JPH0365895B2 - - Google Patents

Info

Publication number
JPH0365895B2
JPH0365895B2 JP59262904A JP26290484A JPH0365895B2 JP H0365895 B2 JPH0365895 B2 JP H0365895B2 JP 59262904 A JP59262904 A JP 59262904A JP 26290484 A JP26290484 A JP 26290484A JP H0365895 B2 JPH0365895 B2 JP H0365895B2
Authority
JP
Japan
Prior art keywords
solder
integrated circuit
semiconductor substrate
substrate
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59262904A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61141146A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP59262904A priority Critical patent/JPS61141146A/ja
Publication of JPS61141146A publication Critical patent/JPS61141146A/ja
Publication of JPH0365895B2 publication Critical patent/JPH0365895B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Wire Bonding (AREA)
JP59262904A 1984-12-14 1984-12-14 集積回路装置 Granted JPS61141146A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59262904A JPS61141146A (ja) 1984-12-14 1984-12-14 集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59262904A JPS61141146A (ja) 1984-12-14 1984-12-14 集積回路装置

Publications (2)

Publication Number Publication Date
JPS61141146A JPS61141146A (ja) 1986-06-28
JPH0365895B2 true JPH0365895B2 (cg-RX-API-DMAC7.html) 1991-10-15

Family

ID=17382217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59262904A Granted JPS61141146A (ja) 1984-12-14 1984-12-14 集積回路装置

Country Status (1)

Country Link
JP (1) JPS61141146A (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6230520B2 (ja) 2014-10-29 2017-11-15 キヤノン株式会社 プリント回路板及び電子機器

Also Published As

Publication number Publication date
JPS61141146A (ja) 1986-06-28

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