JPH0179888U - - Google Patents
Info
- Publication number
- JPH0179888U JPH0179888U JP1987176144U JP17614487U JPH0179888U JP H0179888 U JPH0179888 U JP H0179888U JP 1987176144 U JP1987176144 U JP 1987176144U JP 17614487 U JP17614487 U JP 17614487U JP H0179888 U JPH0179888 U JP H0179888U
- Authority
- JP
- Japan
- Prior art keywords
- side plates
- back plate
- housing
- electronic device
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の原理斜視図、第２図は本考案
による一実施例の説明図で、ａは斜視図、ｂ，ｃ
は要部斜視図、ｄは要部側面図、第３図は従来の
斜視図を示す。
図において、１，２は側板、３は底板、４は天
井板、５は背面板、６は内壁、７Ａ，７Ｂ，７Ｃ
は電子機器、８は電子部品、９はパターン配線、
１０は筐体を示す。
Fig. 1 is a perspective view of the principle of the present invention, Fig. 2 is an explanatory diagram of an embodiment of the invention, where a is a perspective view, b, c
3 shows a perspective view of the main part, d shows a side view of the main part, and FIG. 3 shows a conventional perspective view. In the figure, 1 and 2 are side plates, 3 is a bottom plate, 4 is a ceiling plate, 5 is a back plate, 6 is an inner wall, 7A, 7B, 7C
is an electronic device, 8 is an electronic component, 9 is a pattern wiring,
10 indicates a housing.
Claims (1)
板４、背面板５とによつて箱形に形成される筐体
１０と、筐体１０に収納する電子機器７Ａ，７Ｂ
，７Ｃとを備えた電子装置において、 前記側板１，２および背面板５の内壁６に電子
部品８の実装が行われるよう該側板１，２および
背面板５にはパターン配線９が張架されて成るこ
とを特徴とする電子装置。[Claims for Utility Model Registration] A housing 10 formed into a box shape by side plates 1 and 2, a bottom plate 3, a ceiling plate 4, and a back plate 5 made of synthetic resin, and an electronic device housed in the housing 10. Equipment 7A, 7B
, 7C, patterned wiring 9 is stretched across the side plates 1, 2 and the back plate 5 so that electronic components 8 are mounted on the inner walls 6 of the side plates 1, 2 and the back plate 5. An electronic device characterized by comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987176144U JPH0179888U (en) | 1987-11-18 | 1987-11-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987176144U JPH0179888U (en) | 1987-11-18 | 1987-11-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0179888U true JPH0179888U (en) | 1989-05-29 |
Family
ID=31467900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987176144U Pending JPH0179888U (en) | 1987-11-18 | 1987-11-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0179888U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0319396A (en) * | 1989-06-16 | 1991-01-28 | Hitachi Ltd | Transmission medium insert-molded circuit structure |
-
1987
- 1987-11-18 JP JP1987176144U patent/JPH0179888U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0319396A (en) * | 1989-06-16 | 1991-01-28 | Hitachi Ltd | Transmission medium insert-molded circuit structure |