JPH0355993B2 - - Google Patents
Info
- Publication number
- JPH0355993B2 JPH0355993B2 JP57148027A JP14802782A JPH0355993B2 JP H0355993 B2 JPH0355993 B2 JP H0355993B2 JP 57148027 A JP57148027 A JP 57148027A JP 14802782 A JP14802782 A JP 14802782A JP H0355993 B2 JPH0355993 B2 JP H0355993B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- metal
- printed circuit
- circuit board
- properties
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 36
- 239000002184 metal Substances 0.000 claims description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 239000011889 copper foil Substances 0.000 claims description 14
- 230000006835 compression Effects 0.000 claims description 6
- 238000007906 compression Methods 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 18
- 229910052742 iron Inorganic materials 0.000 description 9
- 238000005452 bending Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- CYUOWZRAOZFACA-UHFFFAOYSA-N aluminum iron Chemical compound [Al].[Fe] CYUOWZRAOZFACA-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電子機器分野で使用される金属ベース
プリント基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a metal-based printed circuit board used in the field of electronic equipment.
従来例の構成とその問題点
近年、通信機器等のプリント基板には、IC、
LSI等の部品が高密度で実装されてきており、こ
れらの電子部品からの発熱を円滑に放熱するため
に金属ベースプリント基板が提案され、実用段階
にある。一方、上記回路作動時の放熱性以外に、
製造上、回路パターン上に電子部品を塔載する実
装工程に於て、これら電子部品の多くは半田浴を
用いて回路パターン上のランドに半田付けされる
が、例外的に半田耐熱性に欠けるIC、LSI等の一
部電子部品については半田浴後に塔載され、その
端子を熱圧着してランド上の半田を融解すること
により半田付けされる。この工程に於て、絶縁層
が高温、高圧力に耐えランド部と金属ベース間で
シヨートしない金属ベースプリント基板が要望さ
れる。又、さらに上記金属プリント基板を異形加
工（曲げ・絞り加工）して使用することも提案さ
れており、前記耐熱圧着性と異形加工性を同時に
兼ね備えた金属ベースプリント基板が要望されて
いる。Conventional configurations and their problems In recent years, printed circuit boards for communication equipment, etc. are equipped with ICs,
Components such as LSIs are being mounted with high density, and metal-based printed circuit boards have been proposed to smoothly dissipate heat from these electronic components, and are now in the practical stage. On the other hand, in addition to the heat dissipation during circuit operation,
During manufacturing, many of these electronic components are soldered to lands on the circuit pattern using a solder bath during the mounting process where electronic components are mounted on the circuit pattern, but they exceptionally lack soldering heat resistance. Some electronic components such as ICs and LSIs are mounted on the tower after a solder bath, and the terminals are thermocompressed and soldered by melting the solder on the lands. In this process, there is a need for a metal-based printed circuit board whose insulating layer can withstand high temperatures and high pressures and does not cause shortening between the land portion and the metal base. Furthermore, it has been proposed to use the metal printed circuit board after shaping it into a different shape (bending/drawing), and there is a demand for a metal-based printed circuit board that has both the heat-resistant compression bonding properties and shape workability.
従来から金属ベースプリント基板は種々提案さ
れ実用化されているが、上記目的にかなつたもの
は無い。特に銅箔り金属ベースプリント基板の実
用化例として絶縁層に(1)熱硬化性のエポキシ樹脂
系のワニスをガラス布基材に含浸した半硬化状態
のいわゆるプリプレグシートを使用したもの、(2)
無機質無充填のエポキシ樹脂系（ゴム、ナイロン
系添加して変成したもの等）のプリプレグシート
を用いたもの等がある。しかし、(1)の場合、耐熱
クリープ性に優れ熱圧着時に問題はないが、反面
異形加工性（曲げ、絞り加工性）に問題があり、
絶縁層の破壊と共に金属ベース界面で剥離が生ず
る。一方(2)の場合には、比較的接着性、柔軟性が
備わつており異形加工性には問題ないが、反面、
耐熱クリープ性に欠け熱圧着時に半田付けランド
部と金属ベース間でシヨートする欠点があり、
(1)、(2)の例からも明らかなように絶縁層にとつて
異形加工性と耐熱圧着性は相反する特性であり、
この両方を兼ね備えた絶縁層を有する金属ベース
プリント基板は前例が無いように思われる。 Various metal-based printed circuit boards have been proposed and put into practical use, but none have met the above objectives. In particular, practical examples of copper foil metal-based printed circuit boards include (1) semi-cured prepreg sheets, which are made by impregnating a glass cloth base material with thermosetting epoxy resin varnish, as the insulating layer; (2) )
There are those using a prepreg sheet of an epoxy resin type (modified by adding rubber or nylon type, etc.) without inorganic filling. However, in the case of (1), although it has excellent heat-resistant creep properties and poses no problems during thermocompression bonding, it does have problems with shaping workability (bending and drawing workability).
Delamination occurs at the metal base interface along with breakdown of the insulating layer. On the other hand, in the case of (2), it has relatively good adhesiveness and flexibility, and there is no problem in shaping it into different shapes, but on the other hand,
It lacks heat-resistant creep properties and has the disadvantage of being shot between the soldering land and the metal base during thermocompression bonding.
As is clear from examples (1) and (2), shape workability and thermocompression bonding properties are contradictory properties for insulating layers.
There seems to be no precedent for a metal-based printed circuit board having an insulating layer that has both of these characteristics.
発明の目的
本発明はこのような点に鑑みて成されたもので
異形加工性と耐熱圧着性を兼ね備えた銅張り金属
ベースプリント基板を提供することを目的とす
る。OBJECTS OF THE INVENTION The present invention has been made in view of the above points, and an object of the present invention is to provide a copper-clad metal-based printed circuit board that has both shape workability and heat-resistant compression bonding properties.
発明の構成
本発明の金属ベースプリント基板は、基板にア
ルミニウム鉄、銅等の金属板を用い、この金属板
に絶縁層を介して銅箔を貼り合せたものであり、
その絶縁層が異種の２層絶縁層構造を有し、その
第１層絶縁層（金属板に接する絶縁層）が接着
性、柔軟性を備え、異形加工性に優れ、第２層絶
縁層（銅箔に接する絶縁層）が耐熱クリープ性を
備え、耐熱圧着性に優れていることを特徴とする
ものである。Structure of the Invention The metal-based printed circuit board of the present invention uses a metal plate made of aluminum iron, copper, etc. as the substrate, and a copper foil is bonded to this metal plate via an insulating layer.
The insulating layer has a two-layer insulating layer structure of different types, the first insulating layer (the insulating layer in contact with the metal plate) has adhesiveness and flexibility, and has excellent shape processability, and the second insulating layer ( The insulating layer (in contact with the copper foil) has heat-resistant creep properties and is characterized by excellent heat-resistant compression bonding properties.
実施例の説明
以下に本発明を図面と実施例、比較例により具
体的に説明する。第１図に示されるようにアルミ
ニウム、鉄等の金属板１に異種の２層の絶縁層
（第１層絶縁層２、第２層絶縁層３）を介して銅
箔４を貼り合せた構造を有する金属ベースプリン
ト基板であつて、第１層絶縁層２は接着性、柔軟
性を備えた熱硬化性のエポキシ樹脂系の接着シー
ト、ワニス、粉末樹脂等を用いて金属板１上に形
成されるものであり、所定の異形加工を満足する
絶縁層が選ばれる。又、第２既絶縁層３は高い熱
変形温度を備えた熱硬化性のエポキシ樹脂系ある
いは熱硬化性のポリイミド系の接着シート、ワニ
ス、粉末樹脂等を用いて第１層絶縁層２上に形成
されるものであり、所定の熱圧着（例えば半田コ
テ温度；380℃、圧縮圧力；20Kg、時間；８秒）
に耐え得る絶縁層が選ばれる。Description of Examples The present invention will be specifically described below with reference to drawings, examples, and comparative examples. As shown in FIG. 1, a copper foil 4 is bonded to a metal plate 1 made of aluminum, iron, etc. with two different insulating layers (a first insulating layer 2 and a second insulating layer 3) interposed therebetween. The first insulating layer 2 is formed on the metal plate 1 using a thermosetting epoxy resin adhesive sheet with adhesiveness and flexibility, varnish, powdered resin, etc. Therefore, an insulating layer that satisfies the predetermined shape processing is selected. The second insulating layer 3 is formed on the first insulating layer 2 using a thermosetting epoxy resin or thermosetting polyimide adhesive sheet, varnish, powder resin, etc. having a high heat distortion temperature. It is formed by thermocompression bonding (for example, soldering iron temperature: 380℃, compression pressure: 20Kg, time: 8 seconds).
An insulating layer is selected that can withstand
次に第１図の構成による本発明の金属ベースプ
リント基板の一実施例を示してその効果を示す。 Next, an embodiment of the metal-based printed circuit board of the present invention having the configuration shown in FIG. 1 will be shown and its effects will be described.
実施例 １
厚さ35μの銅箔４の一面に耐熱性ビスマレイミ
ド・トリアジン系の変性樹脂（硬化後、380℃、
20Kg、８秒の熱圧着に耐える組成物、第２層絶縁
層３）を塗工し、半硬化状態で20〜60μ程度の厚
みにした。次いで、その上にウレタン変成エポキ
シ系の樹脂（硬化後異形加工に耐える組成物、第
１層絶縁層２）を塗工し、半硬化状態で20〜35μ
の厚みにした。得られた２層絶縁層塗工銅箔４と
鉄板１（1.0〜1.6mmの厚み）を熱プレス法によつ
て接着して金属ベースプリント基板を得た。Example 1 A heat-resistant bismaleimide-triazine-based modified resin (after curing, 380°C,
The second insulating layer 3), which is a composition that can withstand thermocompression bonding at 20 kg for 8 seconds, was applied to a thickness of about 20 to 60 μm in a semi-cured state. Next, a urethane-modified epoxy resin (composition that can withstand irregular processing after curing, first insulating layer 2) is coated on top of it, and in a semi-cured state it has a thickness of 20 to 35 μm.
The thickness was set to . The obtained two-layer insulating layer coated copper foil 4 and the iron plate 1 (thickness of 1.0 to 1.6 mm) were bonded together by a hot press method to obtain a metal base printed circuit board.
比較例 １
実施例１と同様の方法で耐熱性ビスアレイミ
ド・トリアジン系の変成樹脂（第２層絶縁層３）
のみを塗工した銅箔４と鉄板１を貼り合せて第２
図に示すような金属ベースプリント基板を得た。Comparative Example 1 A heat-resistant bis-aleimide/triazine-based modified resin (second layer insulating layer 3) was prepared in the same manner as in Example 1.
Copper foil 4 coated with chisel and iron plate 1 are bonded together to form a second
A metal-based printed circuit board as shown in the figure was obtained.
比較例 ２
実施例１と同様の方法でウレタン変性エポキシ
系の樹脂（第１層絶縁層２）のみ塗工した銅箔４
と鉄板１を貼り合せて第３図に示すような金属ベ
ースプリント基板を得た。Comparative Example 2 Copper foil 4 coated with only urethane-modified epoxy resin (first insulating layer 2) in the same manner as in Example 1
and the iron plate 1 were bonded together to obtain a metal-based printed circuit board as shown in FIG.
実施例１で得られた本発明による金属ベースプ
リント基板は熱圧着に耐え、銅箔４と鉄板１間で
シヨートしなかつた。又、銅箔４を塩化第２鉄を
用いてエツチングにより取り除いた基板で第４図
ａに示されるような90゜曲げ加工、第４図ｂに示
されるような絞り加工に耐えた。しかし、比較例
１では熱圧着に耐えたが、絞り加工で絶縁層の破
壊と鉄板からの剥離が発生した。又、市販されて
いるエポキシ樹脂をガラス布基材に含浸した60〜
100μのプリプレグシートを用いた金属プリント
基板も比較例１と同様の試験結果であつた。一
方、比較例２では曲げ加工、絞り加工に耐えた
が、熱圧着でシヨートが発生した。又、市販され
ているエポキシ樹脂充填の樹脂（30μ）を用いた
金属ベースプリント基板は比較例２と同様の結果
であつた。 The metal-based printed circuit board according to the present invention obtained in Example 1 withstood thermocompression bonding and did not shoot between the copper foil 4 and the iron plate 1. Further, a substrate whose copper foil 4 was removed by etching using ferric chloride withstood 90° bending as shown in FIG. 4a and drawing as shown in FIG. 4b. However, although Comparative Example 1 withstood thermocompression bonding, the insulating layer was destroyed and peeled from the iron plate during drawing. In addition, 60~
A metal printed circuit board using a 100 μm prepreg sheet had the same test results as Comparative Example 1. On the other hand, Comparative Example 2 withstood bending and drawing, but shot occurred during thermocompression bonding. Furthermore, a metal-based printed circuit board using a commercially available epoxy resin-filled resin (30μ) had similar results to Comparative Example 2.
尚、本発明において熱圧着性および異形加工性
（曲げ、絞り加工性）の条件は、その目的によつ
て変えられるものであり、その条件に合致した特
性を有する第１層、第２層絶縁層が選ばれるが、
本質的には、第１層絶縁層に異形加工性を備えさ
せ、第２層絶縁層に耐熱圧着性を備えさせる事に
は変りがない。 In the present invention, the conditions of thermocompression bondability and shape workability (bending and drawing workability) can be changed depending on the purpose, and the first and second layer insulation having characteristics that meet the conditions can be changed. Although the layer is selected,
Essentially, there is no change in the fact that the first insulating layer is provided with shape processing properties, and the second insulating layer is provided with heat-resistant compression bonding properties.
発明の効果
本発明の金属ベースプリント基板は、金属板上
の絶縁層を互いに異なる２層の絶縁層で構成し、
そのうちの金属板に接する第１の絶縁層を接着性
および柔軟性を備え、異形加工性に優れている絶
縁層とし、銅箔に接する第２の絶縁層を耐熱クリ
ープ性を備え、耐熱圧着性に優れている絶縁層と
しているので、耐熱圧着性を保持し、なおかつ異
形加工性の良好なものである。すなわち、これ
は、曲げ加工などを施しても、第２の絶縁層にひ
び割れを生じたりすることがなく、銅箔で構成さ
れる導電体と金属板との間で放電リークが発生す
るようなことおそれがない。Effects of the Invention The metal-based printed circuit board of the present invention has an insulating layer on a metal plate composed of two different insulating layers,
The first insulating layer that is in contact with the metal plate is an insulating layer that has adhesiveness and flexibility, and has excellent shape processing properties, and the second insulating layer that is in contact with the copper foil is an insulating layer that has heat-resistant creep properties and heat-resistant crimp properties. Since the insulating layer has excellent properties, it maintains thermocompression bonding properties and has good shape processing properties. In other words, this means that even when subjected to bending, etc., the second insulating layer will not crack, and will not cause discharge leakage between the conductor made of copper foil and the metal plate. There is no fear.
本発明の金属ベースプリント基板は、その特徴
を生かしICやLSI等の熱圧着半田付け装置に適し
ているだけでなく、鉄ベースプリント基板では絞
り加工してモーターの軸受けと回路基板を共用出
来ると共に、磁気シールド効果も有するものが得
られる。さらに、アルミニウム、鉄ベースプリン
ト基板では、その曲げ加工性を利用してシヤーシ
とし、その上に回路パターンを形成した、いわゆ
る筐体兼回路基板への応用も考えられる。 Taking advantage of its characteristics, the metal-based printed circuit board of the present invention is not only suitable for thermocompression soldering equipment such as ICs and LSIs, but also allows iron-based printed circuit boards to be drawn and used as a motor bearing and a circuit board. , one that also has a magnetic shielding effect can be obtained. Furthermore, aluminum or iron-based printed circuit boards can be used as a chassis by taking advantage of their bending properties, and can also be applied to so-called casing-cum-circuit boards on which circuit patterns are formed.
第１図は本発明の金属ベースプリント基板の一
実施例を示す断面図、第２図および第３図は従来
例あるいは比較例を示す断面図、第４図ａ，ｂは
それぞれ本発明の金属ベースプリント基板に90゜
曲げ加工と絞り加工を施した状態を示す断面図で
ある。
１……金属板、２……第１層絶縁層、３……第
２層絶縁層、４……銅箔。
FIG. 1 is a sectional view showing an embodiment of the metal-based printed circuit board of the present invention, FIGS. 2 and 3 are sectional views showing a conventional example or a comparative example, and FIGS. FIG. 3 is a cross-sectional view showing a state in which the base printed circuit board has been subjected to 90° bending and drawing. 1... Metal plate, 2... First layer insulating layer, 3... Second layer insulating layer, 4... Copper foil.
Claims (1)
る金属ベースプリント基板であつて、前記絶縁層
が異種の２層の絶縁層で構成されていて、前記金
属板に接する第１の絶縁層が接着性および柔軟性
を備え、異形加工性に優れている絶縁層であり、
前記銅箔に接する第２の絶縁層が耐熱クリープ性
を備え、耐熱圧着性に優れている絶縁層であるこ
とを特徴とする金属ベースプリント基板。1. A metal-based printed circuit board formed by bonding copper foil to a metal plate via an insulating layer, wherein the insulating layer is composed of two different types of insulating layers, and a first insulating layer in contact with the metal plate It is an insulating layer that has adhesive properties and flexibility, and has excellent shape processing properties.
A metal-based printed circuit board, characterized in that the second insulating layer in contact with the copper foil is an insulating layer having heat-resistant creep properties and excellent heat-resistant compression bonding properties.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14802782A JPS5936992A (en) | 1982-08-25 | 1982-08-25 | Metal base printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14802782A JPS5936992A (en) | 1982-08-25 | 1982-08-25 | Metal base printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5936992A JPS5936992A (en) | 1984-02-29 |
| JPH0355993B2 true JPH0355993B2 (en) | 1991-08-27 |
Family
ID=15443469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14802782A Granted JPS5936992A (en) | 1982-08-25 | 1982-08-25 | Metal base printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5936992A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61127345A (en) * | 1984-11-26 | 1986-06-14 | 日立化成工業株式会社 | Manufacture of silicon steel plate base copper-lined laminated board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53138056A (en) * | 1977-02-22 | 1978-12-02 | Hitachi Chemical Co Ltd | Method of coating resin layer on printed circuit board metal material substrate having through hole |
| JPS56115600A (en) * | 1980-02-18 | 1981-09-10 | Hitachi Ltd | Method of manufacturing metal coreefilled printed circuit board |
-
1982
- 1982-08-25 JP JP14802782A patent/JPS5936992A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53138056A (en) * | 1977-02-22 | 1978-12-02 | Hitachi Chemical Co Ltd | Method of coating resin layer on printed circuit board metal material substrate having through hole |
| JPS56115600A (en) * | 1980-02-18 | 1981-09-10 | Hitachi Ltd | Method of manufacturing metal coreefilled printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5936992A (en) | 1984-02-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2800550B2 (en) | Manufacturing method of printed wiring board | |
| JP2004274035A (en) | Module having built-in electronic parts and method of manufacturing same | |
| KR20060121081A (en) | Method for mounting electronic component | |
| JPH0355993B2 (en) | ||
| JP4172893B2 (en) | Method for manufacturing metal-based circuit board | |
| JPH0529490A (en) | Circuit board for mounting semiconductor | |
| JPH08264939A (en) | Manufacture of printed wiring board | |
| JPH0491489A (en) | Printed wiring board | |
| JP4591181B2 (en) | Printed wiring board | |
| JPH0521957A (en) | Multilayered copper-clad board | |
| JPS63301593A (en) | Printed circuit board with cross-over circuit | |
| JPS61121496A (en) | Multilayer printed wiring board | |
| JP4187082B2 (en) | Metal base circuit board and manufacturing method thereof | |
| JPS60236279A (en) | Plate for circuit | |
| JP2591447B2 (en) | Multilayer substrate and manufacturing method thereof | |
| JPS60236278A (en) | Plate for circuit | |
| JP4285215B2 (en) | Double-sided copper-clad laminate, method for producing the same, and multilayer laminate | |
| JPH0720626B2 (en) | Manufacturing method of copper clad laminate | |
| JP3227969B2 (en) | Manufacturing method of multilayer laminate | |
| JPS6192848A (en) | Manufacture of laminated board for metallic base printed wiring board | |
| JPH02304961A (en) | Semiconductor device | |
| JP2633286B2 (en) | Manufacturing method of electric laminate | |
| JPS60236280A (en) | Plate for circuit | |
| JP2002271028A (en) | Coil-incorporated multi-layer substrate and its manufacturing method, and manufacturing method for laminated coil | |
| JPS6237996A (en) | Multilayer printed wiring board |