JPH0426544U - - Google Patents
Info
- Publication number
- JPH0426544U JPH0426544U JP6754390U JP6754390U JPH0426544U JP H0426544 U JPH0426544 U JP H0426544U JP 6754390 U JP6754390 U JP 6754390U JP 6754390 U JP6754390 U JP 6754390U JP H0426544 U JPH0426544 U JP H0426544U
- Authority
- JP
- Japan
- Prior art keywords
- glass
- oxide
- semiconductor element
- glass layer
- accommodating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 5
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 2
- 239000003086 colorant Substances 0.000 claims 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 claims 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims 1
- 239000005751 Copper oxide Substances 0.000 claims 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims 1
- 229910000423 chromium oxide Inorganic materials 0.000 claims 1
- 229910000428 cobalt oxide Inorganic materials 0.000 claims 1
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- 229910000431 copper oxide Inorganic materials 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 229910000480 nickel oxide Inorganic materials 0.000 claims 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 239000011787 zinc oxide Substances 0.000 claims 1
Landscapes
- Glass Compositions (AREA)
Description
第１図は本考案のガラス封止型半導体素子収納
用パツケージの一実施例を示す側面図、第２図は
第１図に示すパツケージの絶縁基体の平面図、第
３図は第１図の要部拡大断面図である。
１……絶縁基体、２……蓋体、５，６……ガラ
ス層。
FIG. 1 is a side view showing an embodiment of the glass-sealed semiconductor device housing package of the present invention, FIG. 2 is a plan view of the insulating base of the package shown in FIG. 1, and FIG. 3 is the same as that shown in FIG. FIG. 3 is an enlarged cross-sectional view of main parts. 1... Insulating base, 2... Lid, 5, 6... Glass layer.
Claims (1)
且つ相対向する主面にガラス層を被着させた絶縁
基体と蓋体とで外部リード端子を挟持し、前記ガ
ラス層を溶融一体化することによつて半導体素子
を内部に気密封止するガラス封止型半導体素子収
納用パツケージにおいて、前記ガラス層がガラス
粉末に着色剤を含有させた着色ガラスから成るこ
とを特徴とするガラス封止型半導体素子収納用パ
ツケージ。 (2) 前記着色ガラスから成るガラス層は着色剤
が酸化銅、酸化鉄、酸化ニツケル、酸化マンガン
、酸化クロム、酸化コバルト及び酸化亜鉛のうち
の少なくとも２種以上の複合酸化物から成ること
を特徴とする実用新案登録請求の範囲第１項記載
のガラス封止型半導体素子収納用パツケージ。[Claims for Utility Model Registration] (1) Having a recess for accommodating a semiconductor element,
and a glass in which an external lead terminal is sandwiched between an insulating base and a lid whose main surfaces facing each other are coated with a glass layer, and a semiconductor element is hermetically sealed inside by melting and integrating the glass layer. 1. A glass-sealed package for accommodating a semiconductor element, wherein the glass layer is made of colored glass in which glass powder contains a coloring agent. (2) The glass layer made of colored glass is characterized in that the coloring agent is made of a composite oxide of at least two of copper oxide, iron oxide, nickel oxide, manganese oxide, chromium oxide, cobalt oxide, and zinc oxide. A glass-sealed semiconductor device storage package according to claim 1 of the utility model registration claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6754390U JPH0426544U (en) | 1990-06-26 | 1990-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6754390U JPH0426544U (en) | 1990-06-26 | 1990-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0426544U true JPH0426544U (en) | 1992-03-03 |
Family
ID=31601204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6754390U Pending JPH0426544U (en) | 1990-06-26 | 1990-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0426544U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06120361A (en) * | 1992-10-06 | 1994-04-28 | Kyocera Corp | Semiconductor device holding package |
-
1990
- 1990-06-26 JP JP6754390U patent/JPH0426544U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06120361A (en) * | 1992-10-06 | 1994-04-28 | Kyocera Corp | Semiconductor device holding package |
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