JPS61141146A - 集積回路装置 - Google Patents

集積回路装置

Info

Publication number
JPS61141146A
JPS61141146A JP59262904A JP26290484A JPS61141146A JP S61141146 A JPS61141146 A JP S61141146A JP 59262904 A JP59262904 A JP 59262904A JP 26290484 A JP26290484 A JP 26290484A JP S61141146 A JPS61141146 A JP S61141146A
Authority
JP
Japan
Prior art keywords
substrate
solder
integrated circuit
semiconductor substrate
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59262904A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0365895B2 (cg-RX-API-DMAC7.html
Inventor
Yasutoshi Kurihara
保敏 栗原
Mamoru Sawahata
沢畠　守
Koichi Inoue
井上　広一
Komei Yatsuno
八野　耕明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59262904A priority Critical patent/JPS61141146A/ja
Publication of JPS61141146A publication Critical patent/JPS61141146A/ja
Publication of JPH0365895B2 publication Critical patent/JPH0365895B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Wire Bonding (AREA)
JP59262904A 1984-12-14 1984-12-14 集積回路装置 Granted JPS61141146A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59262904A JPS61141146A (ja) 1984-12-14 1984-12-14 集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59262904A JPS61141146A (ja) 1984-12-14 1984-12-14 集積回路装置

Publications (2)

Publication Number Publication Date
JPS61141146A true JPS61141146A (ja) 1986-06-28
JPH0365895B2 JPH0365895B2 (cg-RX-API-DMAC7.html) 1991-10-15

Family

ID=17382217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59262904A Granted JPS61141146A (ja) 1984-12-14 1984-12-14 集積回路装置

Country Status (1)

Country Link
JP (1) JPS61141146A (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016092033A (ja) * 2014-10-29 2016-05-23 キヤノン株式会社 プリント回路板及び電子機器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016092033A (ja) * 2014-10-29 2016-05-23 キヤノン株式会社 プリント回路板及び電子機器
US9960109B2 (en) 2014-10-29 2018-05-01 Canon Kabushiki Kaisha Printed circuit board and electronic equipment

Also Published As

Publication number Publication date
JPH0365895B2 (cg-RX-API-DMAC7.html) 1991-10-15

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