JPH0446556U - - Google Patents
Info
- Publication number
- JPH0446556U JPH0446556U JP8795990U JP8795990U JPH0446556U JP H0446556 U JPH0446556 U JP H0446556U JP 8795990 U JP8795990 U JP 8795990U JP 8795990 U JP8795990 U JP 8795990U JP H0446556 U JPH0446556 U JP H0446556U
- Authority
- JP
- Japan
- Prior art keywords
- leaf spring
- flat part
- spring
- mounting
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案実施例の斜視図、第２図は本考
案実施例の使用状態を示す断面図、第３図は従来
例断面図である。
図中、１１はＩＣ素子（発熱素子）、１２はプ
リント板、１３は板ばね、１４は取付金具、１５
は穴、１６はねじ、２１は板ばね、２２は弯曲部
、２３は平坦部、２４は取付部、２５は穴、を示
す。
FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a cross-sectional view showing the use of the embodiment of the present invention, and FIG. 3 is a cross-sectional view of a conventional example. In the figure, 11 is an IC element (heating element), 12 is a printed board, 13 is a leaf spring, 14 is a mounting bracket, and 15
16 is a hole, 16 is a screw, 21 is a leaf spring, 22 is a curved portion, 23 is a flat portion, 24 is a mounting portion, and 25 is a hole.
Claims (1)
て 該板ばね１１は条片状の平坦部２３から上方に
延在する１対の弯曲部２２と該弯曲部の先端から
平坦部２３にほぼ平行に、かつ、互に離れる方向
に延在する取付部２４から成り、 該板ばねの平坦部２３を発熱素子１１の表面に
接触させた状態で該板ばね２１を取付金具１４に
取付ける構成としたことを特徴とする放熱用板ば
ね２１。 (2) 該取付部２４の平坦部の長手方向の長さＰ
が発熱素子１１の幅に等しく設定してなることを
特徴とする請求項(1)記載の放熱用板ばね２１。[Claims for Utility Model Registration] (1) A leaf spring 21 for heat dissipation of a heat generating element 11, which leaf spring 11 has a pair of curved parts 22 extending upward from a strip-shaped flat part 23; It consists of a mounting part 24 extending from the tip of the curved part almost parallel to the flat part 23 and in a direction away from each other, and the flat part 23 of the plate spring is in contact with the surface of the heating element 11. A heat dissipating leaf spring 21 characterized in that the spring 21 is configured to be attached to a mounting fitting 14. (2) Length P in the longitudinal direction of the flat part of the mounting portion 24
The heat dissipating leaf spring 21 according to claim 1, wherein the width is set equal to the width of the heating element 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8795990U JP2509045Y2 (en) | 1990-08-24 | 1990-08-24 | Heat dissipation leaf spring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8795990U JP2509045Y2 (en) | 1990-08-24 | 1990-08-24 | Heat dissipation leaf spring |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0446556U true JPH0446556U (en) | 1992-04-21 |
| JP2509045Y2 JP2509045Y2 (en) | 1996-08-28 |
Family
ID=31820785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8795990U Expired - Fee Related JP2509045Y2 (en) | 1990-08-24 | 1990-08-24 | Heat dissipation leaf spring |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2509045Y2 (en) |
-
1990
- 1990-08-24 JP JP8795990U patent/JP2509045Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2509045Y2 (en) | 1996-08-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0446556U (en) | ||
| JPS6435753U (en) | ||
| JPH02102741U (en) | ||
| JPH0242489U (en) | ||
| JPH03122547U (en) | ||
| JPH0341214U (en) | ||
| JPH0227737U (en) | ||
| JPH0371696U (en) | ||
| JPH029445U (en) | ||
| JPS62165068U (en) | ||
| JPH0367486U (en) | ||
| JPH023834U (en) | ||
| JPH0397935U (en) | ||
| JPS605840U (en) | thermal printing head | |
| JPS6027448U (en) | radiator | |
| JPH01113392U (en) | ||
| JPS5926255U (en) | transistor mounting bracket | |
| JPS6219797U (en) | ||
| JPH03120045U (en) | ||
| JPH02129794U (en) | ||
| JPS61179752U (en) | ||
| JPS6027447U (en) | radiator | |
| JPS59185846U (en) | transistor heat sink | |
| JPH03110885U (en) | ||
| JPS58127780U (en) | speaker holder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |