JPH07153864A - Package for housing electronic part - Google Patents

Package for housing electronic part

Info

Publication number
JPH07153864A
JPH07153864A JP29937293A JP29937293A JPH07153864A JP H07153864 A JPH07153864 A JP H07153864A JP 29937293 A JP29937293 A JP 29937293A JP 29937293 A JP29937293 A JP 29937293A JP H07153864 A JPH07153864 A JP H07153864A
Authority
JP
Japan
Prior art keywords
resin
lid
parts
sealing material
solid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP29937293A
Other languages
Japanese (ja)
Other versions
JP2746826B2 (en
Inventor
Koichiro Nomoto
浩一郎 野元
Yoji Kobayashi
洋二 小林
Fujito Nakakawaji
藤人 中川路
Kiyoshige Miyawaki
清茂 宮脇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP29937293A priority Critical patent/JP2746826B2/en
Publication of JPH07153864A publication Critical patent/JPH07153864A/en
Application granted granted Critical
Publication of JP2746826B2 publication Critical patent/JP2746826B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PURPOSE:To make it possible to operate electronic parts housed inside stably and normally over a long period of time by effectively preventing the ingress of moisture to the inside. CONSTITUTION:This is a package for storing electronic parts by housing electronic parts in airtight state inside by joining an insulation substrate 1 and lid body 2 through a resin sealing material 8, and the resin sealing material 8 comprises 100 parts of resin, by weight, 1 to 20 parts of a moisture-absorbing filler added at the outside and 30 to 100 parts of non-moistureabsorbing filler having a specific surface of 15 to 45m<2>/g.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は半導体素子や圧電振動子
等の電子部品を収容するための電子部品収納用パッケー
ジに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component storage package for storing electronic components such as semiconductor elements and piezoelectric vibrators.

【0002】[0002]

【従来の技術】従来、半導体素子や圧電振動子等の電子
部品を収納する電子部品収納用パッケージ、例えば光を
電気に変換する半導体材料より成る固体撮像素子を収容
するパッケージは通常、酸化アルミニウム質焼結体等の
電気絶縁材料から成り、その上面に固体撮像素子を載置
固定するための載置部を有し、且つ該載置部周辺から外
周縁にかけて導出されたタングステン、モリブデン、マ
ンガン等の高融点金属粉末から成る複数個のメタライズ
配線層を有する絶縁基体と、固体撮像素子を外部電気回
路に接続するために前記メタライズ配線層に銀ロウ等の
ロウ材を介し取着された外部リード端子と、ガラス、サ
ファイア等の透光材料から成る蓋体とより構成されてお
り、絶縁基体の固体撮像素子載置部に固体撮像素子を接
着剤を介して接着固定するとともに該固体撮像素子の各
電極をボンディングワイヤを介してメタライズ配線層に
電気的に接続し、しかる後、絶縁基体と蓋体とをエポキ
シ樹脂等から成る樹脂製封止材を介して接合させ、固体
撮像素子を内部に気密に封止することによって製品とし
ての固体撮像装置となる。
2. Description of the Related Art Conventionally, an electronic component housing package for housing electronic components such as a semiconductor element and a piezoelectric vibrator, for example, a package for housing a solid-state image sensor made of a semiconductor material that converts light into electricity is usually made of aluminum oxide. It is made of an electrically insulating material such as a sintered body and has a mounting portion for mounting and fixing the solid-state imaging device on the upper surface thereof, and tungsten, molybdenum, manganese, etc. led out from the periphery of the mounting portion to the outer peripheral edge. An insulating substrate having a plurality of metallized wiring layers made of refractory metal powder, and external leads attached to the metallized wiring layers via a brazing material such as silver brazing for connecting the solid-state imaging device to an external electric circuit. It is composed of terminals and a lid made of translucent material such as glass and sapphire, and the solid-state image sensor is bonded to the solid-state image sensor mounting part of the insulating substrate with an adhesive. And each electrode of the solid-state image pickup device is electrically connected to the metallized wiring layer via a bonding wire, and then the insulating base and the lid are joined via a resin sealing material made of epoxy resin or the like. Then, the solid-state imaging device is hermetically sealed inside to form a solid-state imaging device as a product.

【0003】尚、前記エポキシ樹脂から成る樹脂製封止
材は、絶縁基体と蓋体との接合の作業性を良好とするた
めに一般に蓋体の下面で、絶縁基体と相対接する領域全
面に予め所定厚みに被着されており、絶縁基体上に蓋体
を間に樹脂製封止材を挟んで載置させるとともに樹脂製
封止材に約150℃の温度を印加し、樹脂製封止材を熱
硬化させることによって蓋体は絶縁基体に接合されるこ
ととなる。
In order to improve the workability of joining the insulating base and the lid, the resin encapsulant made of the epoxy resin is generally formed on the lower surface of the lid in advance over the entire area in contact with the insulating base. The resin sealing material is adhered to a predetermined thickness and is placed on the insulating base with the resin sealing material sandwiched therebetween, and a temperature of about 150 ° C. is applied to the resin sealing material. The thermosetting resin will bond the lid to the insulating substrate.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、近時、
各種電子機器は小型化が急激に進み、該電子機器に実装
される固体撮像装置等の電子装置も全体の形状が小さな
ものとなり、絶縁基体と蓋体の相対接する領域の幅が狭
いものになるとともに絶縁基体と蓋体とを接合させる樹
脂製封止材の幅も極めて狭いものとなってきた。そのた
めこの固体撮像装置では絶縁基体と蓋体とを接合させる
樹脂製封止材の幅が狭いことに起因して大気中に含まれ
る水分が耐湿性に劣るエポキシ樹脂より成る樹脂製封止
材を通して内部に入り込み易くなり、内部に水分が入り
込むと固体撮像素子の電極やボンディングワイヤ等に酸
化腐食が発生し、固体撮像装置としての機能が喪失する
という欠点を招来した。また、同時に内部に水分が入り
込むと該水分が蓋体に露となって付着し、外部から蓋体
を通して固体撮像素子に像を結像させ、固体撮像素子に
結像した像に対応する光電変換を起こさせる際、固体撮
像素子への結像が前記蓋体に付着した露によって歪み、
固体撮像素子に正確な光電変換を起こさせることができ
ないという欠点も有していた。
However, in recent years,
Miniaturization of various electronic devices has progressed rapidly, and the overall shape of electronic devices such as solid-state imaging devices mounted in the electronic devices has also become small, and the width of the area where the insulating base body and the lid are in relative contact is narrow. At the same time, the width of the resin sealing material for joining the insulating base and the lid has become extremely narrow. For this reason, in this solid-state imaging device, moisture contained in the atmosphere due to the narrow width of the resin encapsulating material that joins the insulating base and the lid body through the resin encapsulating material made of epoxy resin having poor moisture resistance. It becomes easy to enter inside, and when water enters inside, oxidative corrosion occurs in the electrodes of the solid-state imaging device, bonding wires, etc., resulting in the loss of the function as a solid-state imaging device. Further, at the same time, when moisture enters the inside, the moisture adheres to the lid as dew, and an image is formed on the solid-state image sensor from the outside through the lid and photoelectric conversion corresponding to the image formed on the solid-state image sensor. When causing the, the image formation on the solid-state image sensor is distorted by the dew attached to the lid,
There is also a drawback that the solid-state image pickup device cannot perform accurate photoelectric conversion.

【0005】そこで上記欠点を解消するために耐湿性に
劣るエポキシ樹脂等より成る樹脂製封止材にシリカゲル
やゼオライト等から成る吸湿性のフィラーを添加含有さ
せておき、該吸湿性フィラーに樹脂製封止材を通して入
り込む水分を吸着させ、水分が固体撮像素子の電極やボ
ンディングワイヤ等に付着し、ボンディングワイヤ等に
酸化腐食が発生するのを、或は蓋体に付着し、露となっ
て固体撮像素子の光電変換に歪みを発生させるのを有効
に防止することが考えられる。
Therefore, in order to solve the above-mentioned drawbacks, a resin-made sealing material made of epoxy resin or the like having poor moisture resistance is added with a hygroscopic filler made of silica gel, zeolite or the like, and the hygroscopic filler is made of resin. It absorbs the moisture that enters through the encapsulant, and the moisture adheres to the electrodes and bonding wires of the solid-state image sensor, causing oxidative corrosion on the bonding wires, etc. It can be considered to effectively prevent distortion in photoelectric conversion of the image sensor.

【0006】しかしながら、エポキシ樹脂等の樹脂製封
止材にシリカゲルやゼオライト等の吸湿性フィラーを添
加含有させた場合、蓋体の下面に塗布させた後、絶縁基
体と蓋体とを接合させるまでの間に吸湿性フィラーが多
量の水分を吸着してほぼ飽和状態となってしまい、絶縁
基体と蓋体とを接合させた後には樹脂製封止材中の吸湿
性フィラーはほとんど水分を吸着することができず、そ
の結果、従前と同様、内部に水分が入り込み、固体撮像
素子の電極やボンディングワイヤ等に酸化腐食を発生さ
せたり、蓋体に露が付着し、固体撮像素子に正確な光電
変換を起こさせることができないという欠点を有する。
However, when a hygroscopic filler such as silica gel or zeolite is added to a resin sealing material such as an epoxy resin, the hygroscopic filler is applied to the lower surface of the lid and then the insulating base and the lid are joined together. During the process, the hygroscopic filler adsorbs a large amount of water and becomes almost saturated, and the hygroscopic filler in the resin encapsulant adsorbs most of the water after the insulating base and the lid are joined. As a result, as in the past, moisture enters the inside, causing oxidative corrosion on the electrodes and bonding wires of the solid-state image sensor, and dew on the lid, which prevents accurate photoelectric transfer to the solid-state image sensor. It has the disadvantage that no conversion can take place.

【0007】[0007]

【発明の目的】本発明は上記諸欠点に鑑み案出されたも
ので、その目的は内部に水分が入り込むのを有効に防止
し、内部に収容する電子部品を長期間にわたり、正常、
且つ安定に作動させることができる電子部品収納用パッ
ケージを提供することにある。
SUMMARY OF THE INVENTION The present invention has been devised in view of the above-mentioned drawbacks, and its purpose is to effectively prevent moisture from entering the inside and keep the electronic parts housed therein for a long period of time.
Another object of the present invention is to provide an electronic component storing package that can be stably operated.

【0008】[0008]

【課題を解決するための手段】本発明は絶縁基体と蓋体
とを樹脂製封止材を介し接合させることによって内部に
電子部品を気密に収容するようになした電子部品収納用
パッケージであって、前記樹脂製封止材は、樹脂100
重量部に対し、外添加で吸湿性フィラーを1乃至20重
量部、比表面積が15乃至45m2 /gの非吸湿性フィ
ラーを30乃至100重量部添加したものから成ること
を特徴とするものである。
SUMMARY OF THE INVENTION The present invention is an electronic component housing package in which electronic components are hermetically housed by joining an insulating base and a lid with a resin sealing material. The resin sealing material is resin 100
1 to 20 parts by weight of an externally added hygroscopic filler and 30 to 100 parts by weight of a non-hygroscopic filler having a specific surface area of 15 to 45 m 2 / g are added to parts by weight. is there.

【0009】[0009]

【作用】本発明の電子部品収納用パッケージによれば、
絶縁基体と蓋体とを接合させる樹脂製封止材に吸湿性フ
ィラーと、所定比表面積を有する非吸湿性フィラーを所
定量添加含有させたことから水分の樹脂製封止材への浸
入は非吸湿性フィラーで大幅に阻止され、同時に樹脂製
封止材に浸入した少量の水分は吸湿性フィラーに完全に
吸着されることとなって電子部品の収容される内部に水
分が入り込むことはほとんどなく、その結果、電子部品
の電極やボンディングワイヤに酸化腐食等が発生するの
が皆無となり、これによって電子部品を長期間にわた
り、正常、且つ安定に作動させることが可能となる。
According to the electronic component storing package of the present invention,
Since a hygroscopic filler and a non-hygroscopic filler having a predetermined specific surface area are added to the resin encapsulating material for joining the insulating substrate and the lid in a predetermined amount, water does not enter the resin encapsulating material. A small amount of water that has been significantly blocked by the hygroscopic filler and at the same time has completely absorbed into the resin encapsulant, and is completely adsorbed by the hygroscopic filler. As a result, no oxidative corrosion or the like occurs in the electrodes or bonding wires of the electronic component, which allows the electronic component to operate normally and stably for a long period of time.

【0010】また本発明の電子部品収納用パッケージに
よれば樹脂製封止材に吸湿性フィラーと非吸湿性フィラ
ーを添加含有させ、非吸湿性フィラーで樹脂製封止材に
水分が浸入するのを有効に防止していることから、樹脂
製封止材で絶縁基体と蓋体とを接合させる以前に吸湿性
フィラーが多量の水分を吸着して飽和状態になることは
なく、その結果、絶縁基体と蓋体とを樹脂製封止材を介
して接合させた後も吸湿性フィラーが樹脂製封止材に浸
入してくる水分を長期間にわたり安定して吸着すること
が可能となり、電子部品を収容する内部に水分が入り込
むのを長期間にわたり防止することができる。
Further, according to the package for storing electronic parts of the present invention, the resin encapsulating material is made to contain the hygroscopic filler and the non-hygroscopic filler, and the moisture penetrates into the resin encapsulating material by the non-hygroscopic filler. Effectively prevents the hygroscopic filler from adsorbing a large amount of water before joining the insulating base and the lid with the resin encapsulant, resulting in saturation. Even after the base body and the lid are joined together via the resin-made sealing material, the hygroscopic filler can stably adsorb the moisture invading the resin-made sealing material for a long period of time. It is possible to prevent moisture from entering the interior of the housing for a long period of time.

【0011】[0011]

【実施例】次に本発明を添付図面に基づき詳細に説明す
る。
The present invention will now be described in detail with reference to the accompanying drawings.

【0012】図1は本発明の電子部品収納用パッケージ
を半導体材料から成る固体撮像素子を収容するためのパ
ッケージに適用した場合の一実施例を示し、1は絶縁基
体、2は蓋体である。この絶縁基体1と蓋体2とで固体
撮像素子3を収容するための容器4が構成される。
FIG. 1 shows an embodiment in which the package for housing electronic parts according to the present invention is applied to a package for housing a solid-state image pickup device made of a semiconductor material, 1 is an insulating substrate, and 2 is a lid. . The insulating base 1 and the lid 2 constitute a container 4 for housing the solid-state imaging device 3.

【0013】前記絶縁基体1はその上面略中央部に固体
撮像素子3を収容するための空所を形成する凹部1aが
設けてあり、該凹部1a底面には固体撮像素子3がガラ
ス、樹脂、ロウ材等の接着剤を介して載置固定される。
The insulating substrate 1 is provided with a recessed portion 1a which forms a space for accommodating the solid-state image pickup element 3 in a substantially central portion of its upper surface, and the solid-state image pickup element 3 is provided with glass, resin, or the like on the bottom surface of the recessed portion 1a. It is placed and fixed via an adhesive such as a brazing material.

【0014】前記絶縁基体1は酸化アルミニウム質焼結
体、ムライト質焼結体、窒化アルミニウム質焼結体、炭
化珪素質焼結体等の電気絶縁材料から成り、例えば酸化
アルミニウム質焼結体から成る場合、アルミナ(Al2
3 )、シリカ(SiO2 )、カルシア(CaO)、マ
グネシア(MgO)等の原料粉末に適当な有機溶剤、溶
媒を添加混合して泥漿状となすとともにこれを従来周知
のドクターブレード法やカレンダーロール法等を採用す
ることによってセラミックグリーンシート(セラミック
生シート)を形成し、しかる後、前記セラミックグリー
ンシートに適当な打ち抜き加工を施すとともに複数枚積
層し、高温(約1600℃)で焼成することによって製
作される。
The insulating substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, and a silicon carbide sintered body. For example, an aluminum oxide sintered body is used. If it consists of alumina (Al 2
O 3 ), silica (SiO 2 ), calcia (CaO), magnesia (MgO), and other raw material powders are mixed with an appropriate organic solvent and solvent to form a slurry, which is formed by the well-known doctor blade method or calendar. A ceramic green sheet (ceramic green sheet) is formed by adopting a roll method or the like, and thereafter, the ceramic green sheet is appropriately punched and a plurality of layers are laminated and fired at a high temperature (about 1600 ° C.). Produced by.

【0015】また前記絶縁基体1には凹部1a周辺から
側面にかけて導出する複数のメタライズ配線層5が形成
されており、該メタライズ配線層5の凹部1a周辺部に
は固体撮像素子3の各電極がボンディングワイヤ6を介
して電気的に接続され、また側面に導出された部位には
外部電気回路と接続される外部リード端子7が銀ロウ等
のロウ材を介し取着される。
A plurality of metallized wiring layers 5 extending from the periphery of the recess 1a to the side surface are formed on the insulating base 1, and the electrodes of the solid-state image pickup device 3 are formed in the periphery of the recess 1a of the metallized wiring layer 5. External lead terminals 7 that are electrically connected via the bonding wires 6 and that are connected to the external electric circuit are attached to the portions led out to the side surface via a brazing material such as silver brazing.

【0016】前記メタライズ配線層5はタングステン、
モリブデン、マンガン等の高融点金属粉末から成り、該
高融点金属粉末に適当な有機溶剤、溶媒を添加混合して
得た金属ペーストを絶縁基体1となるセラミックグリー
ンシートに予め従来周知のスクリーン印刷法等のより印
刷塗布しておくことによって絶縁基体1の凹部1a周辺
から側面にかけて被着形成される。
The metallized wiring layer 5 is made of tungsten,
A metal green paste made of a high melting point metal powder such as molybdenum or manganese, obtained by adding and mixing an appropriate organic solvent or solvent to the high melting point metal powder, is previously screen-printed on the ceramic green sheet to be the insulating substrate 1 by a known method. And the like are applied by printing, so that the insulating substrate 1 is adhered and formed from the periphery of the concave portion 1a to the side surface.

【0017】尚、前記メタライズ配線層5はその露出す
る表面にニッケルや金等の良導電性で、且つ耐蝕性に優
れた金属をメッキ法により1. 0乃至20. 0μmの厚
みに層着させておくとメタライズ配線層5の酸化腐食を
有効に防止することができるとともにメタライズ配線層
5とボンディングワイヤ6との接続及びメタライズ配線
層5と外部リード端子7とのロウ付けを極めて強固なも
のとなすことができる。従って、前記メタライズ配線層
5の酸化腐食を防止し、メタライズ配線層5とボンディ
ングワイヤ6との接続及びメタライズ配線層5と外部リ
ード端子7とのロウ付けを強固とするにはメタライズ配
線層5の露出する表面にニッケルや金等を1. 0乃至2
0. 0μmの厚みに層着させておくことが好ましい。
On the exposed surface of the metallized wiring layer 5, a metal such as nickel or gold having good conductivity and excellent corrosion resistance is deposited by plating to a thickness of 1.0 to 20.0 μm. This makes it possible to effectively prevent oxidative corrosion of the metallized wiring layer 5, and to extremely firmly connect the metallized wiring layer 5 and the bonding wire 6 and braze the metallized wiring layer 5 and the external lead terminals 7. You can do it. Therefore, in order to prevent the oxidative corrosion of the metallized wiring layer 5 and to strengthen the connection between the metallized wiring layer 5 and the bonding wire 6 and the brazing of the metallized wiring layer 5 and the external lead terminals 7, 1.0 to 2 nickel or gold on the exposed surface
It is preferable to layer them to a thickness of 0.0 μm.

【0018】また前記メタライズ配線層5にロウ付けさ
れる外部リード端子7は内部に収容する固体撮像素子3
を外部電気回路に接続する作用を為し、外部リード端子
7を外部電気回路に接続することによって内部に収容さ
れる固体撮像素子3はメタライズ配線層5及び外部リー
ド端子7を介し外部電気回路と電気的に接続されること
となる。
The external lead terminal 7 brazed to the metallized wiring layer 5 is housed inside the solid-state image pickup device 3.
Is connected to an external electric circuit, and the solid-state imaging device 3 housed inside by connecting the external lead terminal 7 to the external electric circuit is connected to the external electric circuit via the metallized wiring layer 5 and the external lead terminal 7. It will be electrically connected.

【0019】前記外部リード端子7はコバール金属(F
e−Ni−Co合金)や42アロイ(Fe−Ni合金)
等の金属材料から成り、コバール金属等のインゴット
(塊)を従来周知の圧延加工法や打ち抜き加工法等を採
用することによって所定の板状に形成される。
The external lead terminal 7 is made of Kovar metal (F
e-Ni-Co alloy) and 42 alloy (Fe-Ni alloy)
The ingot (lump) of Kovar metal or the like is formed into a predetermined plate shape by adopting a conventionally known rolling processing method, punching processing method, or the like.

【0020】一方、前記絶縁基体1の上面には蓋体2が
エポキシ樹脂等の樹脂製封止材8を介して接合され、蓋
体2で絶縁基体1の凹部1aを塞ぐことによって絶縁基
体1と蓋体2とから成る容器4内部に固体撮像素子3が
気密に封止される。
On the other hand, the lid 2 is joined to the upper surface of the insulating base 1 via a resin sealing material 8 such as epoxy resin, and the lid 2 closes the recess 1a of the insulating base 1 to form the insulating base 1. The solid-state image sensor 3 is hermetically sealed in the container 4 including the lid 2 and the lid 2.

【0021】前記蓋体2はサファイヤやガラス、石英等
の透光性材料から成り、外部レンズ部材(不図示)で縮
小された光学的画像を容器4内部に収容した固体撮像素
子3上に照射結像させる作用をなす。
The lid 2 is made of a light-transmitting material such as sapphire, glass, or quartz, and an optical image reduced by an external lens member (not shown) is projected onto the solid-state image sensor 3 housed inside the container 4. It forms an image.

【0022】尚、前記蓋体2は例えば、ガラスから成る
場合、シリカ(SiO2 )、酸化ホウ素(B2 3 )、
アルミナ(Al2 3 )、カルシア(CaO)、酸化バ
リウム(BaO)等のガラス成分粉末を溶融冷却し平板
状に成形することによって製作される。
When the lid 2 is made of glass, for example, silica (SiO 2 ), boron oxide (B 2 O 3 ),
It is manufactured by melting and cooling glass component powders such as alumina (Al 2 O 3 ), calcia (CaO), and barium oxide (BaO) into flat plates.

【0023】また前記蓋体2を絶縁基体1の上面に接合
させる樹脂製封止材8は例えばエポキシ樹脂から成り、
蓋体2の下面で絶縁基体1と相対接する領域全面に予め
所定厚みに被着させておき、絶縁基体1の上面に蓋体2
を間に樹脂製封止材8を挟んで載置させ、蓋体2を絶縁
基体1側に所定圧力で押圧しながら樹脂製封止材8に約
150℃の温度を印加し、樹脂製封止材8を熱硬化させ
ることによって蓋体2は絶縁基体1に接合されることと
なる。
The resin sealing material 8 for bonding the lid 2 to the upper surface of the insulating substrate 1 is made of, for example, epoxy resin,
The entire surface of the lower surface of the lid body 2 that is in contact with the insulating base body 1 is adhered to a predetermined thickness in advance, and the upper surface of the insulating base body 1 is covered with the lid body 2.
The resin-made sealing material 8 is sandwiched between them, and a temperature of about 150 ° C. is applied to the resin-made sealing material 8 while pressing the lid body 2 against the insulating substrate 1 side with a predetermined pressure to seal the resin-made sealing material. The lid 2 is bonded to the insulating substrate 1 by thermosetting the stopper 8.

【0024】前記樹脂製封止材8は、ビスフェノール型
エポキシやナフタレン型エポキシ、フェノール誘導体型
エポキシ、ビフェニル型エポキシ等のエポキシ樹脂に芳
香族アミン系硬化剤や酸無水物系硬化剤などの硬化剤を
適量、必要に応じてイミダゾール系硬化促進剤、ジシア
ンジアミド系硬化促進剤等の硬化促進剤を添加混合して
ペースト状となすとともにこれを蓋体2の下面に従来周
知のスクリーン印刷法を採用して印刷塗布し、しかる
後、前記ペーストを約80℃の温度で加熱し半硬化状と
なすことによって蓋体2の下面に予め被着される。
The resin encapsulant 8 is an epoxy resin such as bisphenol type epoxy, naphthalene type epoxy, phenol derivative type epoxy or biphenyl type epoxy, and a curing agent such as an aromatic amine type curing agent or an acid anhydride type curing agent. Is added in an appropriate amount, if necessary, with a curing accelerator such as an imidazole type curing accelerator or a dicyandiamide type curing accelerator to form a paste, and this is applied to the lower surface of the lid body 2 by a conventionally known screen printing method. Then, the paste is applied by printing, and then the paste is heated at a temperature of about 80 ° C. to be semi-cured, so that the paste is applied to the lower surface of the lid body 2 in advance.

【0025】前記樹脂製封止材8は、更にその内部に吸
湿性フィラーと比表面積が15乃至45m2 /gの非吸
湿性フィラーが添加含有されており、非吸湿性フィラー
で樹脂製封止材8に水分が浸入するのを大幅に阻止する
とともに樹脂製封止材8に浸入した少量の水分を吸湿性
フィラーで吸着させて容器4内部に水分が入り込むのを
防止し、これによって容器4内部の固体撮像素子3の電
極やボンディングワイヤ6に水分が付着して酸化腐食を
発生したり蓋体2の内面に水分が露となって付着し、固
体撮像素子3への結像に歪みを発生することは皆無とな
る。
The resin encapsulant 8 further contains a hygroscopic filler and a non-hygroscopic filler having a specific surface area of 15 to 45 m 2 / g therein, and the non-hygroscopic filler encapsulates the resin. Moisture is prevented from entering the material 8 significantly, and a small amount of water that has entered the resin sealing material 8 is adsorbed by the hygroscopic filler to prevent water from entering the inside of the container 4. Moisture adheres to the electrodes of the solid-state image sensor 3 and the bonding wires 6 to cause oxidative corrosion, or moisture adheres to the inner surface of the lid body 2 as dew to distort the image formed on the solid-state image sensor 3. Nothing will happen.

【0026】前記樹脂製封止材8に添加される吸湿性フ
ィラーとしては数十オングストロームの細孔を有する吸
湿性シリカやシリカゲル、ゼオライト等が使用され、例
えば粒径1μm、比表面積400乃至600m2 /gの
吸湿性シリカを樹脂製封止材8を構成する液状のエポキ
シ樹脂に添加させることによって樹脂製封止材8中に含
有される。
As the hygroscopic filler added to the resin sealing material 8, hygroscopic silica, silica gel, zeolite or the like having pores of several tens of angstroms are used. For example, the particle size is 1 μm and the specific surface area is 400 to 600 m 2. Hygroscopic silica of / g is contained in the resin encapsulant 8 by adding it to the liquid epoxy resin forming the resin encapsulant 8.

【0027】尚、前記吸湿性フィラーは、その添加量が
樹脂100重量部に対して、1重量部未満となると樹脂
製封止材8に浸入してくる水分を充分に吸着することが
できず、また20重量部を越えると、樹脂製封止材8の
流動性が低下し、絶縁基体1と蓋体2とを接合させて容
器4を気密封止する際、樹脂製封止材8が絶縁基体1と
蓋体2との間に充分流れず良好な封止ができなくなる。
従って、前記樹脂製封止材8に添加含有される吸湿性フ
ィラーの量は、樹脂100重量部に対して、外添加で1
乃至20重量部の範囲に限定される。
If the amount of the hygroscopic filler added is less than 1 part by weight with respect to 100 parts by weight of the resin, the moisture infiltrating into the resin sealing material 8 cannot be sufficiently adsorbed. On the other hand, if the amount exceeds 20 parts by weight, the fluidity of the resin encapsulant 8 decreases, and when the container 4 is hermetically sealed by joining the insulating base 1 and the lid 2, the resin encapsulant 8 is Sufficient flow does not occur between the insulating substrate 1 and the lid 2, and good sealing cannot be performed.
Therefore, the amount of the hygroscopic filler added to the resin encapsulant 8 is 1 when externally added to 100 parts by weight of the resin.
To 20 parts by weight.

【0028】また前記樹脂製封止材8に添加される非吸
湿性フィラーは比表面積15乃至45m2 /gのシリカ
やアルミナ等の無機粉末が使用され、例えば粒径が1乃
至1.4μm、比表面積15乃至45m2 /gのシリカ
を樹脂製封止材8を構成する液状のエポキシ樹脂に添加
させることによって樹脂製封止材8中に含有される。
The non-hygroscopic filler added to the resin sealing material 8 is an inorganic powder such as silica or alumina having a specific surface area of 15 to 45 m 2 / g, for example, a particle diameter of 1 to 1.4 μm, Silica having a specific surface area of 15 to 45 m 2 / g is contained in the resin sealing material 8 by adding it to the liquid epoxy resin forming the resin sealing material 8.

【0029】前記非吸湿性フィラーはその添加量が樹脂
100重量部に対して、30重量部未満となると樹脂製
封止材8への水分浸入を有効に阻止することができなく
なり、100重量部を越えると、樹脂製封止材8の流動
性が低下し、絶縁基体1と蓋体2とを接合させて容器4
を気密封止する際、樹脂製封止材8が絶縁基体1と蓋体
2との間に充分流れず良好な封止ができなくなる。従っ
て、前記樹脂製封止材8に添加含有される非吸湿性フィ
ラーの量は、樹脂100重量部に対して、外添加で30
乃至100重量部の範囲に限定される。
When the amount of the non-hygroscopic filler added is less than 30 parts by weight with respect to 100 parts by weight of the resin, it becomes impossible to effectively prevent the infiltration of water into the resin sealing material 8, and 100 parts by weight. If the temperature exceeds the range, the fluidity of the resin sealing material 8 is lowered, and the insulating base 1 and the lid 2 are joined to each other to form the container 4
When air-tightly sealing, the resin sealing material 8 does not sufficiently flow between the insulating base 1 and the lid 2, and good sealing cannot be performed. Therefore, the amount of the non-hygroscopic filler added to the resin encapsulant 8 is 30 when externally added to 100 parts by weight of the resin.
To 100 parts by weight.

【0030】また前記非吸湿性フイラーは、その比表面
積が15m2 /g未満では樹脂製封止材8への水分浸入
を有効に阻止することができず、また45m2 /gを越
えると樹脂製封止材8が流動性を低下し、絶縁基体1と
蓋体2とから成る容器4の気密封止の信頼性が悪くな
る。従って、前記非吸湿性フィラーの比表面積は15乃
至45m2 /gの範囲に限定される。
Further the non-hygroscopic filler, the If the specific surface area is less than 15 m 2 / g can not be effectively prevented moisture penetration into the resin sealant 8, also exceeds 45 m 2 / g resin The encapsulating material 8 lowers the fluidity, and the reliability of the hermetic sealing of the container 4 including the insulating base 1 and the lid 2 deteriorates. Therefore, the specific surface area of the non-hygroscopic filler is limited to the range of 15 to 45 m 2 / g.

【0031】かくして上述のパッケージによれば、絶縁
基体1の凹部1a底面に固体撮像素子3を接着剤を介し
て取着するとともに固体撮像素子3の各電極をメタライ
ズ配線層5にボンディングワイヤ6を介して電気的に接
続し、しかる後、絶縁基体1の上面に蓋体2を樹脂製封
止材8を介して接合させ、絶縁基体1と蓋体2とから成
る容器4の内部に固体撮像素子3を気密に封止すること
によって製品としての固体撮像装置となる。
Thus, according to the above-mentioned package, the solid-state image pickup device 3 is attached to the bottom surface of the concave portion 1a of the insulating substrate 1 with an adhesive, and each electrode of the solid-state image pickup device 3 is provided with the bonding wire 6 on the metallized wiring layer 5. After that, the lid body 2 is bonded to the upper surface of the insulating base body 1 with the resin sealing material 8 interposed therebetween, and the solid-state imaging is performed inside the container 4 including the insulating base body 1 and the lid body 2. By sealing the element 3 in an airtight manner, a solid-state imaging device as a product is obtained.

【0032】尚、本発明は上述の実施例に限定されるも
のではなく、本発明の要旨を逸脱しない範囲であれば種
々の変更は可能であり、例えば、上述の実施例では固体
撮像素子を収容するパッケージを例にとって説明したが
他の半導体素子や圧電振動子等の電子部品を収容するパ
ッケージにも適用可能である。
The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention. For example, in the above-mentioned embodiments, the solid-state image sensor is Although the package to be housed has been described as an example, the present invention is also applicable to a package to house other semiconductor elements and electronic parts such as piezoelectric vibrators.

【0033】また前記樹脂製封止材8は蓋体2に予め被
着させておいたが絶縁基体1側に余剰領域がある場合に
は絶縁基体1側に被着させておいてもよい。
Although the resin sealing material 8 is applied to the lid body 2 in advance, it may be applied to the insulating base material 1 side if there is a surplus area on the insulating base material 1 side.

【0034】更に樹脂製封止材8は予め、絶縁基体1も
しくは蓋体2に被着させておかなくとも、半硬化させた
板状の樹脂製封止材8を準備しておき、これを絶縁基体
1と蓋体2との間に挾持し、加熱溶融させることによっ
て、絶縁基体1と蓋体2を接合してもよい。
Further, the resin-made sealing material 8 may be prepared by semi-curing the plate-shaped resin-made sealing material 8 without applying it to the insulating substrate 1 or the lid body 2 in advance. The insulating base 1 and the lid 2 may be joined by sandwiching them between the insulating base 1 and the lid 2 and heating and melting.

【0035】[0035]

【発明の効果】本発明の電子部品収納用パッケージによ
れば、絶縁基体と蓋体とを接合させる樹脂製封止材に吸
湿性フィラーを樹脂100重量部に対して外添加で1乃
至20重量部、比表面積が15乃至45m2 /gの非吸
湿性フィラーを樹脂100重量部に対して外添加で30
乃至100重量部添加含有させたことから水分の樹脂製
封止材への浸入は非吸湿性フィラーで大幅に阻止され、
同時に樹脂製封止材に浸入した少量の水分は吸湿性フィ
ラーに完全に吸着されることとなって、電子部品の収容
される内部に水分が入り込むことはほとんどなく、その
結果、電子部品の電極やボンディングワイヤに酸化腐食
等が発生するのが皆無となり、これによって電子部品を
長期間にわたり、正常、且つ安定に作動させることが可
能となる。
According to the package for storing electronic parts of the present invention, the hygroscopic filler is added to the resin sealing material for joining the insulating substrate and the lid with 100 to 100 parts by weight of the resin by external addition of 1 to 20 parts by weight. Part, a non-hygroscopic filler having a specific surface area of 15 to 45 m 2 / g is externally added to 100 parts by weight of the resin by 30
Since the addition of 100 parts by weight to 100 parts by weight, the non-hygroscopic filler prevents the infiltration of water into the resin sealing material,
At the same time, a small amount of water that has penetrated into the resin encapsulant is completely adsorbed by the hygroscopic filler, and the water hardly enters the interior of the electronic component. No oxidative corrosion or the like is generated in the bonding wire and the bonding wire, which makes it possible to operate the electronic component normally and stably for a long period of time.

【0036】また本発明の電子部品収納用パッケージに
よれば樹脂製封止材に吸湿性フィラーと非吸湿性フィラ
ーを添加含有させ、非吸湿性フィラーで樹脂製封止材に
水分が浸入するのを有効に防止していることから、樹脂
製封止材で絶縁基体と蓋体とを接合させる以前に吸湿性
フィラーが多量の水分を吸着して飽和状態になることは
なく、その結果、絶縁基体と蓋体とを樹脂製封止材を介
して接合させた後も吸湿性フィラーが樹脂製封止材に浸
入してくる水分を長期間にわたり安定して吸着すること
が可能となり、電子部品を収容する内部に水分が入り込
むのを長期間にわたり防止することができる。
Further, according to the package for storing electronic parts of the present invention, the resin encapsulating material is made to contain the hygroscopic filler and the non-hygroscopic filler, and the moisture penetrates into the resin encapsulating material with the non-hygroscopic filler. Effectively prevents the hygroscopic filler from adsorbing a large amount of water before joining the insulating base and the lid with the resin encapsulant, resulting in saturation. Even after the base body and the lid are joined together via the resin-made sealing material, the hygroscopic filler can stably adsorb the moisture invading the resin-made sealing material for a long period of time. It is possible to prevent moisture from entering the interior of the housing for a long period of time.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の電子部品収納用パッケージを半導体材
料から成る固体撮像素子を収容するパッケージに適用し
た場合の一実施例を示す断面図である。
FIG. 1 is a cross-sectional view showing an embodiment in which an electronic component housing package of the present invention is applied to a package housing a solid-state image sensor made of a semiconductor material.

【符号の説明】[Explanation of symbols]

1・・・絶縁基体 2・・・蓋体 3・・・固体撮像素子 4・・・容器 7・・・外部リード端子 8・・・樹脂製封止材 DESCRIPTION OF SYMBOLS 1 ... Insulating substrate 2 ... Lid 3 ... Solid-state image sensor 4 ... Container 7 ... External lead terminal 8 ... Resin encapsulant

───────────────────────────────────────────────────── フロントページの続き (72)発明者 宮脇 清茂 京都府京都市山科区東野北井ノ上町5番地 の22 京セラ株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kiyoshige Miyawaki 22 Kyocera Corporation, 5-5 Higashinokitainouemachi, Yamashina-ku, Kyoto City, Kyoto Prefecture

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】絶縁基体と蓋体とを樹脂製封止材を介し接
合させることによって内部に電子部品を気密に収容する
ようになした電子部品収納用パッケージであって、前記
樹脂製封止材は、樹脂100重量部に対し、外添加で吸
湿性フィラーを1乃至20重量部、比表面積が15乃至
45m2 /gの非吸湿性フィラーを30乃至100重量
部添加したものから成ることを特徴とする電子部品収納
用パッケージ。
1. A package for storing electronic components, wherein an insulating base and a lid are joined together via a resin sealing material to hermetically accommodate electronic components therein. The material consists of 100 parts by weight of resin, and 1 to 20 parts by weight of hygroscopic filler added externally and 30 to 100 parts by weight of non-hygroscopic filler having a specific surface area of 15 to 45 m 2 / g. Characteristic electronic component storage package.
JP29937293A 1993-11-30 1993-11-30 Electronic component storage package Expired - Lifetime JP2746826B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29937293A JP2746826B2 (en) 1993-11-30 1993-11-30 Electronic component storage package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29937293A JP2746826B2 (en) 1993-11-30 1993-11-30 Electronic component storage package

Publications (2)

Publication Number Publication Date
JPH07153864A true JPH07153864A (en) 1995-06-16
JP2746826B2 JP2746826B2 (en) 1998-05-06

Family

ID=17871717

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29937293A Expired - Lifetime JP2746826B2 (en) 1993-11-30 1993-11-30 Electronic component storage package

Country Status (1)

Country Link
JP (1) JP2746826B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0878558A (en) * 1994-09-08 1996-03-22 Kyocera Corp Package for semiconductor element
US6445062B1 (en) 1999-02-19 2002-09-03 Nec Corporation Semiconductor device having a flip chip cavity with lower stress and method for forming same
US8053979B2 (en) * 1999-09-24 2011-11-08 Semiconductor Energy Laboratory Co., Ltd. Light-emitting organic compound with improved reliability

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0878558A (en) * 1994-09-08 1996-03-22 Kyocera Corp Package for semiconductor element
US6445062B1 (en) 1999-02-19 2002-09-03 Nec Corporation Semiconductor device having a flip chip cavity with lower stress and method for forming same
US8053979B2 (en) * 1999-09-24 2011-11-08 Semiconductor Energy Laboratory Co., Ltd. Light-emitting organic compound with improved reliability
US8698389B2 (en) 1999-09-24 2014-04-15 Semiconductor Energy Laboratory Co., Ltd. Light-emitting organic compound and EL display device utilizing the same
US9425403B2 (en) 1999-09-24 2016-08-23 Semiconductor Energy Laboratory Co., Ltd. Light-emitting organic compound and EL display device utilizing the same

Also Published As

Publication number Publication date
JP2746826B2 (en) 1998-05-06

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