JPH06120361A - Semiconductor device holding package - Google Patents

Abstract

PURPOSE:To connect each electrode of a semiconductor device electrically to a specified external lead terminal precisely and surely. CONSTITUTION:This semiconductor device holding package is one made by gluing an insulating substrate 1 having a mounting part 1a for a semiconductor device 3 to be mounted on, with an insulating frame 2 for surrounding the mounting part 1a and forming a void space for holding the semiconductor device 3 inside, through an adhesive agent 5 made from resin putting its external lead terminals 4 between them. And, the adhesive agent 5 made from resin has been colored by an coloring agent.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a semiconductor element housing package for housing a semiconductor element.

[0002]

2. Description of the Related Art Conventionally, a semiconductor element accommodating package for accommodating a semiconductor element is made of an electrically insulating material such as alumina ceramics, and has an insulating base member having a mounting portion for mounting a semiconductor element in a substantially central portion of its upper surface. An insulating frame body made of an electrically insulating material and having an opening in a central portion so as to surround the semiconductor element mounting portion of the insulating base, and a plurality of electrically connecting the semiconductor element housed inside to an external electric circuit. The external lead terminals and the insulating frame are sequentially placed on the upper surface of the insulating substrate, and they are bonded and fixed with a resin adhesive such as an epoxy resin.

In such a conventional semiconductor element housing package, a semiconductor element is fixed to a semiconductor element mounting portion of an insulating substrate located in an opening of an insulating frame, and each electrode of the semiconductor element is connected to an external lead terminal via a bonding wire. After that, the opening of the insulating frame is filled with a filling material such as epoxy resin, and the semiconductor element is hermetically sealed to obtain a semiconductor device as a final product.

Further, in the conventional semiconductor element housing package, the surface of the external lead terminal is usually covered with a metal layer made of silver or aluminum in order to strengthen the connection between the external lead terminal and the bonding wire.

Further, in the conventional package for accommodating a semiconductor element, an automatic bonder generally equipped with an image recognition device is used in consideration of productivity when connecting each electrode of the semiconductor element to an external lead terminal through a bonding wire. The position of the external lead terminal is recognized by the image recognition device, and based on this, the electrode of the semiconductor element and the external lead terminal are automatically connected via a bonding wire.

[0006]

However, according to this conventional package for accommodating semiconductor elements, the external lead terminals are silver white because the surfaces thereof are covered with silver and aluminum, while the external lead terminals are The resin adhesive made of an epoxy resin bonded to the insulating base and the insulating frame has a light amber color, and the contrast between the two is small. Therefore, when connecting the bonding wire to the electrode of the semiconductor element and the external lead terminal using the automatic bonder, the image recognition device of the automatic bonder cannot accurately recognize the position of the external lead terminal. There has been a drawback that it is impossible to accurately and surely electrically connect each electrode of the semiconductor element and the lead terminal with the bonder.

[0007]

The present invention has been made in view of the above-mentioned drawbacks, and an object thereof is a package for accommodating a semiconductor element capable of accurately and surely electrically connecting each electrode of the semiconductor element to a predetermined external lead terminal. To provide.

[0008]

According to the present invention, there is provided an insulating base body having a mounting portion on which a semiconductor element is mounted, and an insulating frame body surrounding the mounting portion and forming a void for accommodating the semiconductor element therein. Is a package for storing a semiconductor element in which an external lead terminal is sandwiched between them and is bonded via a resin adhesive, wherein the resin adhesive is colored with a coloring agent. .

[0009]

[Function] The resin adhesive that joins the external lead terminals to the insulating substrate and the insulating frame is colored so that the contrast between the external lead terminals and the resin adhesive is high. The position of the terminal can be accurately recognized, and thus the external lead terminal and each electrode of the semiconductor element can be accurately and reliably electrically connected.

[0010]

The present invention will now be described in detail with reference to the accompanying drawings. FIG. 1 shows an embodiment of a package for housing a semiconductor device of the present invention, in which 1 is an aluminum nitride sintered body, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, and a glass ceramic. An insulating substrate 2 made of an electrically insulating material such as a sintered body is an insulating frame made of an electrically insulating material.

The insulating substrate 1 has a mounting portion 1a for mounting the semiconductor element 3 on the substantially central portion of its upper surface, and the semiconductor element 3 is mounted on the mounting portion 1a via an adhesive made of resin or the like. Adhesively fixed.

When the insulating base 1 is made of, for example, aluminum nitride ceramics, raw material powder such as aluminum nitride powder and yttria powder is filled in a press die having a shape corresponding to the insulating base 1 and a constant pressure is applied. It is manufactured by firing the molded body at a temperature of about 1800 ° C.

An insulating frame body 2 is adhered to the upper surface of the insulating substrate 1 with an external lead terminal 4 interposed therebetween with a resin adhesive 5.

The insulating frame 2 has an opening A formed in the center thereof, and has a frame shape surrounding the mounting portion 1a of the insulating base 1 to which the semiconductor element is fixed. The insulating frame 2 forms a space for accommodating the semiconductor element 3 therein by the opening A at the center thereof and the upper surface of the insulating substrate 1.

The insulating frame 2 is made of an electrically insulating material such as an aluminum nitride sintered body, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, and a glass ceramic sintered body. A method similar to that of the insulating substrate 1, specifically, aluminum nitride powder, yttria powder and other raw material powders are filled into a press die having a shape corresponding to the insulating frame body 2 and a constant pressure is applied to perform molding. After that, the molded body is manufactured by firing at a temperature of about 1800 ° C.

An external lead terminal 4 is sandwiched between the insulating base body 1 and the insulating frame body 2, and each electrode of the semiconductor element 3 is connected to one end of the external lead terminal 4 via a bonding wire 6. It is electrically connected, and the other end side is electrically connected to an external electric circuit.

The external lead terminal 4 is made of an iron alloy such as Kovar metal (iron-nickel-cobalt alloy) or 42 alloy (iron-nickel alloy), or a copper alloy such as copper, nickel, silicon or zinc. Ingot of (
The lump is formed into a predetermined plate shape by adopting a conventionally known metal processing method such as a rolling processing method or a punching processing method.

The external lead terminals 4 are coated with silver, aluminum or the like on their surfaces by plating, vapor deposition or the clad method.
It is deposited to a thickness of 0.5 to 20.0 μm so that the bonding wire 5 is firmly bonded to the external lead terminal 4.

Further, the external lead terminals 4 are fixedly adhered to the insulating substrate 1 and the insulating frame body 2 through a resin adhesive 5. The resin adhesive 5 is a bisphenol A type epoxy resin or a novolac type epoxy resin. , Epoxy resins such as chrysidyl ester type epoxy resin, chrysidyl amine type epoxy resin, chain aliphatic epoxy resin, alicyclic epoxy resin and heterocyclic epoxy resin, and resins such as polyimide, phenol resin, silicone and urethane. Has been formed.

The resin adhesive 5 is colored by containing 0.5 to 3.0 parts by weight of a coloring agent such as carbon black in 100 parts by weight of the resin therein.

Since the resin adhesive 5 is colored with a coloring agent, the contrast between the resin adhesive 5 and the external lead terminals 4 is increased, and as a result, the electrodes of the semiconductor element 3 are separated from each other by using an automatic bonder. When the bonding wire 6 is connected to the external lead terminal 4, the position recognition of the external lead terminal 4 in the image recognition device of the automatic bonder becomes accurate, and the bonding wire 5 is accurately attached to each electrode of the semiconductor element 3 and the external lead terminal 4. And, it is possible to surely bond them.

The colorant composed of carbon black contained in the resin adhesive 5 serves to enhance the contrast between the resin adhesive 5 and the external lead terminals 4, and the content thereof is 100% by weight of the resin. If it is less than 0.5 parts by weight, the contrast with the external lead terminal 4 is not sufficiently large, and if it exceeds 3.0 parts by weight, the resin adhesive
The electric insulation property of 5 tends to decrease. Therefore, the colorant contained in the resin adhesive 5 is preferably in the range of 0.5 to 3.0 parts by weight with respect to 100 parts by weight of the resin.

The resin adhesive 5 is made of an insulating powder such as silicon oxide, aluminum oxide, aluminum nitride, calcium carbonate, magnesium oxide having a particle size of 0.1 to 50.0 μm as a filler for 100 parts by volume of the resin. 50-
If 400 volume parts are dispersed, the moisture permeability of the resin adhesive 5 can be greatly improved. Therefore, the resin adhesive 5 has a particle size of 0.1 to 50.0 μm as a filler.
It is preferable that 50 to 400 parts by weight of the insulating powder of silicon oxide, aluminum oxide, aluminum nitride, calcium carbonate, magnesium oxide or the like is dispersed in 100 parts by weight of the resin.

Further, in order to bond the insulating base 1, the insulating frame 2 and the external lead terminal 4 via the resin adhesive 5, first, for example, bisphenol A type epoxy is provided on the outer peripheral portion of the upper surface of the insulating base 1. A resin paste obtained by adding and mixing carbon black as a coloring agent, silicon oxide powder as a filler, and imidazole as a curing agent to a resin is applied by printing using a screen printing method, and then applied to the upper surface of the insulating substrate 1. The external lead terminal 4 is placed on the upper surface of the insulating substrate 1 by placing the external lead terminal 4 on it and heating it to a temperature of about 150 ° C. to heat cure the resin paste.
Then, a resin paste obtained by similarly mixing and mixing, for example, bisphenol A type epoxy resin with carbon black as a colorant, silicon oxide powder as a filler, and imidazole as a curing agent on the lower surface of the insulating frame 2. It is applied by printing and is placed on the upper surface of the insulating substrate 1 to which the external lead terminals 4 are fixed.
It is carried out by thermally curing the resin paste applied to the lower surface of 2 at a temperature of about 150 ° C.

Thus, according to the package for accommodating a semiconductor element of the present invention, the semiconductor element 3 is fixed to the semiconductor element mounting portion 1a of the insulating substrate 1 with an adhesive and each electrode of the semiconductor element 3 is bonded with the bonding wire 6 The semiconductor device 3 is a final product by connecting to the external lead terminal 4 via the resin, and finally filling the resin filler 7 into the opening A of the insulating frame 2 and hermetically sealing the semiconductor element 3.

As the resin filler 7 for hermetically sealing the semiconductor element 3, a resin such as epoxy resin, polyimide, phenol resin, or silicone is used.
The semiconductor element 3 is placed in the opening A of the insulating frame 2 so as to be hermetically sealed by filling a resin paste such as an epoxy resin in the opening A of the above and thermally curing it at a temperature of about 150 ° C. It

The resin filler 7 contains silicon oxide, aluminum oxide, having a particle size of 0.1 to 50.0 μm,
When 50 to 400 parts by weight of a filler made of an insulating powder such as aluminum nitride, calcium carbonate, magnesium oxide or the like is dispersed in 100 parts by weight of the resin, a resin filler is obtained.
The moisture permeability of 7 can be improved, and the semiconductor element housed inside can be more firmly protected from the external environment. Therefore, the resin filler 7 contains silicon oxide having a particle size of 0.1 to 50.0 μm,
It is preferable to disperse 50 to 400 parts by weight of filler made of insulating powder such as aluminum oxide, aluminum nitride, calcium carbonate, magnesium oxide, or other silicon oxide.

If necessary, the resin filler 7 may be colored by adding a colorant such as carbon black to the resin filler 7.

Furthermore, the present invention is not limited to the above-mentioned embodiments, and various modifications can be made without departing from the gist of the present invention.

[0030]

According to the package for housing a semiconductor element of the present invention, the resin adhesive for fixing the external lead terminals to the insulating substrate and the insulating frame is colored, so that the external lead terminals and the resin adhesive are The contrast becomes high, and when connecting each electrode of the semiconductor element and the external lead terminal by the bonding wire with the automatic bonder equipped with the image recognition device, the position of the external lead terminal can be accurately set on the image recognition device of the automatic bonder. As a result, the external lead terminals can be accurately and surely connected via the bonding wires.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an embodiment of a semiconductor element housing package of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Insulating substrate 1a ... Semiconductor element mounting part 2 ... Insulating frame 3 ... Semiconductor element 4 ... External lead terminal 5 ... Resin adhesive 6 ... Bonding wire

Claims (1)

[Claims] 1. An insulating base body having a mounting portion on which a semiconductor element is mounted, an insulating frame body surrounding the mounting portion and forming a space for accommodating the semiconductor element therein, and an external lead terminal provided therebetween. A package for storing a semiconductor element, which is sandwiched and adhered via a resin adhesive, wherein the resin adhesive is colored with a coloring agent.