JPH036662B2 - - Google Patents
Info
- Publication number
- JPH036662B2 JPH036662B2 JP20925581A JP20925581A JPH036662B2 JP H036662 B2 JPH036662 B2 JP H036662B2 JP 20925581 A JP20925581 A JP 20925581A JP 20925581 A JP20925581 A JP 20925581A JP H036662 B2 JPH036662 B2 JP H036662B2
- Authority
- JP
- Japan
- Prior art keywords
- sleeve
- lead wire
- header
- electrodes
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Details Of Resistors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20925581A JPS58111348A (ja) | 1981-12-25 | 1981-12-25 | 電子部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20925581A JPS58111348A (ja) | 1981-12-25 | 1981-12-25 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58111348A JPS58111348A (ja) | 1983-07-02 |
JPH036662B2 true JPH036662B2 (en, 2012) | 1991-01-30 |
Family
ID=16569922
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20925581A Granted JPS58111348A (ja) | 1981-12-25 | 1981-12-25 | 電子部品 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58111348A (en, 2012) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01185954A (ja) * | 1988-01-20 | 1989-07-25 | Nec Corp | リードレスダイオード |
-
1981
- 1981-12-25 JP JP20925581A patent/JPS58111348A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58111348A (ja) | 1983-07-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0245969A (ja) | 半導体装置の製造方法 | |
JPH01238148A (ja) | 半導体装置 | |
JPH0332912B2 (en, 2012) | ||
JP3356649B2 (ja) | 半導体装置及びその製造方法 | |
GB2123609A (en) | Termination of hermetically sealed glass-encapsulated ceramic capacitors | |
JP4557804B2 (ja) | 半導体装置及びその製造方法 | |
JPH036662B2 (en, 2012) | ||
JP2001060759A (ja) | 電子部品のボール端子接続構造 | |
JP5036280B2 (ja) | 気密端子およびその製造方法 | |
KR900002119B1 (ko) | 반도체 장치 및 그 보호외피의 조립방법 | |
KR100659534B1 (ko) | 반도체 장치를 밀폐형으로 밀봉하는 밀봉 링과 그것을사용한 반도체 장치의 제조 방법 | |
JP3325755B2 (ja) | 半導体装置及びその実装方法、並びにその実装部の検査方法 | |
JPS5828859A (ja) | リ−ドレスガラス封止ダイオ−ド | |
JP2748180B2 (ja) | 集積回路パッケージの製造法 | |
JPH03177033A (ja) | 半導体装置及び半導体装置の製造方法 | |
JP2577315B2 (ja) | 口金付管球 | |
JP3942596B2 (ja) | 半導体装置の実装方法及び半導体装置のリペア方法 | |
JP2918676B2 (ja) | 気密封止用ステムの製造方法 | |
JPH0572751B2 (en, 2012) | ||
JPH0883662A (ja) | スーパーマイクロコネクタの製造方法 | |
US4196309A (en) | Semiconductor device subassembly and manufacture thereof | |
JPH0442933Y2 (en, 2012) | ||
JPS6225899Y2 (en, 2012) | ||
JPS5842764A (ja) | メツキ方法 | |
JPS60113934A (ja) | 半導体装置 |