JPH0227737U - - Google Patents
Info
- Publication number
- JPH0227737U JPH0227737U JP10578788U JP10578788U JPH0227737U JP H0227737 U JPH0227737 U JP H0227737U JP 10578788 U JP10578788 U JP 10578788U JP 10578788 U JP10578788 U JP 10578788U JP H0227737 U JPH0227737 U JP H0227737U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- holding surface
- circuit element
- holding
- screw hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 claims description 2
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Control Of Voltage And Current In General (AREA)
Description
第１図はこの考案の一実施例を示す斜視図、第
２図はその縦断面図である。
図面において、１は放熱板、２は回路素子、３
は保持面、４は側面、５は水平面、６は取付け基
板、７は垂直面、８は係止面、９はねじ孔９、１
１，１２，１４は挿入孔、１３は放熱部、１５は
固定用ねじである。
FIG. 1 is a perspective view showing an embodiment of this invention, and FIG. 2 is a longitudinal sectional view thereof. In the drawings, 1 is a heat sink, 2 is a circuit element, and 3 is a heat sink.
is a holding surface, 4 is a side surface, 5 is a horizontal surface, 6 is a mounting board, 7 is a vertical surface, 8 is a locking surface, 9 is a screw hole 9, 1
1, 12, and 14 are insertion holes, 13 is a heat radiation part, and 15 is a fixing screw.
Claims (1)
の側縁から延在し、前記回路素子からの熱を放熱
するための放熱面とを有する放熱板において、前
記保持面の一端縁には、取付け基板の厚さに略等
しい長さの前記取付け基板の側縁に当接する垂直
面とこの垂直面の先端から前記保持面と略平行な
間隙を置いて相対する係止面が一体的に形成され
、前記係止面の略中央にはねじ孔を有し、前記保
持面には前記ねじ孔と整合する孔を有し、前記回
路素子は前記ねじ孔に螺合される固定用ねじによ
り固定されることを特徴とする回路素子の放熱板
。 (2) 前記回路素子は、放熱部を備えた３端子電
圧レギユレータであり、前記保持面には前記放熱
部が面接触するように取付けられることを特徴と
する請求項１に記載の放熱板。[Claims for Utility Model Registration] (1) A heat sink having a holding surface for holding a circuit element and a heat radiation surface extending from a side edge of the holding surface for dissipating heat from the circuit element. , at one end edge of the holding surface, a vertical surface having a length substantially equal to the thickness of the mounting board and abutting the side edge of the mounting board, and a gap substantially parallel to the holding surface from the tip of this vertical surface. Opposing locking surfaces are integrally formed, the locking surface has a screw hole approximately in the center, the holding surface has a hole that aligns with the screw hole, and the circuit element is arranged in the screw hole. A heat sink for a circuit element, characterized in that it is fixed by a fixing screw screwed into the heat sink. (2) The heat sink according to claim 1, wherein the circuit element is a three-terminal voltage regulator including a heat sink, and the heat sink is attached to the holding surface so that the heat sink is in surface contact with the holding surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10578788U JPH0227737U (en) | 1988-08-10 | 1988-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10578788U JPH0227737U (en) | 1988-08-10 | 1988-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0227737U true JPH0227737U (en) | 1990-02-22 |
Family
ID=31338716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10578788U Pending JPH0227737U (en) | 1988-08-10 | 1988-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0227737U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1097348A (en) * | 1996-09-20 | 1998-04-14 | Toshiba Corp | Circuit module having heating circuit element and portable electronic instrument |
-
1988
- 1988-08-10 JP JP10578788U patent/JPH0227737U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1097348A (en) * | 1996-09-20 | 1998-04-14 | Toshiba Corp | Circuit module having heating circuit element and portable electronic instrument |
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