JPH0367273B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a transparent pattern electrode on an insulating substrate used in an electro-optical display element such as a liquid crystal display. The present invention also relates to a method for manufacturing transparent pattern electrodes that facilitate connection with circuit elements such as IC chips.

Traditionally, tin oxide and indium oxide have been widely used as materials for transparent pattern electrodes, but since it is not possible to directly connect bonding wires to transparent electrodes made of such materials, electrical connections are made using connectors. I was making a connection.

However, recently, transparent electrode patterns have become more complex.
In addition, there is a trend toward higher density, and it has been desired to directly connect circuit elements to patterned electrodes.

Therefore, the present invention was devised in order to solve such problems, and it is a transparent pattern in which the lead portion drawn out from the transparent pattern electrode is formed of metal to enable bonding and soldering. The present invention provides a method for manufacturing an electrode.

Next, to explain the manufacturing method of the transparent pattern electrode of the present invention in the order of steps, as shown in FIG. Metal thin film that is transparent and conductive after oxidation 2
(C) This metal thin film 2 is irradiated with a laser beam or an electron beam in a negative pattern to remove unnecessary parts and remove part of the characters or figures. (D) The remaining metal thin film 2 is coated with a resist material 4 on the part that will be oxidized to become a transparent electrode. (E ) Gold plating 5 on the uncoated metal thin film 2
(F) After removing the resist material 4, (G) heating to a high temperature in an oxidizing atmosphere such as oxygen to oxidize the metal thin film 2 and form the transparent electrode 6. At this time, the part to which the gold plating 5 has been applied is not oxidized and remains the gold-plated metal.

The wavelength of the laser beam 3 irradiated to remove the transparent and conductive metal thin film 2 after oxidation includes:
It is sufficient to select a wavelength that is easily absorbed by the metal thin film 2. Also, as a device for irradiating the laser beam 3 in a negative pattern, a device that operates on the same principle as a laser printer, which is known as an output device for electronic computers, can be used. As shown in FIG. 2, while the laser beam 3 from the laser light source 10 is swept by the rotating mirror 11 onto the metal thin film 2 of the substrate 1 moving at a constant speed, the pattern signal generator 12
This can be carried out by modulating the laser beam 3 with a pattern signal from the .

Further, when performing the deletion process using an electron beam, it can be easily carried out using the same principle as the deflection and modulation of the electron beam in a cathode ray tube.

Laser beams can obtain high energy density by focusing, and electron beams can obtain high energy density by focusing and accelerating, so if the pattern electrode removal process is performed using laser beams or electron beams. The shape and deletion width of the patterned electrode can be easily controlled, and highly accurate patterned electrodes can be produced in a short time and with less energy.

Gold plating is easy when tin is used as the transparent and conductive metal thin film 2 after oxidation, but when indium is used, it is difficult to directly gold plate the indium, so first copper plating is applied to the indium. , and then gilding it.

In the embodiment described above, gold plating is performed after the process of removing the metal thin film 2 in a negative pattern using the laser beam 3, but the parts to be gold plated are first plated with gold. ,
Negative pattern deletion can then be carried out using a laser beam.

According to the method for manufacturing a transparent pattern electrode of this invention,
Since the electrode with the lead part plated with gold can be easily obtained without the need for post-processing, bonding and soldering are possible. For example, as shown in FIG. Glue the IC chip 8 to the
The substrate 1 having the transparent pattern electrode can be used like a printed wiring board so that the IC chip 8 and the transparent pattern electrode 6 can be directly connected.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view showing an example of the manufacturing method of a transparent pattern electrode of the present invention in the order of steps, FIG. 2 is a schematic diagram showing an example of a laser beam irradiation device used in the manufacturing method of the present invention, and FIG. FIG. 2 is a cross-sectional view showing an example of a usage state of a transparent pattern electrode made by the manufacturing method of the invention. 1...Transparent substrate (glass substrate), 2...Metal thin film that is transparent and conductive after oxidation, 5...Plated gold.

Claims (1)

[Claims] 1. A first step of forming a transparent and conductive metal thin film after oxidation on a transparent substrate, and removing an unnecessary part of the metal thin film to form a segment that forms part of a character or figure and a segment that is connected to the segment. a second step of forming the lead portion into a pattern; a third step of applying gold plating to a portion of the lead portion that is far from the segment; and a third step of forming the metal thin film including the gold-plated portion. A method for manufacturing a transparent pattern electrode, comprising a fourth step of exposing it to an oxidizing atmosphere at a high temperature.