JPH0374437B2 - - Google Patents
Info
- Publication number
- JPH0374437B2 JPH0374437B2 JP59258260A JP25826084A JPH0374437B2 JP H0374437 B2 JPH0374437 B2 JP H0374437B2 JP 59258260 A JP59258260 A JP 59258260A JP 25826084 A JP25826084 A JP 25826084A JP H0374437 B2 JPH0374437 B2 JP H0374437B2
- Authority
- JP
- Japan
- Prior art keywords
- module
- card
- oversheet
- adhesive
- center core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59258260A JPS61136186A (ja) | 1984-12-06 | 1984-12-06 | Icカ−ド |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59258260A JPS61136186A (ja) | 1984-12-06 | 1984-12-06 | Icカ−ド |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61136186A JPS61136186A (ja) | 1986-06-24 |
JPH0374437B2 true JPH0374437B2 (enrdf_load_stackoverflow) | 1991-11-26 |
Family
ID=17317758
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59258260A Granted JPS61136186A (ja) | 1984-12-06 | 1984-12-06 | Icカ−ド |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61136186A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08479B2 (ja) * | 1986-12-11 | 1996-01-10 | 三菱電機株式会社 | Icカードの製造方法 |
JPH01120393A (ja) * | 1987-11-04 | 1989-05-12 | Mitsubishi Electric Corp | Icカード |
-
1984
- 1984-12-06 JP JP59258260A patent/JPS61136186A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61136186A (ja) | 1986-06-24 |
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