JPH029497U - - Google Patents
Info
- Publication number
- JPH029497U JPH029497U JP8872888U JP8872888U JPH029497U JP H029497 U JPH029497 U JP H029497U JP 8872888 U JP8872888 U JP 8872888U JP 8872888 U JP8872888 U JP 8872888U JP H029497 U JPH029497 U JP H029497U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- circuit board
- printed circuit
- locking piece
- metal body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案による放熱板の実装構造の一実
施例を示す側面図、第２図は該実施例の係止片形
成部分の形状を示す側面図、第３図は該実施例の
放熱板の斜視図、第４図は該実施例における金属
体の取付け構造を示す分解斜視図、第５図ないし
第７図は本考案の他の実施例を示す斜視図、第８
図は従来の放熱板の構造を示す斜視図、第９図は
該放熱板を用いた従来の実装構造を示す側面図、
第１０図は従来の放熱板の他の例を示す斜視図、
第１１図は該放熱板を用いた従来の実装構造を示
す側面図である。
Fig. 1 is a side view showing an embodiment of the heat dissipation plate mounting structure according to the present invention, Fig. 2 is a side view showing the shape of the locking piece forming part of the embodiment, and Fig. 3 is the heat dissipation of the embodiment. FIG. 4 is an exploded perspective view showing the mounting structure of the metal body in this embodiment; FIGS. 5 to 7 are perspective views showing other embodiments of the present invention; FIG.
The figure is a perspective view showing the structure of a conventional heat sink, and FIG. 9 is a side view showing a conventional mounting structure using the heat sink.
FIG. 10 is a perspective view showing another example of a conventional heat sink;
FIG. 11 is a side view showing a conventional mounting structure using the heat sink.
Claims (1)
取付けた放熱板をプリント基板に実装する構造に
おいて、放熱板の取付け面にＬ字形の係止片を設
けると共に、該取付け面の前記係止片から隔たつ
た個所に、半田付け可能な金属体を取付け面より
突出させて取付け、前記Ｌ字形の係止片をプリン
ト基板に設けたスリツトに挿入してスリツトの縁
に係止させ、前記金属体をプリント基板に設けた
穴に挿入して半田付けしたことを特徴とする放熱
板の実装構造。 ２ 前記Ｌ字形係止片と放熱板との間に間隙が形
成され、かつ該間隙は開口側が拡大されたテーパ
ー形をなすことを特徴とする請求項１記載の放熱
板の実装構造。 ３ 前記金属体が筒状をなし、該金属体を、放熱
板に形成した棒状部に嵌合して取付けたことを特
徴とする請求項１または２記載の放熱板の実装構
造。[Scope of Claim for Utility Model Registration] 1. In a structure in which a heat sink made of a material that cannot be soldered and to which a heat generating element is attached is mounted on a printed circuit board, an L-shaped locking piece is provided on the mounting surface of the heat sink, and , Attach a solderable metal body to a part of the mounting surface that is separated from the locking piece so as to protrude from the mounting surface, and insert the L-shaped locking piece into a slit provided on the printed circuit board to remove the slit. A mounting structure for a heat sink, characterized in that the metal body is fixed to the edge of the printed circuit board, and the metal body is inserted into a hole provided in a printed circuit board and soldered. 2. The heat sink mounting structure according to claim 1, wherein a gap is formed between the L-shaped locking piece and the heat sink, and the gap has a tapered shape with an opening side enlarged. 3. The heat sink mounting structure according to claim 1, wherein the metal body has a cylindrical shape and is attached by fitting into a rod-shaped portion formed on the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8872888U JPH029497U (en) | 1988-07-04 | 1988-07-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8872888U JPH029497U (en) | 1988-07-04 | 1988-07-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH029497U true JPH029497U (en) | 1990-01-22 |
Family
ID=31313289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8872888U Pending JPH029497U (en) | 1988-07-04 | 1988-07-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH029497U (en) |
-
1988
- 1988-07-04 JP JP8872888U patent/JPH029497U/ja active Pending