JPH0356833A - 温度測定センサ - Google Patents
温度測定センサInfo
- Publication number
- JPH0356833A JPH0356833A JP2185462A JP18546290A JPH0356833A JP H0356833 A JPH0356833 A JP H0356833A JP 2185462 A JP2185462 A JP 2185462A JP 18546290 A JP18546290 A JP 18546290A JP H0356833 A JPH0356833 A JP H0356833A
- Authority
- JP
- Japan
- Prior art keywords
- support
- temperature
- conductor tracks
- protective sleeve
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- 230000008054 signal transmission Effects 0.000 claims abstract description 5
- 230000001681 protective effect Effects 0.000 claims description 16
- 238000009529 body temperature measurement Methods 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- -1 polytetrafluoroethylene Polymers 0.000 claims description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000004033 plastic Substances 0.000 abstract description 10
- 229920003023 plastic Polymers 0.000 abstract description 10
- 239000000523 sample Substances 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3923535.1 | 1989-07-15 | ||
| DE3923535A DE3923535C1 (enExample) | 1989-07-15 | 1989-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0356833A true JPH0356833A (ja) | 1991-03-12 |
Family
ID=6385177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2185462A Pending JPH0356833A (ja) | 1989-07-15 | 1990-07-16 | 温度測定センサ |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5037488A (enExample) |
| EP (1) | EP0408823A3 (enExample) |
| JP (1) | JPH0356833A (enExample) |
| DE (1) | DE3923535C1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001050821A (ja) * | 1999-07-21 | 2001-02-23 | Robert Bosch Gmbh | 温度センサ及び温度センサを製造するための方法 |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4418472C2 (de) * | 1994-05-20 | 1998-03-19 | Hartmann & Braun Ag | Sonde zur Temperaturmessung von Gasen oder Flüssigkeiten |
| GB9411160D0 (en) * | 1994-06-03 | 1994-07-27 | Land Infrared Ltd | Improvements relating to radiation thermometers |
| US5726624A (en) * | 1996-07-01 | 1998-03-10 | Honeywell Inc. | Temperature sensor with internal rigid substrate |
| US6123675A (en) * | 1998-10-06 | 2000-09-26 | Trex Medical Corporation | Temperature gradient sensing probe for monitoring hyperthermic medical treatments |
| DE19913195C2 (de) * | 1999-03-24 | 2001-02-15 | Techem Service Ag | Meßeinsatz für Widerstandsthermometer |
| US6383144B1 (en) * | 2000-01-18 | 2002-05-07 | Edwards Lifesciences Corporation | Devices and methods for measuring temperature of a patient |
| DE10029186C2 (de) * | 2000-06-19 | 2002-04-25 | Heraeus Electro Nite Int | Temperatur-Messvorrichtung |
| US6588931B2 (en) * | 2000-12-07 | 2003-07-08 | Delphi Technologies, Inc. | Temperature sensor with flexible circuit substrate |
| US6712772B2 (en) * | 2001-11-29 | 2004-03-30 | Biocontrol Medical Ltd. | Low power consumption implantable pressure sensor |
| JP4009520B2 (ja) * | 2002-11-05 | 2007-11-14 | 日東電工株式会社 | 温度測定用フレキシブル配線回路基板 |
| DE102004026396B4 (de) * | 2004-05-29 | 2007-10-31 | Itw Automotive Products Gmbh & Co. Kg | Vorrichtung zur Messung der Füllstandshöhe und/oder der Temperatur in einem Behälter |
| US7855632B1 (en) | 2005-03-02 | 2010-12-21 | Watlow Electric Manufacturing Company | Temperature sensor and method of manufacturing |
| DE102005030555A1 (de) * | 2005-06-22 | 2007-01-04 | E.G.O. Elektro-Gerätebau GmbH | Sensoreinrichtung für eine Heizeinrichtung |
| US7316507B2 (en) | 2005-11-03 | 2008-01-08 | Covidien Ag | Electronic thermometer with flex circuit location |
| US7997795B2 (en) * | 2006-05-02 | 2011-08-16 | Watlow Electric Manufacturing Company | Temperature sensors and methods of manufacture thereof |
| CN102175336A (zh) * | 2006-06-03 | 2011-09-07 | 精密线性系统股份有限公司 | 温度感测和变送组件、可编程传感器单元及其制造和使用方法 |
| WO2007145913A1 (en) * | 2006-06-05 | 2007-12-21 | Ams Research Corporation | Electrical muscle stimulation to treat fecal incontinence and/or pelvic prolapse |
| DE102006034181B3 (de) * | 2006-07-24 | 2008-04-03 | Siemens Ag | Temperatursensor |
| DE102006037532A1 (de) * | 2006-08-10 | 2008-02-14 | Siemens Ag | Verfahren zur Erzeugung einer elektrischen Funktionsschicht auf einer Oberfläche eines Substrats |
| US7749170B2 (en) | 2007-05-22 | 2010-07-06 | Tyco Healthcare Group Lp | Multiple configurable electronic thermometer |
| US8496377B2 (en) | 2007-12-31 | 2013-07-30 | Covidien Lp | Thermometer having molded probe component |
| DE102008036837A1 (de) | 2008-08-07 | 2010-02-18 | Epcos Ag | Sensorvorrichtung und Verfahren zur Herstellung |
| US8380312B2 (en) | 2009-12-31 | 2013-02-19 | Ams Research Corporation | Multi-zone stimulation implant system and method |
| DE102011103331B3 (de) | 2011-05-27 | 2012-11-29 | Inor Process Ab | Temperaturfühler für ein Kontaktthermometer |
| US9731112B2 (en) | 2011-09-08 | 2017-08-15 | Paul J. Gindele | Implantable electrode assembly |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2886475A (en) * | 1953-02-24 | 1959-05-12 | Warren D Foster | Method of producing an electrical device |
| US2916537A (en) * | 1956-12-27 | 1959-12-08 | Gen Dynamics Corp | Thermocouple element |
| US3521212A (en) * | 1968-06-21 | 1970-07-21 | Texas Instruments Inc | Electric motor protection sensor |
| DE2124465B2 (de) * | 1971-05-17 | 1976-08-26 | Siemens AG, 1000 Berlin und 8000 München | Thermoelektrischer radionuklidgenerator |
| CH571758A5 (enExample) * | 1973-08-30 | 1976-01-15 | Siemens Ag | |
| US4036665A (en) * | 1974-07-16 | 1977-07-19 | Nuclear Battery Corporation | Thermopile for microwatt thermoelectric generator |
| FR2363091A1 (fr) * | 1976-08-27 | 1978-03-24 | Dietrich & Cie De | Capteur ou sonde de temperature |
| US4376927A (en) * | 1978-12-18 | 1983-03-15 | Mcgalliard James D | Printed circuit fuse assembly |
| DE3134166A1 (de) * | 1981-08-28 | 1983-03-10 | Robert Bosch Gmbh, 7000 Stuttgart | Temperaturfuehler |
| GB2209093B (en) * | 1987-08-27 | 1992-04-08 | Stc Plc | Temperature probe |
-
1989
- 1989-07-15 DE DE3923535A patent/DE3923535C1/de not_active Expired - Lifetime
-
1990
- 1990-01-30 EP EP19900101767 patent/EP0408823A3/de not_active Withdrawn
- 1990-06-28 US US07/545,369 patent/US5037488A/en not_active Expired - Fee Related
- 1990-07-16 JP JP2185462A patent/JPH0356833A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001050821A (ja) * | 1999-07-21 | 2001-02-23 | Robert Bosch Gmbh | 温度センサ及び温度センサを製造するための方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3923535C1 (enExample) | 1990-10-31 |
| EP0408823A2 (de) | 1991-01-23 |
| EP0408823A3 (en) | 1991-05-29 |
| US5037488A (en) | 1991-08-06 |
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