JPH0359688U - - Google Patents

Info

Publication number
JPH0359688U
JPH0359688U JP12051989U JP12051989U JPH0359688U JP H0359688 U JPH0359688 U JP H0359688U JP 12051989 U JP12051989 U JP 12051989U JP 12051989 U JP12051989 U JP 12051989U JP H0359688 U JPH0359688 U JP H0359688U
Authority
JP
Japan
Prior art keywords
wedge
groove
shaped locking
heat sink
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12051989U
Other languages
Japanese (ja)
Other versions
JP2539612Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989120519U priority Critical patent/JP2539612Y2/en
Publication of JPH0359688U publication Critical patent/JPH0359688U/ja
Application granted granted Critical
Publication of JP2539612Y2 publication Critical patent/JP2539612Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の第1の実施例を示す図、第2
図は従来使用してきた取付構造を示す図、第3図
は金具に部分的突出部をもうけたものを使用した
取付構造を示す図、第4図は第2図と第3図の取
付構造とした場合生じる問題を示す図、a半導体
素子が薄いときの図、b半導体素子が厚いときの
図、第5図は本考案の第2の実施例を示す図、第
6図は本考案の実施例に補助放熱板を取付け改良
した実施例を示す図を示す。 1……楔形を有する留め具、2……放熱板、5
……半導体素子。
FIG. 1 is a diagram showing the first embodiment of the present invention, and FIG.
The figure shows the mounting structure conventionally used, Fig. 3 shows the mounting structure using a metal fitting with a partial protrusion, and Fig. 4 shows the mounting structure shown in Figs. 2 and 3. Figure 5 shows the second embodiment of the present invention. Figure 6 shows the implementation of the present invention. A diagram showing an improved embodiment in which an auxiliary heat sink is attached to the example is shown. 1... Fastener having a wedge shape, 2... Heat sink, 5
...Semiconductor element.

Claims (1)

【実用新案登録請求の範囲】 (1) 放熱が要求される電気部品を、穴が設けら
れた放熱板に、楔形を有する留め具を使いネジ留
めする際、留め具が回転しないように留め具の楔
形部分を放熱板の穴に挿入してあることを特徴と
する電気部品の取付構造。 (2) L字形板金状の固定金具のうち、楔形係止
部分を、ある物体の溝あるいは貫通孔に挿入し、
溝あるいは貫通孔の寸法を変えることより楔形係
止部分の溝あるいは貫通孔に挿入される長さが変
えられ、それを利用して物を固定させることを特
徴とする取付構造。 (3) 楔形にカツトされた形状を有する固定用金
具で、放熱板の溝あるいは貫通孔に楔形係止部分
を挿入させ他の部分を電気部品に押しあて、電気
部品と楔形係止部分の間にボルトを通してある物
体に固定する。そのとき放熱板の溝の形状寸法を
変えることにより、溝に挿入される楔形係止部分
の長さが変えられることを特徴とする取付構造。 (4) 楔形係止部分を有した5角形の板金を広い
面に対して直角に折り曲げた金具を使用して、放
熱板に平形電子部品を固定させるとき、金具の楔
形係止部分を放熱板の溝あるいは貫通孔に挿入さ
せ他の部分を平形物体に押しあて、楔形係止部分
と平形電子部品の間にボルトを通し放熱板に締め
つけ、溝あるいは貫通孔の形状寸法を変化させる
ことにより挿入される楔形係止部分の長さも変化
することを特徴とする物体の取付構造。 (5) 平形電子部品は半導体素子であるもので(4)
項のように固定することを特徴とする物体の取付
構造。
[Scope of Claim for Utility Model Registration] (1) A fastener that prevents the fastener from rotating when a wedge-shaped fastener is used to screw an electrical component that requires heat dissipation to a heat sink with holes. A mounting structure for electrical components, characterized in that a wedge-shaped portion of the holder is inserted into a hole in a heat sink. (2) Insert the wedge-shaped locking part of the L-shaped sheet metal fixing fitting into a groove or through hole of an object,
A mounting structure characterized in that by changing the dimensions of the groove or through-hole, the length of the wedge-shaped locking portion inserted into the groove or through-hole can be changed, and this can be used to fix an object. (3) A fixing metal fitting that is cut into a wedge shape, and the wedge-shaped locking part is inserted into the groove or through hole of the heat sink, and the other part is pressed against the electrical component, and the gap between the electrical component and the wedge-shaped locking part is to fix it to an object by passing a bolt through it. A mounting structure characterized in that the length of the wedge-shaped locking portion inserted into the groove can be changed by changing the shape and dimensions of the groove of the heat sink. (4) When fixing a flat electronic component to a heat sink using a metal fitting made by bending a pentagonal sheet metal with a wedge-shaped locking part at right angles to a wide surface, the wedge-shaped locking part of the metal fitting is attached to the heat sink. insert it into the groove or through hole, press the other part against the flat object, pass a bolt between the wedge-shaped locking part and the flat electronic component, tighten it to the heat sink, and change the shape and dimensions of the groove or through hole. An object mounting structure characterized in that the length of a wedge-shaped locking portion is also changed. (5) Flat electronic components are semiconductor elements (4)
A mounting structure for an object, which is characterized by being fixed as described in Section 1.
JP1989120519U 1989-10-13 1989-10-13 Mounting structure of electric parts Expired - Lifetime JP2539612Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989120519U JP2539612Y2 (en) 1989-10-13 1989-10-13 Mounting structure of electric parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989120519U JP2539612Y2 (en) 1989-10-13 1989-10-13 Mounting structure of electric parts

Publications (2)

Publication Number Publication Date
JPH0359688U true JPH0359688U (en) 1991-06-12
JP2539612Y2 JP2539612Y2 (en) 1997-06-25

Family

ID=31668594

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989120519U Expired - Lifetime JP2539612Y2 (en) 1989-10-13 1989-10-13 Mounting structure of electric parts

Country Status (1)

Country Link
JP (1) JP2539612Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013229366A (en) * 2012-04-24 2013-11-07 Meidensha Corp Fixing structure of electronic component
JP2017212275A (en) * 2016-05-24 2017-11-30 矢崎総業株式会社 Electronic component fixing structure

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63502547A (en) * 1986-02-18 1988-09-22 エヌ・シー・アール・インターナショナル・インコーポレイテッド Mounting device for solid equipment
JPH02110389U (en) * 1989-02-22 1990-09-04

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63502547A (en) * 1986-02-18 1988-09-22 エヌ・シー・アール・インターナショナル・インコーポレイテッド Mounting device for solid equipment
JPH02110389U (en) * 1989-02-22 1990-09-04

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013229366A (en) * 2012-04-24 2013-11-07 Meidensha Corp Fixing structure of electronic component
JP2017212275A (en) * 2016-05-24 2017-11-30 矢崎総業株式会社 Electronic component fixing structure

Also Published As

Publication number Publication date
JP2539612Y2 (en) 1997-06-25

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