JPH0360158B2 - - Google Patents
Info
- Publication number
- JPH0360158B2 JPH0360158B2 JP13980984A JP13980984A JPH0360158B2 JP H0360158 B2 JPH0360158 B2 JP H0360158B2 JP 13980984 A JP13980984 A JP 13980984A JP 13980984 A JP13980984 A JP 13980984A JP H0360158 B2 JPH0360158 B2 JP H0360158B2
- Authority
- JP
- Japan
- Prior art keywords
- lead wires
- mold
- support shaft
- cut
- slip ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 12
- 230000003014 reinforcing effect Effects 0.000 claims description 12
- 238000009713 electroplating Methods 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 238000007772 electroless plating Methods 0.000 claims description 2
- 239000003973 paint Substances 0.000 claims description 2
- 238000007493 shaping process Methods 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000009413 insulation Methods 0.000 description 10
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 239000002390 adhesive tape Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13980984A JPS6119084A (ja) | 1984-07-06 | 1984-07-06 | スリップリングアセンブリの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13980984A JPS6119084A (ja) | 1984-07-06 | 1984-07-06 | スリップリングアセンブリの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6119084A JPS6119084A (ja) | 1986-01-27 |
JPH0360158B2 true JPH0360158B2 (ko) | 1991-09-12 |
Family
ID=15253943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13980984A Granted JPS6119084A (ja) | 1984-07-06 | 1984-07-06 | スリップリングアセンブリの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6119084A (ko) |
-
1984
- 1984-07-06 JP JP13980984A patent/JPS6119084A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6119084A (ja) | 1986-01-27 |
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