JPH0371654U - - Google Patents

Info

Publication number
JPH0371654U
JPH0371654U JP13324389U JP13324389U JPH0371654U JP H0371654 U JPH0371654 U JP H0371654U JP 13324389 U JP13324389 U JP 13324389U JP 13324389 U JP13324389 U JP 13324389U JP H0371654 U JPH0371654 U JP H0371654U
Authority
JP
Japan
Prior art keywords
semiconductor device
external lead
angle
mounting board
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13324389U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13324389U priority Critical patent/JPH0371654U/ja
Publication of JPH0371654U publication Critical patent/JPH0371654U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例の実装用基板実装時
の断面図、第2図は本考案の他の実施例の実装用
基板実装時の断面図、第3図は従来の表面実装形
半導体装置の一例の実装用基板実装時の断面図で
ある。 1……封止部、2……外部リードの平坦部、3
……外部リードの曲げ加工部、4……リード切断
部、5……接合材料、6……実装用基板。
Fig. 1 is a sectional view of one embodiment of the present invention when mounted on a mounting board, Fig. 2 is a sectional view of another embodiment of the present invention when mounted on a mounting board, and Fig. 3 is a conventional surface mount type. FIG. 2 is a cross-sectional view of an example of a semiconductor device when it is mounted on a mounting board. 1...Sealing part, 2...Flat part of external lead, 3
. . . External lead bending section, 4 . . . Lead cutting section, 5 . . . Bonding material, 6 . . . Mounting board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 封止部から導出された外部リードを有する表面
実装形半導体装置において、前記外部リードの先
端部を実装用基板の実装面に対して90°以上1
80°未満の範囲の角度に曲げ加工を施したこと
を特徴とする表面実装形半導体装置。
In a surface mount semiconductor device having an external lead led out from a sealing part, the tip of the external lead is set at an angle of 90° or more to the mounting surface of the mounting board.
A surface-mounted semiconductor device characterized by being bent at an angle of less than 80°.
JP13324389U 1989-11-15 1989-11-15 Pending JPH0371654U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13324389U JPH0371654U (en) 1989-11-15 1989-11-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13324389U JPH0371654U (en) 1989-11-15 1989-11-15

Publications (1)

Publication Number Publication Date
JPH0371654U true JPH0371654U (en) 1991-07-19

Family

ID=31680653

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13324389U Pending JPH0371654U (en) 1989-11-15 1989-11-15

Country Status (1)

Country Link
JP (1) JPH0371654U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007187199A (en) * 2006-01-11 2007-07-26 Chugoku Electric Power Co Inc:The Rotation preventive structure of fastening member
JP2013535807A (en) * 2010-07-06 2013-09-12 フェニックス コンタクト ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフト Connecting member

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007187199A (en) * 2006-01-11 2007-07-26 Chugoku Electric Power Co Inc:The Rotation preventive structure of fastening member
JP4566133B2 (en) * 2006-01-11 2010-10-20 中国電力株式会社 Anti-rotation structure for fastening members
JP2013535807A (en) * 2010-07-06 2013-09-12 フェニックス コンタクト ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフト Connecting member

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