JPH0370932B2 - - Google Patents
Info
- Publication number
- JPH0370932B2 JPH0370932B2 JP59139275A JP13927584A JPH0370932B2 JP H0370932 B2 JPH0370932 B2 JP H0370932B2 JP 59139275 A JP59139275 A JP 59139275A JP 13927584 A JP13927584 A JP 13927584A JP H0370932 B2 JPH0370932 B2 JP H0370932B2
- Authority
- JP
- Japan
- Prior art keywords
- case member
- parts
- electronic components
- case
- connecting part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003860 storage Methods 0.000 claims description 24
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 4
- 238000007789 sealing Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1028—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being held between spring terminals
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59139275A JPS6119208A (ja) | 1984-07-05 | 1984-07-05 | 密封型電子部品の製造方法及びそれに使用される多連ケ−ス部材 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59139275A JPS6119208A (ja) | 1984-07-05 | 1984-07-05 | 密封型電子部品の製造方法及びそれに使用される多連ケ−ス部材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6119208A JPS6119208A (ja) | 1986-01-28 |
JPH0370932B2 true JPH0370932B2 (ko) | 1991-11-11 |
Family
ID=15241487
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59139275A Granted JPS6119208A (ja) | 1984-07-05 | 1984-07-05 | 密封型電子部品の製造方法及びそれに使用される多連ケ−ス部材 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6119208A (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62141214U (ko) * | 1986-02-27 | 1987-09-05 | ||
EP0341531A3 (de) * | 1988-05-11 | 1991-05-15 | Licentia Patent-Verwaltungs-GmbH | Regelbarer Breitbandverstärker |
JPH0693698A (ja) * | 1992-09-14 | 1994-04-05 | Ryoji Nomoto | 壁面用タイルの施工方法及び固定金具 |
-
1984
- 1984-07-05 JP JP59139275A patent/JPS6119208A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6119208A (ja) | 1986-01-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |