JPH0368535B2 - - Google Patents

Info

Publication number
JPH0368535B2
JPH0368535B2 JP61101599A JP10159986A JPH0368535B2 JP H0368535 B2 JPH0368535 B2 JP H0368535B2 JP 61101599 A JP61101599 A JP 61101599A JP 10159986 A JP10159986 A JP 10159986A JP H0368535 B2 JPH0368535 B2 JP H0368535B2
Authority
JP
Japan
Prior art keywords
slug
glass sleeve
lead
glass
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61101599A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62257752A (ja
Inventor
Kenzo Senba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kansai Nippon Electric Co Ltd
Original Assignee
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kansai Nippon Electric Co Ltd filed Critical Kansai Nippon Electric Co Ltd
Priority to JP61101599A priority Critical patent/JPS62257752A/ja
Publication of JPS62257752A publication Critical patent/JPS62257752A/ja
Publication of JPH0368535B2 publication Critical patent/JPH0368535B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
JP61101599A 1986-04-30 1986-04-30 半導体装置の製造方法 Granted JPS62257752A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61101599A JPS62257752A (ja) 1986-04-30 1986-04-30 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61101599A JPS62257752A (ja) 1986-04-30 1986-04-30 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS62257752A JPS62257752A (ja) 1987-11-10
JPH0368535B2 true JPH0368535B2 (enExample) 1991-10-28

Family

ID=14304852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61101599A Granted JPS62257752A (ja) 1986-04-30 1986-04-30 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS62257752A (enExample)

Also Published As

Publication number Publication date
JPS62257752A (ja) 1987-11-10

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