JP3068039U - Assembly structure of heat dissipation plate for electronic device - Google Patents

Abstract

(57) [Problem] To provide an assembly structure of a heat dissipation plate for an electronic element to which various electronic elements of different standards can be easily attached. SOLUTION: The heat dissipating plate 11 includes a heat dissipating plate 11 having a concave portion and a clip device 13, a fastening member 15 for fastening an electronic element 14 in the concave portion, and a jig for sandwiching the heat dissipating plate 11. 1
4 is arranged on the surface where it is not provided. Fastening member 1
5, the electronic element 14 of any standard can be fastened to the recess. Further, by sandwiching the clip device 13 between the jigs, the heat radiating plates 11 of various standards can be sandwiched, and there is no need to replace the jigs corresponding to the heat radiating plates 11.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to an assembly structure of a heat dissipation plate for an electronic device.

[0002]

[Prior art]

 In a conventional electronic device, for example, an electronic device such as a transistor is mounted on a heat dissipation plate so as to dissipate heat. As shown in FIG. 7, two insertion pins 712 of the heat radiation plate 71 are fitted into two insertion holes 701 of the circuit board 700. The heat dissipation plate 71 is provided with a screw hole 711. A fastening member such as a screw is fitted into the mounting hole 732 of the electronic element 73, and the fastening member is further screwed into the screw hole 711 of the heat radiation plate 71.

[0003]

[Problems to be solved by the invention]

 However, the standards of the electronic element 73 are various, and the screw holes 711 of the heat radiation plate 71 cannot be applied to all the standards of the electronic element 73. Therefore, when the electronic element 73 is replaced, a new screw hole 711 needs to be formed in the heat radiation plate 71, which is inconvenient.

When the electronic element 73 is fastened to the heat radiating plate 71, the position of the heat radiating plate 71 is determined by sandwiching the heat radiating plate 71 with a jig, and the electronic element 73 is fastened to the heat radiating plate 71 by a fastening member 72 such as a screw. However, there are various standards for the heat radiation plate 71, and it is necessary to use a jig corresponding to the heat radiation plate 71 used. That is, it is necessary to replace the jig according to the heat radiation plate 71, which is inconvenient.

Accordingly, the present invention has been made to solve the above-described problem, and has as its object to provide an assembly structure of an electronic element heat radiation plate to which various electronic elements of different standards can be easily attached. And Another object of the present invention is to provide an assembling structure of a heat radiating plate for an electronic element which does not require replacement of a jig.

[0006]

[Means for Solving the Problems]

 According to the assembly structure of the heat radiating plate for an electronic element of the present invention to achieve the above object, the heat radiating plate having the concave portion and the clip device, the fastening member for fastening the electronic element to the concave portion, and the heat radiating plate are sandwiched. The clip device is disposed on the surface of the heat dissipation plate on which the electronic elements are not provided.

[0007] By the fastening member, an electronic element of any standard can be fastened to the recess. In addition, by sandwiching the clip device between the jigs, heat radiation plates of various standards can be held, and there is no need to replace the jig so as to correspond to the heat radiation plates. There is no need to make screw holes for assembling electronic elements to the heat dissipation plate.

[0008]

[Embodiment of the invention]

 Hereinafter, several embodiments of the present invention will be described with reference to the drawings. FIG. 1 illustrates an assembly structure of a heat dissipation plate for an electronic device according to a first embodiment of the present invention. As shown in FIG. 1, a concave portion 12 is provided on one surface of the heat radiation plate 11. The clip device 13 is arranged on the other surface. In this embodiment, the clip device 13 has one protrusion 131, but two or more protrusions 131 may be provided.

As shown in FIG. 2, in the present embodiment, the electronic element 14 is a transistor. When the electronic element 14 is fastened to the heat radiating plate 11, first, in order to determine the position of the heat radiating plate 11, the clip device 13 including the protrusion 131 is sandwiched between jigs (not shown), and the heat radiating plate 11 is held between the jigs. Next, a tapping screw 15 as a fastening member is fitted into a mounting hole (not shown) of the electronic element 14, and the tapping screw 15 is further screwed into the recess 12. The outer diameter of the tapping screw 15 is larger than that of the recess 12. When the tapping screw 15 is screwed into the recess 12, a female screw is formed on the side wall of the recess 12, and the electronic element 14 is assembled to the heat dissipation plate 11. In addition, the electronic element 14 of various standards can be assembled at any position of the concave portion 12 by the fastening member. There is no need to drill screw holes as in the past.

An inclined surface 121 is provided above both side walls of the recess 12. Therefore, even if the outer diameter of the tapping screw 15 for tightening the electronic element 14 corresponding to the used electronic element 14 increases, the tapping screw 15 is guided by the inclined surface 121 of the concave section 12 to the concave section 12, and The electronic element 14 is assembled. The heat radiating plate 11 is provided with a clip device 13 and prevents the heat radiating plate 11 from vibrating left and right when the electronic element 14 is fastened to the heat radiating plate 11. Since all the heat radiating plates 11 are provided with the same size and the same type of clip device 13, there is no need to replace the jig when the heat radiating plates 11 are replaced.

Second Embodiment FIG. 3 shows an assembly structure of a heat dissipation plate for an electronic device according to a second embodiment of the present invention. As shown in FIG. 3, three through holes 32 are arranged on one surface of the heat dissipation plate 31. A clip device 33 is arranged on the other surface of the heat radiating plate 31. In the present embodiment, three through holes 32 are arranged, but one through hole 32 may be provided. Although the clip device 33 has one protrusion 333, two or more protrusions 333 may be provided.

As shown in FIG. 4, an inclined surface 321 is provided above both side walls of each through hole 32. For this reason, even if the outer diameter of the tapping screw 35 for tightening the electronic element 34 corresponding to the electronic element 34 used increases, the tapping screw 35 is guided to the through hole 32 by the inclined surface 321 of the concave portion 32, The electronic element 34 is mounted in the hole 32. The clip device 33 is the same as in the first embodiment, and will not be described in detail.

Third Embodiment FIG. 5 shows an assembly structure of a heat dissipation plate for an electronic device according to a third embodiment of the present invention. As shown in FIG. 5, first and second projections 512 and 513 projecting from the first surface 510 to the second surface 511 of the heat radiation plate 51 are formed by press working. One side of the first 512 and the second 513 is connected to the second surface 511, respectively. The first and second pawls 512 and 513 are inclined with respect to the second face 511 such that the farther away from the second face 511, the closer the distance between the first face 512 and the second face 513. An opening 514 is formed by the tips of the first and second claws 512 and 513. As shown in FIG. 6, the opening 514 is formed so that the tapping screw 53 can be tightened. Further, a portion where the first and second pawls 512 and 513 protrude from the second surface 511 of the heat radiation plate 51 becomes the clip device 54, which can be held by a jig (not shown).

As shown in FIG. 6, when assembling the electronic element 52 such as a transistor, for example, to the heat dissipation plate 51, first, the heat dissipation plate 51 is fastened to a jig (not shown), and the first and second jigs 512 and 513 are used for the jig. The formed clip device 54 is sandwiched, and the heat radiation plate 51 is fixed to the jig. Next, the electronic element 52 is arranged on the first surface of the heat radiation plate 51. The tapping screw 53 is screwed into a mounting hole (not shown) of the electronic element 52, and the tapping screw 53 is further screwed along the first and second claws 512 and 513, so that the electronic element 52 is assembled to the heat dissipation plate 51.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a heat dissipation plate according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along line II of FIG.

FIG. 3 is a perspective view showing a heat dissipation plate according to a second embodiment of the present invention;

FIG. 4 is a cross-sectional view taken along line II-II of FIG.

FIG. 5 is a perspective view showing a heat dissipation plate according to a third embodiment of the present invention.

FIG. 6 is a sectional view taken along the line III-III of FIG. 5;

FIG. 7 is a perspective view showing a heat dissipation plate according to a conventional example.

[Explanation of symbols]

 REFERENCE SIGNS LIST 11 heat radiating plate 12 concave portion 13 clip device 14 electronic element 15 tapping screw (tightening member) 31 heat radiating plate 32 through hole 33 clip device 34 electronic element 35 tapping screw (tightening member) 51 heat radiating plate 52 electronic element 53 tapping screw (tightening) Attached member) 54 Clip device 131 Projection 333 Projection

Claims (7)

[Utility model registration claims] A radiating plate having a concave portion and a clip device; a fastening member for tightening an electronic element in the concave portion; and a jig for sandwiching the radiating plate. An assembling structure of a heat radiating plate for an electronic element, wherein the heat radiating plate is arranged on a surface not provided. 2. The structure of claim 1, wherein the clip device is a single protrusion. 3. A heat dissipation plate having a concave portion on the first surface and having a clip device on a second surface behind the first surface, a fastening member for fastening an electronic element to the concave portion, and holding the heat dissipating plate. An assembly structure of a heat dissipation plate for an electronic element, comprising: a jig; 4. The assembly structure according to claim 3, wherein said clip device is a bar protruding from said second surface. 5. The assembly structure according to claim 3, wherein the concave portion provided on the first surface penetrates to the second surface to form a through hole. 6. A heat radiating plate, a first and a second ones of which are connected to the heat radiating plate on one side thereof and projecting from one surface of the heat radiating plate, and a jig for sandwiching the heat radiating plate, The first tip and the second tip are separated,
An assembly structure for a heat dissipation plate for an electronic element, wherein a fastening member is fastened between the first tip and the second tip. 7. The assembly structure for a heat radiating plate for an electronic device according to claim 1, wherein said fastening member is a tapping screw.