JPH0367988B2 - - Google Patents

Info

Publication number
JPH0367988B2
JPH0367988B2 JP61316143A JP31614386A JPH0367988B2 JP H0367988 B2 JPH0367988 B2 JP H0367988B2 JP 61316143 A JP61316143 A JP 61316143A JP 31614386 A JP31614386 A JP 31614386A JP H0367988 B2 JPH0367988 B2 JP H0367988B2
Authority
JP
Japan
Prior art keywords
copper
alumina substrate
copper plate
alumina
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61316143A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63166774A (ja
Inventor
Naoyuki Kanehara
Masahiro Furo
Tetsuo Kohata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Holdings Co Ltd
Original Assignee
Dowa Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Mining Co Ltd filed Critical Dowa Mining Co Ltd
Priority to JP61316143A priority Critical patent/JPS63166774A/ja
Priority to US07/126,601 priority patent/US4811893A/en
Publication of JPS63166774A publication Critical patent/JPS63166774A/ja
Publication of JPH0367988B2 publication Critical patent/JPH0367988B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
    • C04B2235/6562—Heating rate
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658—Atmosphere during thermal treatment
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658—Atmosphere during thermal treatment
    • C04B2235/6583—Oxygen containing atmosphere, e.g. with changing oxygen pressures
    • C04B2235/6585—Oxygen containing atmosphere, e.g. with changing oxygen pressures at an oxygen percentage above that of air
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/407—Copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/52—Pre-treatment of the joining surfaces, e.g. cleaning, machining
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/706—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the metallic layers or articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Products (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP61316143A 1986-12-27 1986-12-27 銅板とアルミナ基板との接合体の製造方法 Granted JPS63166774A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP61316143A JPS63166774A (ja) 1986-12-27 1986-12-27 銅板とアルミナ基板との接合体の製造方法
US07/126,601 US4811893A (en) 1986-12-27 1987-11-30 Method for bonding copper plate to alumina substrate and process for producing copper/alumina bonded assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61316143A JPS63166774A (ja) 1986-12-27 1986-12-27 銅板とアルミナ基板との接合体の製造方法

Publications (2)

Publication Number Publication Date
JPS63166774A JPS63166774A (ja) 1988-07-09
JPH0367988B2 true JPH0367988B2 (enExample) 1991-10-24

Family

ID=18073740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61316143A Granted JPS63166774A (ja) 1986-12-27 1986-12-27 銅板とアルミナ基板との接合体の製造方法

Country Status (2)

Country Link
US (1) US4811893A (enExample)
JP (1) JPS63166774A (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01272183A (ja) * 1988-04-25 1989-10-31 Toshiba Corp セラミックス回路基板
JPH07502B2 (ja) * 1989-03-01 1995-01-11 同和鉱業株式会社 非酸化物系セラミックスのメタライズ方法
US4996116A (en) * 1989-12-21 1991-02-26 General Electric Company Enhanced direct bond structure
US5090651A (en) * 1990-01-31 1992-02-25 Electrovert Ltd. Gas curtain additives and zoned tunnel for soldering
US5111277A (en) * 1991-03-29 1992-05-05 Aegis, Inc. Surface mount device with high thermal conductivity
US5188985A (en) * 1991-03-29 1993-02-23 Aegis, Inc. Surface mount device with high thermal conductivity
JP3450023B2 (ja) * 1992-01-24 2003-09-22 日本碍子株式会社 金属・セラミックス接合体およびそれを使用した金属セラミックス複合構造体とその製造方法
CA2140311A1 (en) * 1994-01-14 1995-07-15 Joseph P. Mennucci Multilayer laminate product and process
US5777259A (en) * 1994-01-14 1998-07-07 Brush Wellman Inc. Heat exchanger assembly and method for making the same
US6022426A (en) * 1995-05-31 2000-02-08 Brush Wellman Inc. Multilayer laminate process
JP3890539B2 (ja) * 1996-04-12 2007-03-07 Ｄｏｗａホールディングス株式会社 セラミックス−金属複合回路基板
US6699571B1 (en) 2002-03-27 2004-03-02 Morgan Advanced Ceramics, Inc. Devices and methods for mounting components of electronic circuitry
JP2004350479A (ja) * 2003-05-26 2004-12-09 Hitachi Powdered Metals Co Ltd 熱電変換発電ユニットおよびこの熱電変換発電ユニットを備えるトンネル型炉
US20070231590A1 (en) * 2006-03-31 2007-10-04 Stellar Industries Corp. Method of Bonding Metals to Ceramics
EP4382503A4 (en) 2021-08-03 2025-07-30 Kyocera Corp CERAMIC SINTERED BODY, CERAMIC SUBSTRATE, MOUNTING SUBSTRATE, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING CERAMIC SINTERED BODY
CN119462193B (zh) * 2024-10-09 2025-06-13 江苏富乐华半导体科技股份有限公司 一种解决dcb铜岛间绝缘性不良的方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB761045A (en) * 1952-08-29 1956-11-07 Lodge Plugs Ltd Improvements in or relating to the bonding of ceramics with copper
NL153508B (nl) * 1966-11-30 1977-06-15 Philips Nv Werkwijze voor het vacuuemdicht verbinden van een keramisch voorwerp met een metalen voorwerp en elektrische ontladingsbuis voorzien van een stroomtoevoergeleider verkregen volgens die werkwijze.
US4050956A (en) * 1970-02-20 1977-09-27 Commonwealth Scientific And Industrial Research Organization Chemical bonding of metals to ceramic materials
US4032058A (en) * 1973-06-29 1977-06-28 Ibm Corporation Beam-lead integrated circuit structure and method for making the same including automatic registration of beam-leads with corresponding dielectric substrate leads
US4129243A (en) * 1975-07-30 1978-12-12 General Electric Company Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof
US3994430A (en) * 1975-07-30 1976-11-30 General Electric Company Direct bonding of metals to ceramics and metals
JPS61220836A (ja) * 1985-03-28 1986-10-01 株式会社東芝 セラミツクス回路基板

Also Published As

Publication number Publication date
US4811893A (en) 1989-03-14
JPS63166774A (ja) 1988-07-09

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