JPH033753U - - Google Patents

Info

Publication number
JPH033753U
JPH033753U JP6438489U JP6438489U JPH033753U JP H033753 U JPH033753 U JP H033753U JP 6438489 U JP6438489 U JP 6438489U JP 6438489 U JP6438489 U JP 6438489U JP H033753 U JPH033753 U JP H033753U
Authority
JP
Japan
Prior art keywords
external lead
glass
sealed
lead terminal
insulating base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6438489U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6438489U priority Critical patent/JPH033753U/ja
Publication of JPH033753U publication Critical patent/JPH033753U/ja
Pending legal-status Critical Current

Links

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  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案のガラス封止型半導体素子収納
用パツケージの一実施例を示す分解斜視図、第2
図aは第1図に示したパツケージにおける封止後
の状態を示す断面図、第2図bはその要部拡大断
面図、第3図は従来のガラス封止型半導体素子収
納用パツケージの一例を示す分解斜視図、第4図
は第3図に示したパツケージの封止後の状態を示
す断面図である。 1……絶縁基体、2……蓋体、3……絶縁容器
、4……外部リード端子、5……貫通孔、60a
,60b……ガラス層。
FIG. 1 is an exploded perspective view showing an embodiment of the glass-sealed semiconductor device storage package of the present invention;
Figure a is a cross-sectional view showing the package shown in Figure 1 after sealing, Figure 2 b is an enlarged cross-sectional view of the main part, and Figure 3 is an example of a conventional glass-sealed package for housing semiconductor elements. FIG. 4 is a sectional view showing the package shown in FIG. 3 in a sealed state. 1...Insulating base, 2...Lid, 3...Insulating container, 4...External lead terminal, 5...Through hole, 60a
, 60b...Glass layer.

Claims (1)

【実用新案登録請求の範囲】 相対接する主面にガラス層を被着形成した絶縁
基体と蓋体とで外部リード端子を挟持し、前記ガ
ラス層を溶融一体化することにより半導体素子を
内部に気密封止するガラス封止型半導体素子収納
用パツケージにおいて、前記外部リード端子の絶
縁基体外周辺が位置する部位に、該外部リード端
子の全幅をAとしたとき、 0.4A≦B≦0.8A 但し、Bは前記外部リード端子の幅方向におけ
る最大内径寸法 を満足する貫通孔を形成したことを特徴とする
ガラス封止型半導体素子収納用パツケージ。
[Claims for Utility Model Registration] External lead terminals are sandwiched between an insulating base and a lid, the main surfaces of which are in contact with each other and a glass layer is adhered thereto, and the glass layers are melted and integrated to form a semiconductor element inside. In a glass-sealed semiconductor device storage package to be sealed, the outer periphery of the insulating base of the external lead terminal is located at a portion where the total width of the external lead terminal is A, 0.4A≦B≦0.8A. However, B is a glass-sealed package for housing a semiconductor element, characterized in that a through hole is formed that satisfies the maximum inner diameter dimension in the width direction of the external lead terminal.
JP6438489U 1989-05-31 1989-05-31 Pending JPH033753U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6438489U JPH033753U (en) 1989-05-31 1989-05-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6438489U JPH033753U (en) 1989-05-31 1989-05-31

Publications (1)

Publication Number Publication Date
JPH033753U true JPH033753U (en) 1991-01-16

Family

ID=31595283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6438489U Pending JPH033753U (en) 1989-05-31 1989-05-31

Country Status (1)

Country Link
JP (1) JPH033753U (en)

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