. Airtight terminal for elements. 2. The hermetic terminal for a crystal element according to claim 1 of the utility model registration, characterized in that a welding protrusion is provided on one or both of the cut surfaces of the base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989182U JPS58123573U (en) | 1982-02-17 | 1982-02-17 | Airtight terminal for crystal element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989182U JPS58123573U (en) | 1982-02-17 | 1982-02-17 | Airtight terminal for crystal element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58123573U JPS58123573U (en) | 1983-08-23 |
| JPS6210940Y2 true JPS6210940Y2 (en) | 1987-03-14 |
Family
ID=30032079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989182U Granted JPS58123573U (en) | 1982-02-17 | 1982-02-17 | Airtight terminal for crystal element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58123573U (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56119270U (en) * | 1980-02-13 | 1981-09-11 |
-
1982
- 1982-02-17 JP JP1989182U patent/JPS58123573U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58123573U (en) | 1983-08-23 |
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