JPS5852715Y2 - Sealing structure of electronic components - Google Patents
Sealing structure of electronic componentsInfo
- Publication number
- JPS5852715Y2 JPS5852715Y2 JP1976108039U JP10803976U JPS5852715Y2 JP S5852715 Y2 JPS5852715 Y2 JP S5852715Y2 JP 1976108039 U JP1976108039 U JP 1976108039U JP 10803976 U JP10803976 U JP 10803976U JP S5852715 Y2 JPS5852715 Y2 JP S5852715Y2
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- case
- resin
- opening
- sealing structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
【考案の詳細な説明】
この考案は電子部品を収納しているケース内に封止用の
樹脂が入り込まない構造に関する。[Detailed Description of the Invention] This invention relates to a structure that prevents sealing resin from entering a case housing electronic components.
電子部品、たとえば複数個のセラミック共振子からなる
セラミックフィルターは第１図に示すように、内ケース
１内にセラミック共振子２を収納し、さらに内ケース１
を外ケース３に収納し、外ケース３の開口部に樹脂４を
充填して封止していた。As shown in FIG. 1, an electronic component, for example a ceramic filter consisting of a plurality of ceramic resonators, houses a ceramic resonator 2 in an inner case 1, and further includes a ceramic resonator 2 in an inner case 1.
was housed in an outer case 3, and the opening of the outer case 3 was filled with resin 4 and sealed.
しかしながら、端子５を導出している内ケース１の端子
穴６から樹脂４が流れ込み、セラミック共振子２に付着
して特性劣化を来たすという問題があった。However, there is a problem in that the resin 4 flows into the terminal hole 6 of the inner case 1 from which the terminal 5 is led out and adheres to the ceramic resonator 2, causing characteristic deterioration.
この考案は上記した問題を解消したもので、ケース内に
樹脂が入り込まない電子部品の封止構造を提供すること
を目的とする。This invention solves the above-mentioned problems and aims to provide a sealing structure for electronic components that does not allow resin to enter the case.
以下この考案を図示した一実施例に従って詳述する。This invention will be described in detail below according to an illustrated embodiment.
第２図、第３図において、１１は一端に開口部１２を有
するケース、１３はケース１１内に収納されたセラミッ
ク共振子、１４は端子、１５はケース１１の開口部１２
を覆った柔らかいシートで、より具体的に構成を述べる
と１．ポリエステルなどの合成樹脂シートに紙が張り合
わせであるラミネートシートであり、このラミネートシ
ートの低側をケース１１の開口部１２側に向けるととも
に合成樹脂シート側をケース１１内部側に向けることと
する。In FIGS. 2 and 3, 11 is a case having an opening 12 at one end, 13 is a ceramic resonator housed in the case 11, 14 is a terminal, and 15 is an opening 12 of the case 11.
To be more specific, the structure is 1. This is a laminate sheet in which paper is pasted onto a synthetic resin sheet such as polyester, and the lower side of the laminate sheet faces toward the opening 12 of the case 11, and the synthetic resin sheet side faces toward the inside of the case 11.
このシート１５には端子１４を導出している略コ字状の
切り込み口１６が設けられている。This sheet 15 is provided with a substantially U-shaped notch 16 through which the terminal 14 is led out.
１７はシート１２を被覆した樹脂である。17 is a resin that coats the sheet 12.
上記した実施例によれば、端子１４はシート１５の切り
込み口１６から導出されており、端子１４と切り込み口
１６の間にほとんど隙間ができないから、樹脂１７でケ
ース１１の開口部１２を封止してもケース１１内に樹脂
１７が入り込むことはない。According to the embodiment described above, the terminal 14 is led out from the notch 16 of the sheet 15, and there is almost no gap between the terminal 14 and the notch 16, so the opening 12 of the case 11 is sealed with the resin 17. However, the resin 17 will not enter the case 11.
またシート１５は柔軟性があるため、樹脂１７の重みで
切り込み口１６は閉じられケース１１を密封することが
できる。Further, since the sheet 15 is flexible, the cut opening 16 is closed by the weight of the resin 17, and the case 11 can be sealed.
そして上述したような構成のシート１５を用いたので、
樹脂１７が紙にしみ込んで充分な密着性が得られる一方
、紙の裏には樹脂１７をとおさない合成樹脂シートが存
在するので、ケース１１内部には樹脂１７がはいりこま
ない。Since the sheet 15 having the above-mentioned configuration was used,
While the resin 17 soaks into the paper and provides sufficient adhesion, there is a synthetic resin sheet behind the paper that does not allow the resin 17 to pass through, so the resin 17 does not get inside the case 11.
第１図は従来例の縦断面図、第２図はこの考案の一実施
例を示す縦断面図、第３図は同じくシートを示す平面図
である。
１１・・・・・・ケース、１２・・・・・・開口部、１
３・・・・・・セラミック共振子、１４・・・・・・端
子、１５・・・・・・シート、１６・・・・・・切り込
み口、１７・・・・・・樹脂。FIG. 1 is a longitudinal sectional view of a conventional example, FIG. 2 is a longitudinal sectional view of an embodiment of the invention, and FIG. 3 is a plan view of the same sheet. 11... Case, 12... Opening, 1
3... Ceramic resonator, 14... Terminal, 15... Sheet, 16... Notch, 17... Resin.
Claims (1)
いるシートの切り込み口から電子部品の端子が導出され
、さらにシートが樹脂で被覆されてケースの開口部が封
止されている電子部品の封止構造において、シートとし
て、合成樹脂シートに紙のような被覆樹脂との密着性の
よい材料からなるシートを張り合わせている柔軟性のあ
るラミネートシートを用い、このラミネートシートの、
紙のような被覆樹脂との密着性のよい材料からなるシー
ト側をケースの開口側に向けるとともに合成樹脂シート
側をケース内部側に向け、また、ラミネートシートの切
り込み口は略コ字状であることを特徴とする、電子部品
の封止構造。An electronic component is housed in a case, the terminals of the electronic component are led out from a cut in a sheet covering the opening of the case, and the sheet is further covered with resin to seal the opening of the case. In the sealing structure, a flexible laminate sheet is used as the sheet, which is a synthetic resin sheet laminated with a sheet made of a material such as paper that has good adhesion to the coating resin.
The side of the sheet made of a material that has good adhesion to the coating resin, such as paper, faces toward the opening of the case, and the synthetic resin sheet side faces toward the inside of the case, and the cut in the laminate sheet is approximately U-shaped. A sealing structure for electronic components characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976108039U JPS5852715Y2 (en) | 1976-08-11 | 1976-08-11 | Sealing structure of electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976108039U JPS5852715Y2 (en) | 1976-08-11 | 1976-08-11 | Sealing structure of electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5324837U JPS5324837U (en) | 1978-03-02 |
| JPS5852715Y2 true JPS5852715Y2 (en) | 1983-12-01 |
Family
ID=28718045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976108039U Expired JPS5852715Y2 (en) | 1976-08-11 | 1976-08-11 | Sealing structure of electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5852715Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS472799U (en) * | 1971-01-27 | 1972-08-31 |
-
1976
- 1976-08-11 JP JP1976108039U patent/JPS5852715Y2/en not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS472799U (en) * | 1971-01-27 | 1972-08-31 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5324837U (en) | 1978-03-02 |
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