JPS59143348A - Electronic component part - Google Patents

Abstract

PURPOSE:To miniaturize mounting dimensions and facilitate the automation of mounting by a method wherein a pair of electrodes are mounted on sides opposed to each other alternately, while projecting end parts, respectively, and then resin-molded, thereafter these end parts are bent and made to run along the molded side surfaces, when said electrodes are mounted on a semiconductor chip provided with electrodes on both surfaces back and front. CONSTITUTION:When a pair of electrodes 9 and 10 composed of Cu, etc. mounted on both surfaces front and back of the diode chip 11 wherein a semi-spherical bump electrode is adhered on the surface, and an opposition electrode on the back surface, recesses 13 for preventing slip-out are provided at side edge parts of these electrodes 9 and 10, and the end parts of these electrodes 9 and 10 are alternately extended out of the chip 11. Thereafter, these are molded with resin 8, the external extending parts of the electrodes 9 and 10 are bent, thus being made to run along the side surface of the resin 8. Accordingly, the electronic component parts are miniaturized and then made appropriate for automatic assembly.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to electronic components, zJs type electronic components having two electrodes, such as 4I diodes, resistors, and capacitors. structure is known. The figure ←) shows a pair of Nura Greed 1.
This is a double heat sink diode (DHD) in which a chip (not shown) is sandwiched between the large-diameter end faces of the double heat sink diode (DHD), and the chip and the like are sealed with a glass tube 2. The figure (1, ,) shows a resin package type diode in which two leads 4 are made to protrude from one side of a resin package 3. This diode has a chip (not shown) fixed to the inner end of one lead. Further, the inner end of the other lead and the electrode of the chip are connected by a wire (not shown). The inner ends of both leads, the chip, and the wires are sealed with a resin package 3. Furthermore, in the same figure (C), a tip (not shown)' is sandwiched between the small diameter end faces of one stepped electrode 5, and the portion covering the small diameter part, the tip, and the small diameter part is sealed with a glass tube 6. It has a structure.

However, these diodes have the following drawbacks.

(1) When mounting DHDs and resin packaged diodes, the leads must be inserted into the mounting holes of the wiring board, but it is difficult to automatically insert the leads. The height of the assembled diode is 2 to 3 when mounted.
mg and high.

(2), step 1 shown in FIG. 1(c)! The electrode structure is a so-called surface mount structure in which the large diameter part of the stepped electrode is mounted on the wiring board by soldering it in that state, making it easy to automate the mounting, and the mounting height can be reduced to, for example, 1. .5w
It has the advantage that it can be made as small as 3.
．． It is long with five temples, and is large as a whole.

Therefore, an object of the present invention is to provide a small electronic component whose mounting can be easily automated and whose mounting dimensions are small.

FIG. 2 is a cross-sectional view of a diode according to an embodiment of the present invention;
3(a) to 3(C) are schematic diagrams and cross-sectional views showing the method of assembling the diode, and FIG. 4 is a cross-sectional view showing the mounting state.

As shown in FIG. 2, the diode 7 of the embodiment includes a rectangular parallelepiped resin package 8, an inner end bent at the lower end of the paris cage 8, and a protruding portion extending along one end surface of the entire outer end of the package 8. An electrode plate 9 is bent upward at the upper end of the package 8, and an electrode plate 10 is bent downward at the protruding part so that the inner end is aligned with the upper part of the other end of the package 8, and the entire outer end is along the other end surface of the package 8. , and a chip 11 which is clamped and fixed between the electrode plate portions of the pair of electrode plates 9 and 10 which are opposed to each other so as to be aligned with each other. Since the chip 11 serves as a diode element, it has 111tj12' on the front and back surfaces (upper and lower surfaces) of the chip 11. And chip 1
1 are electrically and mechanically connected via both electrodes 12 to mutually opposite ends of the electrode plates 9, 10, respectively. Also,
Both electrode plates 9 and 10 are provided with hook portions, which will be described later, to prevent them from coming off the resin package 8.

Next, a method of assembling the diode of the embodiment while opening the valves in FIGS. 3(a) to 3(Q) will be explained.

First, a pair of electrode plates 9 and 10 and a chip (diode chip) of 11" ft are prepared. The chip 11 has length and width dimensions of, for example, 04 μm, thickness (height) of 0.02 μm, and a surface (upper surface) of the chip 11. A pole (electrode) 12 is provided in the center, which is a hemispherical bump made of silver with a height of about 50 μm.In addition, on the back surface (lower surface) of the chip 11, there is provided an electrode 12 made of a hemispherical bump made of silver with a thickness of several thousand amps. A pair of electrode plates 9 and 10 has a width that is the same as the width (horizontal) of the chip 110 (which may be larger or smaller), and a length that is equal to the vertical length of the chip 11. The parting is also longer.Also, the electrode plate 9
, 10 are made of a material commonly used for lead electrodes, such as copper or Kovar, and their thickness is made to be as thin as possible so that they do not break during handling or cause any inconvenience as electrodes. In addition, a pair of electrode plates 9.1
0 face the mutually oppositely pointed ends 11. ! !
, fc, this chip facing part is covered with a resin cage as described later, but at that time, 11
A cover section 13 is provided. The hook part 13 is connected to the electrode plates 9, 1
Although it is formed by partially recessing both sides of the electrode plate 9, 10, other structures may be formed by protrusions provided on both sides of the electrode plate 9, 10, or holes bored in the electrode plate 9, 10.

Therefore, as shown in FIG. 3(a), a pair of electrode plates 9.
The chip 11 is sandwiched between the mutually opposing ends of the electrode plate 9, and the chip 11 and the electrode plate 9 are connected by applying heat and pressure to connect the w-contact part.
．． 10 are electrically and mechanically connected.

Next, as shown in FIG. Cb), the chip 11 and the electrode plate portion supporting the chip 11 are resin molded and covered with a resin package 8.

Next, as shown in the same figure (C), the resin pari cage 8
The electrode plate portion protruding from the electrode plate is bent at the protruding portion so as to fit along the end surface of the resin package 8. That is, the lower electrode plate 9 is bent upward, and the upper electrode plate 10 is bent downward. Note that the electrode plates 9 and 10 are bent in advance so that the bent ends protrude from the upper and lower surfaces of the package 8.
Set the length.

When mounting such a diode 7, it is placed on a wiring board 14 as shown in FIG. 4, and connected in this state through solder 15. Electrode plates 9 and 10 exposed at both ends of back cage 80 are electrically and mechanically connected to wiring layer 16 of wiring board 14 via solder 15.

The vertical and horizontal dimensions of the package 8 for the diode 7 need only be slightly larger than the vertical and horizontal dimensions of the chip 11, and the height also depends on the depth of the chip 110, the thickness of the two electrode plates, and the resin covering. All you need is the thickness. Furthermore, the thin electrode plates 9 and 10 are structured to extend over the end face of the package 8. As a result, the overall dimensions of the diode of the example are smaller than those of conventional products, for example, the length and width are 1.5
m.

The height is extremely small, just one garden. Therefore, the mounting dimensions, especially the height dimensions, of the diode of this embodiment can be reduced.

Furthermore, since the present array diode has a surface mounting structure, it is easy to automate the supply during mounting, and the automation of mounting is also facilitated.

Note that the present invention is not limited to the above embodiments. for example,
As shown in FIG. 5, in the electrode plate 9 of the T portion, the back surface of the surface on which the chip 11 is mounted (chip mounting surface) may not be covered with the resin package 8. In this case, the height of the diode 7 is further reduced, and since one electrode is located on the lower surface of the resin package 8, the degree of freedom in designing the wiring board 14 is increased.

FIG. 6 is an improved version of the embodiment shown in FIG. 5, in which the electrode plate 9 located on the lower surface of the resin package 8 does not protrude from the end surface of the resin package 8. With this structure, in addition to the effects produced in the embodiment of FIG.
Since the vertical dimension of the diode 7 is reduced by the thickness of the electrode plate, further miniaturization can be achieved.

The present invention relates to resistors and capacitors other than diodes.

Alternatively, it can be applied to other semiconductor devices.

As described above, according to the present invention, it is possible to provide a compact electronic component assembly whose mounting can be easily automated and whose mounting dimensions are small.

[Brief explanation of the drawing]

Figures 1 (a) to (c) are front views showing a conventional diode, Figure 2 is a sectional view of a diode according to an embodiment of the present invention, and Figures 3 (,) to (c) are the same diode assembly. A side view and a sectional view showing the method, FIG. 4 is a sectional view showing the mounting state, FIG. 5 is a sectional view of a diode according to another embodiment, and FIG. 6 is a sectional view of a diode according to another embodiment. be. 7...Diode, 8...Package, 9,1o・
...electrode plate, 11...chip, 12...electrode, 14.
...Wiring board, 15...Solder, 16...Wiring layer. (9). Figure 4-240- Figure 6

Claims (1)

[Scope of Claims] 1. A pair of fc electrode plates disposed such that their opposite ends overlap each other, and a pair of fc electrode plates sandwiched between these electrode plates and electrically and mechanically connected via the electrodes. A package consisting of a chip that has electrodes on the front and back sides, a resin package that covers the chip and the electrode plate part that supports the chip, and a shell that protrudes from the package and the part of the electrode plate that does not support the chip is folded at the protruding part. An electronic component characterized in that it is curved and extends along the end face of the bug cage. 2. The electronic component according to claim 1, wherein the back surface of the chip mounting surface of the one electrode plate is exposed from the package.