JPH0362797B2 - - Google Patents
Info
- Publication number
- JPH0362797B2 JPH0362797B2 JP59096075A JP9607584A JPH0362797B2 JP H0362797 B2 JPH0362797 B2 JP H0362797B2 JP 59096075 A JP59096075 A JP 59096075A JP 9607584 A JP9607584 A JP 9607584A JP H0362797 B2 JPH0362797 B2 JP H0362797B2
- Authority
- JP
- Japan
- Prior art keywords
- copper strip
- mixture
- strip
- powder
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9607584A JPS60238487A (ja) | 1984-05-14 | 1984-05-14 | 金属条材の表面処理方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9607584A JPS60238487A (ja) | 1984-05-14 | 1984-05-14 | 金属条材の表面処理方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27746485A Division JPS61179880A (ja) | 1985-12-10 | 1985-12-10 | ラジエ−タ用フイン材の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60238487A JPS60238487A (ja) | 1985-11-27 |
JPH0362797B2 true JPH0362797B2 (enrdf_load_stackoverflow) | 1991-09-27 |
Family
ID=14155279
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9607584A Granted JPS60238487A (ja) | 1984-05-14 | 1984-05-14 | 金属条材の表面処理方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60238487A (enrdf_load_stackoverflow) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU604462B2 (en) * | 1986-07-28 | 1990-12-20 | Furukawa Electric Co. Ltd., The | Fin of heat exchanger and method of making it |
JP4434669B2 (ja) | 2003-09-11 | 2010-03-17 | Necエレクトロニクス株式会社 | 電子部品 |
JP4700537B2 (ja) * | 2005-03-24 | 2011-06-15 | 新日本製鐵株式会社 | 金属帯板のめっき方法 |
JP5531179B2 (ja) * | 2011-03-24 | 2014-06-25 | 日本碍子株式会社 | Cu薄板処理方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49106920A (enrdf_load_stackoverflow) * | 1973-02-17 | 1974-10-11 | ||
JPS5121377A (ja) * | 1974-08-14 | 1976-02-20 | Hitachi Ltd | Hodento |
JPS54137439A (en) * | 1978-04-18 | 1979-10-25 | Minoru Isono | Formation of hardened layer on metal surface |
JPS54147135A (en) * | 1978-05-12 | 1979-11-17 | Minoru Isono | Formation of saw teeth hard quality chips and apparatus therefor |
JPS5638456A (en) * | 1979-09-04 | 1981-04-13 | Senjiyu Kinzoku Kogyo Kk | Zinc plating method |
-
1984
- 1984-05-14 JP JP9607584A patent/JPS60238487A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60238487A (ja) | 1985-11-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3723160A (en) | Zinc-plating compositions | |
JPH0362797B2 (enrdf_load_stackoverflow) | ||
KR101665880B1 (ko) | 내식성이 우수한 합금화 아연도금강판 및 제조방법 | |
US3642523A (en) | Method and device for producing tin layers of {22 3{82 {0 on copper and copper alloy wire by hot tin plating | |
US4958763A (en) | Method of soldering aluminum | |
JPS6348948B2 (enrdf_load_stackoverflow) | ||
PL81125B1 (en) | Method of producing a coated ferrous substrate[gb1269150a] | |
DE2756437A1 (de) | Beschichtetes bzw. umhuelltes substrat und verfahren zu dessen herstellung | |
CZ194394A3 (en) | Process for producing metallic elements with a surface retaining particulate material and elements retaining particles of fluxing agent | |
DE3828911C1 (en) | Process for the hot metallisation of piece goods | |
US3079275A (en) | Spray-coating process | |
JPH0649614A (ja) | 耐食性及びはんだ付け性が優れた溶融錫めっき銅合金材の製造方法 | |
JPH07292482A (ja) | 鋼帯の合金メッキ装置 | |
DE1521286C (de) | Verfahren zum Überziehen von metallischen Massenteilen mit Weichlotmetallen | |
DE2058678C3 (de) | Verfahren zum Überziehen von Metallteilen aus Kupfer oder Kupferlegierungen mit einer Zinn-Blei-Legierung | |
JP2808200B2 (ja) | 半田または錫溶融めっき材のめっき表面平滑化方法 | |
JPH03211263A (ja) | 溶融めっき鋼板の製造装置 | |
EP1815037B1 (de) | Verfahren zum einseitigen beschichten von metallbändern und deren verwendung | |
JPH08218160A (ja) | 2層スプレーめっきによる高耐食性Zn−Al合金めっき鋼板の製造方法 | |
JPS5967357A (ja) | 鋼板に金属被覆を行う方法 | |
DE102005050221B4 (de) | Verfahren zum einseitigen Beschichten von Metallbändern und deren Verwendung | |
JPS62142067A (ja) | 半田との合金層形成の少ない複合材 | |
Daniels | Factors influencing the formation and structure of hot-dipped tin coatings | |
JPH0472047A (ja) | アルミニウム・亜鉛合金溶融めっき被覆物及びアルミニウム・亜鉛合金溶融めっき方法 | |
EP0864666A1 (de) | Verfahren zur Herstellung eines verzinnten Bandes |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |