JPH0368330B2 - - Google Patents

Info

Publication number
JPH0368330B2
JPH0368330B2 JP23456582A JP23456582A JPH0368330B2 JP H0368330 B2 JPH0368330 B2 JP H0368330B2 JP 23456582 A JP23456582 A JP 23456582A JP 23456582 A JP23456582 A JP 23456582A JP H0368330 B2 JPH0368330 B2 JP H0368330B2
Authority
JP
Japan
Prior art keywords
suction cup
semiconductor wafer
pressure sensor
sample
adsorption
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP23456582A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59122922A (ja
Inventor
Kunyoshi Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP23456582A priority Critical patent/JPS59122922A/ja
Publication of JPS59122922A publication Critical patent/JPS59122922A/ja
Publication of JPH0368330B2 publication Critical patent/JPH0368330B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/0061Force sensors associated with industrial machines or actuators
    • G01L5/0076Force sensors associated with manufacturing machines
    • G01L5/009Force sensors associated with material gripping devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP23456582A 1982-12-28 1982-12-28 半導体ウエハの吸着度測定装置 Granted JPS59122922A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23456582A JPS59122922A (ja) 1982-12-28 1982-12-28 半導体ウエハの吸着度測定装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23456582A JPS59122922A (ja) 1982-12-28 1982-12-28 半導体ウエハの吸着度測定装置

Publications (2)

Publication Number Publication Date
JPS59122922A JPS59122922A (ja) 1984-07-16
JPH0368330B2 true JPH0368330B2 (enrdf_load_stackoverflow) 1991-10-28

Family

ID=16973002

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23456582A Granted JPS59122922A (ja) 1982-12-28 1982-12-28 半導体ウエハの吸着度測定装置

Country Status (1)

Country Link
JP (1) JPS59122922A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04206546A (ja) * 1990-11-30 1992-07-28 Hitachi Ltd プラズマ処理方法および装置
JP2891160B2 (ja) * 1995-05-02 1999-05-17 日新電機株式会社 真空処理装置及び該装置により目的処理物を得る方法
KR101362673B1 (ko) * 2006-11-03 2014-02-12 엘아이지에이디피 주식회사 정전력 측정장치 및 이를 이용한 정전력 측정방법

Also Published As

Publication number Publication date
JPS59122922A (ja) 1984-07-16

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