JPH0364433A - Fe-ni series alloy for lead frame - Google Patents
Fe-ni series alloy for lead frameInfo
- Publication number
- JPH0364433A JPH0364433A JP20093889A JP20093889A JPH0364433A JP H0364433 A JPH0364433 A JP H0364433A JP 20093889 A JP20093889 A JP 20093889A JP 20093889 A JP20093889 A JP 20093889A JP H0364433 A JPH0364433 A JP H0364433A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- nonmetallic inclusions
- peeling
- regulated
- series
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 27
- 239000000956 alloy Substances 0.000 title claims abstract description 27
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims abstract description 6
- 230000001105 regulatory effect Effects 0.000 claims abstract description 6
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 4
- 238000005530 etching Methods 0.000 abstract description 9
- 239000002184 metal Substances 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- 239000000463 material Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 3
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 238000003723 Smelting Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000005097 cold rolling Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000007670 refining Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005261 decarburization Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 150000003568 thioethers Chemical group 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体装置のリードフレーム用として使用さ
れるＦｅ−Ｎｉ系合金に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an Fe--Ni alloy used for lead frames of semiconductor devices.
一般に半導体を要素とする集積回路のリードフレーム材
は回路に電気信号を伝達し、また回路部の発熱をすみや
かに外部へ放出させるため、優れた電気伝導性と熱伝導
性が要求されるほか、加熱を伴う組立工程中の熱膨張差
による歪に起因する半導体チップの特性変動あるいはモ
ールドレジンとの密着性劣化を防ぐため、リードフレー
ム材には半導体チップあるいはモールドレジンと近似し
た熱膨張係数が必要とされている。」二記のような特性
を有する代表的な金属材料として、Ｆｅ−４２Ｎｉ合金
やＦ ｅ−５０Ｎ ｉ合金などの低熱膨張合金が従来か
ら広く使用されてきた。これらの合金は薄板状に仕上げ
た素材をプレスまたはエツチングにより、それぞれの形
状に加工された後、リードフレームの一部もしくは全面
にＡｕ、Ａｇ、Ｃｕ等のメツキが施され、Ａｇペースト
やＡｕ−８ｉ共品によるダイボンディングとＡ ｕ 、
Ａ ｌ ｆｔＩＪＩによるワイヤボンディングが行な
われている。In general, lead frame materials for integrated circuits that use semiconductors as elements transmit electrical signals to the circuit and quickly release heat from the circuit to the outside, so they are required to have excellent electrical and thermal conductivity. In order to prevent changes in the characteristics of the semiconductor chip or deterioration of adhesion with the mold resin due to distortion due to differences in thermal expansion during the assembly process that involves heating, the lead frame material must have a coefficient of thermal expansion similar to that of the semiconductor chip or mold resin. It is said that Low thermal expansion alloys such as Fe-42Ni alloy and Fe-50Ni alloy have been widely used as typical metal materials having the characteristics described in 2 above. These alloys are processed into the respective shape by pressing or etching the material finished into a thin plate shape, and then plating with Au, Ag, Cu, etc. is applied to a part or the entire surface of the lead frame, and then plated with Ag paste or Au- Die bonding and A u with 8i common products,
Wire bonding is performed using AlftIJI.
近年、半導体回路の高集積化に伴いリードフレームの形
状がより複雑になり、従来の打抜加工からフォトエツチ
ング加工へと移行する傾向にある。In recent years, as semiconductor circuits have become more highly integrated, the shapes of lead frames have become more complex, and there has been a trend toward a shift from conventional punching to photo-etching.
ところが、エツチング性については、特にＣ含有量によ
っても変動するので、本願発明の出願人は、特願平１−
３５４５８号において、Ｃ含有量が低いほどエツチング
性が良好でその傾向は、Ｃ′ｉＸか０．０１％以下で顕
著になることを開示した。However, since the etching properties vary depending on the C content, the applicant of the present invention
No. 35458 discloses that the lower the C content, the better the etching properties, and this tendency becomes noticeable when C'iX is 0.01% or less.
他方、従来のＦｅ−Ｎｉ系合金を薄板に仕上げた際に、
時として材料内部に空洞ができる、ふくれ現象が、また
この現象が材料表面に発生した場合は、はがれと称する
不具合が発生し、前述の熱伝導性を損なう原因やエツチ
ング時の腐食液が空洞に入り込み正常なエツチングがで
きなくなる問題があった。On the other hand, when a conventional Fe-Ni alloy is made into a thin plate,
Occasionally, cavities are formed inside the material, a blistering phenomenon.If this phenomenon occurs on the surface of the material, a defect called peeling occurs, which can cause the aforementioned loss of thermal conductivity, and corrosive liquid during etching may form cavities. There was a problem that the etching could not be performed properly due to the intrusion.
本発明の目的は、エツチング性に優れ、かつ上記ふくれ
やはがれの発生がないＦｅ−Ｎｉ系合金を提供すること
である。An object of the present invention is to provide an Fe--Ni alloy that has excellent etching properties and does not cause the above-mentioned blistering or peeling.
本発明者は、前述のような問題点を解決するべく、Ｆｅ
−Ｎｉ系合金を対象に種々検討した結果、ふくれまたは
はがれ現象は合金中に存在する非金属介在物が深く関与
していることを新規に見出したものである。より詳しく
は、主として冷間圧延と焼なましを繰り返して薄鋼帯に
仕」−げる工程において、硫化物系などの比較的延性の
大きい非金属介在物は圧延方向に長く伸びた扁平状の形
状になり、この際非金属介在物と基地との密着度が失わ
れて微細な隙間を生じ、これがふくれまたははがれの原
因になること、また硬くて脆い酸化物系の非金属介在物
は圧延方向へ連鎖状に伸びた形状になり、この際冷間加
工中に塑性変形することなく割れるか、もしくは基地と
非金属介在物の間に発生する剪断応力によって界面に空
洞が発生し、これがふくれまたははがれの原因になるこ
とを知見した。In order to solve the above-mentioned problems, the present inventors made Fe
As a result of various studies on Ni-based alloys, it has been newly discovered that nonmetallic inclusions present in the alloy are deeply involved in the blistering or peeling phenomenon. More specifically, in the process of forming thin steel strips by repeating cold rolling and annealing, relatively ductile nonmetallic inclusions such as sulfides form in flat shapes that extend in the rolling direction. At this time, the adhesion between the nonmetallic inclusions and the matrix is lost, creating minute gaps that cause blistering or peeling.Also, hard and brittle oxide-based nonmetallic inclusions The shape extends in a chain in the rolling direction, and at this time, it cracks without plastic deformation during cold working, or cavities are generated at the interface due to the shear stress generated between the matrix and the nonmetallic inclusions. It has been found that it causes blistering or peeling.
すなわち、本発明は、重量％でＮｉ３５〜６０％を含有
するリードフレーム用Ｆｅ−Ｎｉ系合金において、Ｍｎ
／Ｓｉ比を２．０以上に規制するとともに、Ｃ０．００
３−０，０１０％、Ｓ ０．００３％以下、Ｓｅ５
ｐｐｍ以下としたことを特徴とするリードフレーム用Ｆ
ｅＮｉ系合金である。That is, the present invention provides an Fe-Ni alloy for lead frames containing 35 to 60% Ni by weight.
/Si ratio is regulated to 2.0 or more, and C0.00
3-0,010%, S 0.003% or less, Se5
F for lead frames characterized by ppm or less
It is an eNi-based alloy.
次に本発明合金の成分限定理由について述べる。 Next, the reason for limiting the composition of the alloy of the present invention will be described.
Ｎｉは本発明合金の基本成分であり、Ｎｊが３５％未満
になると合金の熱膨張係数が低くなり過ぎ、封着椙料と
して不適となり、また逆にＮｊが６０％を−
越えると合金の熱膨張係数が高くなり過ぎ、やはり不適
となる。そのためにＮｉは３５〜６０％とした。Ni is a basic component of the alloy of the present invention, and if Nj is less than 35%, the thermal expansion coefficient of the alloy will be too low, making it unsuitable as a sealing agent. Conversely, if Nj exceeds 60%, the thermal expansion coefficient of the alloy will be too low. The expansion coefficient becomes too high, which is also unsuitable. For this purpose, Ni was set at 35 to 60%.
Ｍｎ／Ｓｉ比は本発明合金の目的である有害な非金属介
在物を抑制するうえで重要な要件である。The Mn/Si ratio is an important requirement for suppressing harmful nonmetallic inclusions, which is the purpose of the alloy of the present invention.
Ｍｎ／Ｓｉ比が２．０未満の場合、溶湯中の５ｉｎ２が
増加し、その結果、融点が高く硬質の５１０２−Ｍｎ０
−ＡＩ、０３系の非金属介在物がインゴット中に残留す
る。そのためにＭｎ／Ｓｉ比を２．０以上に限定する。When the Mn/Si ratio is less than 2.0, 5in2 in the molten metal increases, resulting in a high melting point and hard 5102-Mn0.
-AI, 03-based nonmetallic inclusions remain in the ingot. Therefore, the Mn/Si ratio is limited to 2.0 or more.
Ｃは、例えば、真空精錬炉で真空脱炭を行なって溶湯中
の酸素濃度を下げて酸化物系の非金属介在物を低減させ
るうえで有効な元素であるが、Ｃ含有量が０．００３％
未満の場合、精錬効果が少ないために非金属介在物が多
くなり、Ｃ含有量が０．０１．０％を越えるとエツチン
グ性を害するため、Ｃ含有量を０．００３〜０．０１０
％とする。C, for example, is an effective element in vacuum decarburization in a vacuum smelting furnace to lower the oxygen concentration in the molten metal and reduce oxide-based nonmetallic inclusions, but when the C content is 0.003 %
If the C content is less than 0.01%, non-metallic inclusions will increase due to less refining effect, and if the C content exceeds 0.01.0%, etching properties will be impaired.
%.
ＳはＭｎＳの非金属介在物を形成するため、その上限を
０．００３％にする。Since S forms nonmetallic inclusions of MnS, its upper limit is set to 0.003%.
Ｓｅは少量で硬質のＭｎＳｅ系の非金属介在物を形成し
て、ふくれやはがれの原因になるので、その上限を５ｐ
ｐｍとする。Se can form hard MnSe-based nonmetallic inclusions in small amounts, causing blistering and peeling, so the upper limit should be set at 5p.
Let it be pm.
＝４
本発明のＦｅ−Ｎｉ系合金とは、このほか合金の強化や
表面処理性、その細別工性を改善させる目的などで添加
されるＣｒ、Ｍｏ、Ｖ、Ｔｊ、Ｚｒ、Ｎｂ、ＡＩ。=4 The Fe-Ni alloy of the present invention includes Cr, Mo, V, Tj, Zr, Nb, and AI, which are added for the purpose of strengthening the alloy, improving surface treatment properties, and improving its workability.
Ｂ、Ｍｇなど若干の元素が含まれてよいものである。It may contain some elements such as B and Mg.
次に本発明を実施例により説明する。 Next, the present invention will be explained by examples.
第１表に示す合金をアーク炉にて溶解し、続いて真空精
錬炉で精錬を行ない造塊した。その後分塊圧延機によっ
てスラブを作製し、その後熱間圧延および冷間圧延を施
して０．５ｍｍ厚さの板材に仕上げた。次いで、これら
の板利から試料を採取して非金属介在物を測定した。測
定方法は、試料の片面を鏡面研磨した後、光学顕微鏡で
検鏡し、総面積９００ｍｍ”当りの非金属介在物をカウ
ントしたもので、その測定結果を第２表に示す。The alloys shown in Table 1 were melted in an arc furnace, and then refined in a vacuum smelting furnace to form ingots. Thereafter, a slab was produced using a blooming mill, followed by hot rolling and cold rolling to produce a plate material with a thickness of 0.5 mm. Next, samples were taken from these slabs and nonmetallic inclusions were measured. The measurement method was to mirror-polish one side of the sample, examine it with an optical microscope, and count the non-metallic inclusions per 900 mm of total area.The measurement results are shown in Table 2.
第１表および第２表の比較合金Ｎｏ、１は、Ｃ含有量が
低いため、真空精錬の効果が少なく、結果的に溶湯中の
酸素濃度が高くなり、酸化物系の非金属介在物が多くな
っている。比較合金Ｎｏ、４はＭｎ／Ｓｉ比が１．９と
低く、そのため５１０２糸の非金属介在物が多く、Ｎ０
９５およびＮｏ、６４まＳ ＋ Ｓ ｅ力くそれぞれ高
く、これらの元素を主体とする一Ｉ［金属介在物が多く
認められている。Comparative alloy No. 1 in Tables 1 and 2 has a low C content, so vacuum refining has little effect, resulting in a high oxygen concentration in the molten metal and oxide-based nonmetallic inclusions. The number is increasing. Comparative alloy No. 4 has a low Mn/Si ratio of 1.9, so there are many nonmetallic inclusions of 5102 threads, and N0
95, No. 64, and S + S e strength are high, respectively, and many metal inclusions mainly composed of these elements are observed.
また上記比較合金Ｎｏ、１．Ｎｏ、４な１７）シＮｏ、
６＆より）ずれも最終検査でふくれ、また（ま（ま力Ｓ
れ力〜検出され、不適となったものである。In addition, the above comparative alloy No. 1. No, 417) しNo,
6&) The misalignment also swelled during the final inspection, and again (Ma-power S
force is detected and becomes unsuitable.
これに対して本発明鋼合金Ｎ０９２およびＮｏ、３は非
金属介在物が少なく、また、ふくれまたははがれが検出
されず良好であった。In contrast, steel alloys N092 and No. 3 of the present invention had few nonmetallic inclusions, and no blistering or peeling was detected, giving good results.
本発明によれば、従来不十分であったＦｅ−Ｎｊ系合金
のエツチング性の不具合、ふくれおよびはがれの発生を
大幅に解消でき、その効果は極めて第２表According to the present invention, it is possible to significantly eliminate the etching problems, blistering, and peeling of Fe-Nj alloys, which were previously unsatisfactory, and the effects are extremely high as shown in Table 2.
Claims (1)
用Ｆｅ−Ｎｉ系合金において、Ｍｎ／Ｓｉ比を２．０以
上に規制するとともに、Ｃ０．００３〜０．０１０％、
Ｓ０．００３％以下、Ｓｅ５ｐｐｍ以下としたことを特
徴とするリードフレーム用Ｆｅ−Ｎｉ系合金。In a Fe-Ni alloy for lead frames containing 35 to 60% Ni at 1% by weight, the Mn/Si ratio is regulated to 2.0 or more, and C0.003 to 0.010%,
A Fe-Ni alloy for lead frames, characterized in that S is 0.003% or less and Se is 5 ppm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20093889A JPH0364433A (en) | 1989-08-02 | 1989-08-02 | Fe-ni series alloy for lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20093889A JPH0364433A (en) | 1989-08-02 | 1989-08-02 | Fe-ni series alloy for lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0364433A true JPH0364433A (en) | 1991-03-19 |
Family
ID=16432790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20093889A Pending JPH0364433A (en) | 1989-08-02 | 1989-08-02 | Fe-ni series alloy for lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0364433A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2666741A2 (en) | 2012-05-25 | 2013-11-27 | Murata Machinery, Ltd. | Yarn splicing device, yarn splicing system, and textile machine |
-
1989
- 1989-08-02 JP JP20093889A patent/JPH0364433A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2666741A2 (en) | 2012-05-25 | 2013-11-27 | Murata Machinery, Ltd. | Yarn splicing device, yarn splicing system, and textile machine |
| EP2666741A3 (en) * | 2012-05-25 | 2014-06-18 | Murata Machinery, Ltd. | Yarn splicing device, yarn splicing system, and textile machine |
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