JPH0361365U - - Google Patents
Info
- Publication number
- JPH0361365U JPH0361365U JP2426489U JP2426489U JPH0361365U JP H0361365 U JPH0361365 U JP H0361365U JP 2426489 U JP2426489 U JP 2426489U JP 2426489 U JP2426489 U JP 2426489U JP H0361365 U JPH0361365 U JP H0361365U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- synthetic resin
- molded product
- resin molded
- board characterized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920003002 synthetic resin Polymers 0.000 claims 2
- 239000000057 synthetic resin Substances 0.000 claims 2
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本発明に関わる電子回路基板を備えた
電子機器の側面断面図、第２図は上記電子機器の
要部側面断面図、第３図は本発明に関わる電子回
路基板の他の実施例を示す側面断面図であり、第
４図は従来の電子回路基板を備えた電子機器の側
面断面図である。
１……電子機器、２……機器筐体、２ａ，２ｂ
……操作面板、３，３０……回路基板、３ｃ，３
ｄ，３０ａ，３０ｂ，３０ｃ……装着面、３ａ′
，３ｂ′，３０′……装着基準面、４ａ，４ｂ，
４ｃ，４ｄ，４ｅ，４０ａ，４０ｂ，４０ｃ……
回路部品。
FIG. 1 is a side sectional view of an electronic device equipped with an electronic circuit board according to the present invention, FIG. 2 is a side sectional view of the main part of the electronic device, and FIG. 3 is another embodiment of the electronic circuit board according to the present invention FIG. 4 is a side sectional view showing an example, and FIG. 4 is a side sectional view of an electronic device equipped with a conventional electronic circuit board. 1...Electronic device, 2...Device housing, 2a, 2b
...Operation panel, 3,30...Circuit board, 3c,3
d, 30a, 30b, 30c... mounting surface, 3a'
, 3b', 30'... Mounting reference plane, 4a, 4b,
4c, 4d, 4e, 40a, 40b, 40c...
circuit parts.
Claims (1)
に倣つて形成された合成樹脂成形品から成ること
を特徴とする電子回路基板。 (2) 各回路部品に対する各装着面を装着基準面
に対しずらして設けた合成樹脂成形品から成るこ
とを特徴とする電子回路基板。[Scope of Claim for Utility Model Registration] (1) An electronic circuit board characterized by being made of a synthetic resin molded product formed to imitate a plurality of continuous face plates in an electronic device housing. (2) An electronic circuit board characterized in that it is made of a synthetic resin molded product in which each mounting surface for each circuit component is offset from a mounting reference surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2426489U JPH0361365U (en) | 1989-03-01 | 1989-03-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2426489U JPH0361365U (en) | 1989-03-01 | 1989-03-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0361365U true JPH0361365U (en) | 1991-06-17 |
Family
ID=31527232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2426489U Pending JPH0361365U (en) | 1989-03-01 | 1989-03-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0361365U (en) |
-
1989
- 1989-03-01 JP JP2426489U patent/JPH0361365U/ja active Pending