JPS60182751A - Formation of wiring pattern of circuit board - Google Patents

Abstract

PURPOSE:To rapidly produce wiring patterns of micro-pitch by a method wherein necessary wirings are cut by cutting an electrode pattern after a mounting component having a plurality of terminals is connected to the electrode pattern of flat plate form. CONSTITUTION:A plurality of wiring patterns 3 are formed on a circuit board 1: in use of the patterns as the electrode apttern, the mounting component 2 is arranged and a flat plate terminal electrode 8 of copper foil form is formed at the connection part of the board 1. Next, electrode tips 10a of a flexible multi- core cable 9 are placed on the terminal electrode 8 and soldered. Then, the electrode 8 is cut by laser irradiation by excluding terminal electrode sections 12 combining the tips 3a of the pattern 3 with the tips 10a of the cable 9. As a result, the patterns 3 of the board 1 are joined 12 to the electrodes of the flexible multi-core cable 9 and separated from other patterns. This construction facilitates the junction between the terminal of the mounting component and the terminal to be connected and enables rapid formation of wiring patterns of micro- pitch with high reliability.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a method for forming a wiring pattern on a circuit board, and particularly to a method for forming a wiring pattern on a circuit board. The present invention relates to a method of forming a wiring pattern on a circuit board, which comprises connecting the terminal and the flat electrode backing and then separating the required wiring pattern.

[Prior art]

Conventional 9 Circuit board 2 For example, a resistor on a printed circuit board.

When mounting chips such as capacitors or integrated circuits, a predetermined wiring pattern is formed on the printed circuit board in advance,
A method of connecting electrode patterns is known, in which the above-mentioned mounting component terminals are inserted into the holes of the pattern η111 and soldering is performed, or chips for built-up circuits are connected by punching or crimping.

When using this type of connection method, the number of terminals on the mounted component is very large, and the pinch between the terminals is extremely small, so there is a one-to-one correspondence between the electrode pattern formed on the circuit board and the electrode pattern of the mounted component. A slight misalignment may occur, causing heat generation and poor bonding at the joint, which is harmful.

In order to eliminate such disadvantages, the present inventor previously proposed the following connection method as a method for joining multiple terminals of a mounted component and an electrode pattern.

[Problems with conventional technology]

FIG. 1 is a plan view showing a method of joining an electrode pattern and a terminal of a mounted component according to the prior art. In FIG. Output electrodes 3 for the chi-knob 2 are patterned on the circuit board, and the output electrodes 3 are connected to the electrodes 5 of the display panel 4 in one-to-one correspondence, for example. In this state, a thin metal plate 6 is brought into close contact between the output electrode 3 and the electrode 5 of the display panel 4, as shown by dotted lines, so as to straddle each other and soldered.

We proposed a connection method in which a carbon dioxide gas laser or a Y to G laser or the like is used to cut the metal plate in a direction perpendicular to the longitudinal direction to bring the electrodes disposed in parallel to each other into a non-conducting state.

According to this connection method, it is possible to propose a joining method that does not cause misalignment between the terminals of a plurality of mounted components and the electrode patterns that are connected patterns during bonding as described in the prior art. There is a problem in that the number of steps for closely bonding the terminal 5 and the terminal 5 to be connected increases.

[Object of the Invention] In view of the above-mentioned drawbacks, the present invention has been developed to facilitate close bonding between the terminals of mounted components and connected terminals, to achieve high-density, high-reliability bonding, and to meet the user's requirements for minutely pinched wiring patterns. It is an object of the present invention to provide a method for forming wiring patterns on circuit boards that can be quickly formed into any desired shape.

[Structure of the invention]

The above-mentioned object of the present invention is to form a plurality of wiring patterns on a circuit board, and when using the wiring patterns as electrode patterns, to form the electrode patterns into flat electrode patterns in advance,
Wiring pattern formation for a circuit board, characterized in that after connecting a mounting component having one or more terminals to the flat electrode, the flat electrode pattern is cut to create a non-conducting state between necessary wirings. This is achieved by providing a method.

[Embodiments of the invention]

An embodiment of the present invention will be described in detail below with reference to the drawings.

Figure 2 (al, (b), (cl) is a plan view of a circuit board showing the principle of the wiring pattern forming process of the circuit board of the present invention. Figure 2 (a) is a circuit board 1 mounted on a printed circuit board. Part 2 is arranged and pattern 3 is formed.

Multiple electrodes 10 of flexible multicore cable 9 (usually 0.
2~0.6i+n pitch) and pattern 3 of the above circuit board
A terminal electrode 8 is formed in the shape of a hemlock at the joint portion of the circuit board in order to connect the circuit board. The terminal electrode is formed of a copper foil-like conductive member similar to pattern 3. The next step is the second
As shown in FIG. 1, the electrode tip 10a of the electrode 10 of the flexible multicore cable 9 is placed on the terminal electrode 8 of the circuit board 1, and soldering is performed, for example.

The next step is to connect the electrode tip 10a of the flexible multi-core cable 9 with a potential of 10 to 0 of the circuit board 1 as shown in FIG.
111 non-electrode 8''2 is grounded and soldering (=J) is performed, for example.

The next step is pattern 3 of the circuit board as shown in Figure 2 (C1).
') tit 3 a and flexible multi-core cable 9
G to Y except for the terminal electrode part 12 connecting with the tip 10a of
By irradiating the laser and cutting off the M'i:l end electrode 8 and performing step 11, the pattern 3 of the circuit board 1 and the electrode of the cross-pull multicore cable 9 are joined 12 and separated from other patterns. It can be in a non-conductive state. The laser for separating the terminal electrode used in the above example is YA,
In addition to the G laser, a carbon dioxide laser, an electron beam, etc. can be used.

FIG. 3 shows an example of this, in which 13 is an XY stage, 14. Y, 14X is a motor for moving the XY stage in the Y-axis and The terminal electrode 8 is burned out by the energy beam from the irradiation source 15. The pitch and moving distance for moving the XY stage 13 are set in advance according to the user's design criteria (/1).
By setting 1 and Q described in 6, it is possible to perform the cutting process at extremely high speed.

FIG. 4 (Ill (bl (Cl) indicates still another embodiment of the present invention, in which an integrated circuit chip mounted on a Heemley F-type chip or a film carrier is mounted on a circuit board made of ceramic or the like. FIG. 3 is a plan view showing the manufacturing process.

In FIG. 4 (Fl), reference numeral 17 denotes a ceramic circuit board, which forms a circuit pattern 18 for appropriately connecting the integrated circuit chip mounted on the board, and also forms a circuit pattern 18 for appropriately connecting the integrated circuit chips mounted on the board.
a square-shaped solid flat plate electrode portion 19a in contact with ゛;
A plurality of terminal electrodes 21a of 4A integrated circuit chips 20a, 2Qb are formed, and integrated circuit chips 20a, 201) are arranged in the flat plate electrode portions 19a, 19b in the shape of a hemlock as shown in FIG. 4(b). 21b to the above plate electrode 19a,
19b and heat-bond it all at once. Next, as shown in FIG. 4 fc), cutting Rli L 2 s is performed using the above-mentioned laser beam according to a desired wiring pattern.

This allows the integrated circuit 20a to be integrated within the circuit board.

20b are mutually parcooned to form the desired terminal type (French 21
A and 21b will be connected. In the above embodiment, an example was explained in which a beam lead type chip or the like was used as an integrated circuit chip as a mounting component, but it is also applicable to various types such as a conventional DIP dip carrier, a flip chip, etc. It is also applicable to forming further specific wiring patterns.

In other words, if there is a possibility that the wiring part may change depending on the user's requirements, only that part is made into a solid conductive pattern, and this part is cut with a laser to create a pattern that meets the user's requirements. You can do as you like.

In addition, in the above embodiments, as a means for separating the electrodes, Rayleigh' or an electronic beam was used as a means for separating the electrodes, but it is also possible to use a machine such as cutting with a diamond cutter or a machine that forms a pattern by ejecting Sun IS blast from above the pattern mask. The non-conductive portion may be separated by a conventional method, or by applying a photoresist and then chemically etching it by photolithography.

〔Effect of the invention〕

As explained above, according to the present invention, there is no misalignment or poor connection in joining between patterned electrodes and electrodes to be connected arranged in a small pinch, and a metal flat plate can be cut and crimped or pressure-bonded. Since this is not necessary, the process can be simplified, complexity can be eliminated, and the connection of corresponding electrodes on a one-to-one basis can be made more reliable.

[Brief explanation of drawings]

Fig. 1 is a plan view of a circuit board showing a conventional circuit board wiring pattern forming method, and Fig. 2 is a plan view of a circuit board showing a conventional method for forming wiring patterns on a circuit board.
el is a plan view showing a circuit board and a flexible multicore cable to be connected, showing the method of forming a wiring pattern of a circuit board of the present invention, and FIG. An example of the equipment used to separate the bridges is shown in the route map, Figure 4 (al (b) (
cl is a plan view showing a circuit board and a connected object (IC chip) showing another embodiment of the method for forming a wiring pattern on a circuit board according to the present invention. ■...Circuit board, 2...chip/7p. 3.5... Electrode, 4... Display board. 6...Metal plate, 7...Cutting part. 8... Solid terminal electrode, 9... Flexible multicore cable, 10... Flexible multicore cable electrode 2, 11... Separated portion, 12... Joined portion. 13...XY stage, 14. X, 14Y...Motor, 15...Energy ray irradiation source, 16...Computer. 17... Circuit board, 18... Circuit pattern, 1
9a, 19b... solid flat plate electrode portion, 20a, 20
b... Length product circuit chip (a) Figure 1 (C) Figure 2 Figure 4 Figure 8

Claims (1)

[Scope of Claims] A plurality of wiring patterns are formed on a circuit board, and when the wiring patterns are used as electrode patterns, the electrode patterns are previously formed into flat electrode patterns. Wiring pattern formation for a circuit board, characterized in that after connecting a mounting component having one or more terminals to the flat electrode, the flat electrode pattern is cut to create a non-conducting state between necessary wirings. Method.