JPH0375325A - 半導体装置用Ｃｕ合金リード素材 - Google Patents

半導体装置用Ｃｕ合金リード素材

Info

Publication number
JPH0375325A
JPH0375325A JP19645590A JP19645590A JPH0375325A JP H0375325 A JPH0375325 A JP H0375325A JP 19645590 A JP19645590 A JP 19645590A JP 19645590 A JP19645590 A JP 19645590A JP H0375325 A JPH0375325 A JP H0375325A
Authority
JP
Japan
Prior art keywords
lead
lead material
semiconductor devices
press punching
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19645590A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0514780B2 (enrdf_load_stackoverflow
Inventor
Rensei Futatsuka
二塚　錬成
Tadao Sakakibara
直男 榊原
Masuhiro Izumida
泉田　益弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Original Assignee
Mitsubishi Shindoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindoh Co Ltd filed Critical Mitsubishi Shindoh Co Ltd
Priority to JP19645590A priority Critical patent/JPH0375325A/ja
Publication of JPH0375325A publication Critical patent/JPH0375325A/ja
Publication of JPH0514780B2 publication Critical patent/JPH0514780B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP19645590A 1990-07-25 1990-07-25 半導体装置用Ｃｕ合金リード素材 Granted JPH0375325A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19645590A JPH0375325A (ja) 1990-07-25 1990-07-25 半導体装置用Ｃｕ合金リード素材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19645590A JPH0375325A (ja) 1990-07-25 1990-07-25 半導体装置用Ｃｕ合金リード素材

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP700886A Division JPS62164843A (ja) 1986-01-16 1986-01-16 半導体装置用Ｃｕ合金リ−ド素材

Publications (2)

Publication Number Publication Date
JPH0375325A true JPH0375325A (ja) 1991-03-29
JPH0514780B2 JPH0514780B2 (enrdf_load_stackoverflow) 1993-02-25

Family

ID=16358097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19645590A Granted JPH0375325A (ja) 1990-07-25 1990-07-25 半導体装置用Ｃｕ合金リード素材

Country Status (1)

Country Link
JP (1) JPH0375325A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0514780B2 (enrdf_load_stackoverflow) 1993-02-25

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees