JPH0375325A - 半導体装置用Ｃｕ合金リード素材 - Google Patents

半導体装置用Ｃｕ合金リード素材

Info

Publication number
JPH0375325A
JPH0375325A JP19645590A JP19645590A JPH0375325A JP H0375325 A JPH0375325 A JP H0375325A JP 19645590 A JP19645590 A JP 19645590A JP 19645590 A JP19645590 A JP 19645590A JP H0375325 A JPH0375325 A JP H0375325A
Authority
JP
Japan
Prior art keywords
lead
alloy
press punching
semiconductor device
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19645590A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0514780B2 (cs
Inventor
Rensei Futatsuka
二塚　錬成
Tadao Sakakibara
直男 榊原
Masuhiro Izumida
泉田　益弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Original Assignee
Mitsubishi Shindoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindoh Co Ltd filed Critical Mitsubishi Shindoh Co Ltd
Priority to JP19645590A priority Critical patent/JPH0375325A/ja
Publication of JPH0375325A publication Critical patent/JPH0375325A/ja
Publication of JPH0514780B2 publication Critical patent/JPH0514780B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP19645590A 1990-07-25 1990-07-25 半導体装置用Ｃｕ合金リード素材 Granted JPH0375325A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19645590A JPH0375325A (ja) 1990-07-25 1990-07-25 半導体装置用Ｃｕ合金リード素材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19645590A JPH0375325A (ja) 1990-07-25 1990-07-25 半導体装置用Ｃｕ合金リード素材

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP700886A Division JPS62164843A (ja) 1986-01-16 1986-01-16 半導体装置用Ｃｕ合金リ−ド素材

Publications (2)

Publication Number Publication Date
JPH0375325A true JPH0375325A (ja) 1991-03-29
JPH0514780B2 JPH0514780B2 (cs) 1993-02-25

Family

ID=16358097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19645590A Granted JPH0375325A (ja) 1990-07-25 1990-07-25 半導体装置用Ｃｕ合金リード素材

Country Status (1)

Country Link
JP (1) JPH0375325A (cs)

Also Published As

Publication number Publication date
JPH0514780B2 (cs) 1993-02-25

Similar Documents

Publication Publication Date Title
JPS6252464B2 (cs)
US4908078A (en) Material for conductive parts of electronic or electric devices
JP2007039735A (ja) 異形断面銅合金板の製造方法
US5205878A (en) Copper-based electric and electronic parts having high strength and high electric conductivity
JPS61284946A (ja) 半導体装置用Ｃｕ合金リ−ド素材
JPS6160846A (ja) 半導体装置用銅合金リ−ド材
EP0189745B1 (en) Lead material for ceramic package ic
JPS6389640A (ja) 電子電気機器導電部品材料
JP3772319B2 (ja) リードフレーム用銅合金およびその製造方法
JP2000144284A (ja) 耐熱性に優れる高強度・高導電性Ｃｕ−Ｆｅ系合金板
JPH0726167B2 (ja) 半導体装置のボンデイングワイヤ用Ａｕ合金極細線
JPH0375325A (ja) 半導体装置用Ｃｕ合金リード素材
JP2503793B2 (ja) 打抜金型の摩耗抑制効果を有する電気電子部品用Ｃｕ合金板材
JP2662209B2 (ja) メッキ密着性及びハンダ接合性に優れた電子機器用銅合金とその製造法
JP2733117B2 (ja) 電子部品用銅合金およびその製造方法
JPS62164843A (ja) 半導体装置用Ｃｕ合金リ−ド素材
JPS58147140A (ja) 半導体装置のリ−ド材
JPH0469217B2 (cs)
JPS6314832A (ja) メッキ密着性及びハンダ接合性に優れた電子機器用銅合金とその製造法
JPS64449B2 (cs)
JPS62133033A (ja) 半導体装置用Ｃｕ合金リ−ド素材
JP2568063B2 (ja) 電気電子部品用銅合金
JPH11323464A (ja) 耐打抜き金型摩耗性に優れた銅合金および銅合金薄板
JP2994230B2 (ja) Ａｇめっき性が優れた半導体リードフレーム用銅合金
JPH0788546B2 (ja) 電子機器用銅合金とその製造法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees