JPH0363831B2 - - Google Patents
Info
- Publication number
- JPH0363831B2 JPH0363831B2 JP59230709A JP23070984A JPH0363831B2 JP H0363831 B2 JPH0363831 B2 JP H0363831B2 JP 59230709 A JP59230709 A JP 59230709A JP 23070984 A JP23070984 A JP 23070984A JP H0363831 B2 JPH0363831 B2 JP H0363831B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- conductors
- flexible wiring
- insulating film
- spring material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 46
- 239000000463 material Substances 0.000 claims description 16
- 238000003780 insertion Methods 0.000 claims description 7
- 230000037431 insertion Effects 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 description 13
- 238000000034 method Methods 0.000 description 11
- 238000005476 soldering Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920006015 heat resistant resin Polymers 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59230709A JPS61108193A (ja) | 1984-11-01 | 1984-11-01 | 可撓性配線板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59230709A JPS61108193A (ja) | 1984-11-01 | 1984-11-01 | 可撓性配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61108193A JPS61108193A (ja) | 1986-05-26 |
JPH0363831B2 true JPH0363831B2 (fr) | 1991-10-02 |
Family
ID=16912077
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59230709A Granted JPS61108193A (ja) | 1984-11-01 | 1984-11-01 | 可撓性配線板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61108193A (fr) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59172288A (ja) * | 1983-03-18 | 1984-09-28 | 松下電器産業株式会社 | プリント基板装置 |
-
1984
- 1984-11-01 JP JP59230709A patent/JPS61108193A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59172288A (ja) * | 1983-03-18 | 1984-09-28 | 松下電器産業株式会社 | プリント基板装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS61108193A (ja) | 1986-05-26 |
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