JPH0373144B2 - - Google Patents

Info

Publication number
JPH0373144B2
JPH0373144B2 JP57114743A JP11474382A JPH0373144B2 JP H0373144 B2 JPH0373144 B2 JP H0373144B2 JP 57114743 A JP57114743 A JP 57114743A JP 11474382 A JP11474382 A JP 11474382A JP H0373144 B2 JPH0373144 B2 JP H0373144B2
Authority
JP
Japan
Prior art keywords
lead frame
lead
temperature
unit
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57114743A
Other languages
English (en)
Japanese (ja)
Other versions
JPS595652A (ja
Inventor
Shinichi Oota
Keiji Hazama
Toshuki Arai
Kiichi Kanamaru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP57114743A priority Critical patent/JPS595652A/ja
Publication of JPS595652A publication Critical patent/JPS595652A/ja
Publication of JPH0373144B2 publication Critical patent/JPH0373144B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/421—
    • H10W72/07173—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57114743A 1982-07-01 1982-07-01 半導体類のパツケ−ジ成形方法 Granted JPS595652A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57114743A JPS595652A (ja) 1982-07-01 1982-07-01 半導体類のパツケ−ジ成形方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57114743A JPS595652A (ja) 1982-07-01 1982-07-01 半導体類のパツケ−ジ成形方法

Publications (2)

Publication Number Publication Date
JPS595652A JPS595652A (ja) 1984-01-12
JPH0373144B2 true JPH0373144B2 (cg-RX-API-DMAC10.html) 1991-11-20

Family

ID=14645542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57114743A Granted JPS595652A (ja) 1982-07-01 1982-07-01 半導体類のパツケ−ジ成形方法

Country Status (1)

Country Link
JP (1) JPS595652A (cg-RX-API-DMAC10.html)

Also Published As

Publication number Publication date
JPS595652A (ja) 1984-01-12

Similar Documents

Publication Publication Date Title
US5949132A (en) Dambarless leadframe for molded component encapsulation
US5041902A (en) Molded electronic package with compression structures
US5331205A (en) Molded plastic package with wire protection
US6583504B2 (en) Semiconductor die with attached heat sink and transfer mold
EP0959494A1 (en) Semiconductor and method for manufacturing the same
US5733802A (en) Semiconductor device and method of manufacturing the same
KR100225333B1 (ko) 리이드프레임및반도체장치
US4305897A (en) Packaging process for semiconductors
JPH09507614A (ja) 面取りされた電子パッケージ部品
JP3316449B2 (ja) 混成集積回路装置およびその製造方法
JP3281859B2 (ja) 混成集積回路装置の製造方法
US4764235A (en) Process and apparatus for sealing semiconductor packages
JPH0373144B2 (cg-RX-API-DMAC10.html)
US6015280A (en) Apparatus for reducing warping of plastic packages
JPS6249738B2 (cg-RX-API-DMAC10.html)
JPS612348A (ja) 樹脂封止形半導体装置の製造方法
JP3070795B2 (ja) 半導体装置用箱形樹脂成形体の成形方法およびそれによって成形された箱形樹脂成形体
KR0119653B1 (ko) 반도체 패키지용 리드프레임의 탑재판 구조
JPH06302635A (ja) 樹脂封止型半導体装置の製法
JPH01205454A (ja) リードフレーム
JPS6058647A (ja) 樹脂封止体
JP2002289717A (ja) リードフレーム、電子部品装置及びその製造方法
KR20040092589A (ko) 열팽창 흡수형 리드프레임
JPS60154542A (ja) 素子密封式半導体装置
JPS6122467B2 (cg-RX-API-DMAC10.html)