JPS62257752A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS62257752A JPS62257752A JP61101599A JP10159986A JPS62257752A JP S62257752 A JPS62257752 A JP S62257752A JP 61101599 A JP61101599 A JP 61101599A JP 10159986 A JP10159986 A JP 10159986A JP S62257752 A JPS62257752 A JP S62257752A
- Authority
- JP
- Japan
- Prior art keywords
- slags
- glass sleeve
- lead frame
- slug
- sleeves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W70/427—
-
- H10W72/00—
Landscapes
- Led Device Packages (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61101599A JPS62257752A (ja) | 1986-04-30 | 1986-04-30 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61101599A JPS62257752A (ja) | 1986-04-30 | 1986-04-30 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62257752A true JPS62257752A (ja) | 1987-11-10 |
| JPH0368535B2 JPH0368535B2 (enExample) | 1991-10-28 |
Family
ID=14304852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61101599A Granted JPS62257752A (ja) | 1986-04-30 | 1986-04-30 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62257752A (enExample) |
-
1986
- 1986-04-30 JP JP61101599A patent/JPS62257752A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0368535B2 (enExample) | 1991-10-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS62257752A (ja) | 半導体装置の製造方法 | |
| CN109003971A (zh) | 用于光电器件的外壳及其生产方法、以及用于外壳的盖 | |
| US3753054A (en) | Hermetically sealed electronic package | |
| JPS598471B2 (ja) | 吸熱マウントの製法 | |
| US4322599A (en) | Apparatus for resistance welding of an electro-optic device housing | |
| IE55418B1 (en) | Diaphragm forming | |
| JPH0331241B2 (enExample) | ||
| JP2615081B2 (ja) | 縦型熱処理炉 | |
| JPH027453A (ja) | ガラスキャップ法 | |
| JPS6321111Y2 (enExample) | ||
| JPH07146195A (ja) | 圧力センサの製造方法 | |
| KR830002462Y1 (ko) | 기밀단자(氣密端子) | |
| JPS61251161A (ja) | Dhdダイオ−ドの製造方法 | |
| JPS58210641A (ja) | 小型電子部品の製造法 | |
| JPS6062142A (ja) | ガラス・ダイオ−ドの製造方法 | |
| KR920006850Y1 (ko) | 음극선관 봉입장치 | |
| JPH10309750A (ja) | 容器及びその口部並びに口部の溶着方法及びその溶着金型 | |
| KR100448928B1 (ko) | 테이프 마운트 설비의 센터 테이블 프레임 가열장치 | |
| KR200294478Y1 (ko) | 침구용 원적외선 방사부재의 부착구조 | |
| JPH0480948A (ja) | 半導体製造装置 | |
| JPS6260244A (ja) | 半導体装置の封止方法及び装置 | |
| JPS63226948A (ja) | 混成集積装置 | |
| JPS58100436A (ja) | 半導体装置の製造方法 | |
| JPH09169529A (ja) | ガラスセルの製造方法とその装置 | |
| JPS62148828A (ja) | 半導体圧力センサ |