JPH0355556B2 - - Google Patents

Info

Publication number
JPH0355556B2
JPH0355556B2 JP59246853A JP24685384A JPH0355556B2 JP H0355556 B2 JPH0355556 B2 JP H0355556B2 JP 59246853 A JP59246853 A JP 59246853A JP 24685384 A JP24685384 A JP 24685384A JP H0355556 B2 JPH0355556 B2 JP H0355556B2
Authority
JP
Japan
Prior art keywords
metal foil
thickness
pattern
frame
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59246853A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61124600A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP24685384A priority Critical patent/JPS61124600A/ja
Publication of JPS61124600A publication Critical patent/JPS61124600A/ja
Publication of JPH0355556B2 publication Critical patent/JPH0355556B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern

Landscapes

  • ing And Chemical Polishing (AREA)
JP24685384A 1984-11-21 1984-11-21 フレ−ムパタ−ンの形成方法 Granted JPS61124600A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24685384A JPS61124600A (ja) 1984-11-21 1984-11-21 フレ−ムパタ−ンの形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24685384A JPS61124600A (ja) 1984-11-21 1984-11-21 フレ−ムパタ−ンの形成方法

Publications (2)

Publication Number Publication Date
JPS61124600A JPS61124600A (ja) 1986-06-12
JPH0355556B2 true JPH0355556B2 (cs) 1991-08-23

Family

ID=17154685

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24685384A Granted JPS61124600A (ja) 1984-11-21 1984-11-21 フレ−ムパタ−ンの形成方法

Country Status (1)

Country Link
JP (1) JPS61124600A (cs)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013057772A1 (ja) * 2011-10-17 2013-04-25 株式会社 ベアック 孔開き金属箔の製造方法
KR20160058888A (ko) * 2013-09-19 2016-05-25 트레데가르 필름 프로덕츠 코포레이션 포밍 스크린의 제조 방법

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5492527A (en) * 1977-12-28 1979-07-21 Dainippon Printing Co Ltd Manufacture of metal foil having apertures

Also Published As

Publication number Publication date
JPS61124600A (ja) 1986-06-12

Similar Documents

Publication Publication Date Title
JP4534984B2 (ja) 金属フォトエッチング製品の製造方法
DE69233200T2 (de) Selektive Entmetallisierung von Aluminium
DE69218344T2 (de) Herstellungsverfahren für eine gedruckte Schaltung
US4053370A (en) Process for the fabrication of printed circuits
US4651417A (en) Method for forming printed circuit board
DE1057672B (de) Verfahren zur Herstellung eingelegter Stromkreise
US3414487A (en) Method of manufacturing printed circuits
US3415699A (en) Production of etched patterns in a continuously moving metal strip
JP3743702B2 (ja) プリント配線板のセミアディティブ製造法
DE69111003T2 (de) Verfahren unter Verwendung einer permanenten Matrize zur Herstellung von elektrischen Schaltungen.
DE4231535A1 (de) Verfahren zur erzeugung eines leitenden schaltungsmusters
JPH0355556B2 (cs)
JP2004218033A (ja) エッチング製品及びエッチング方法
EP0402377A1 (de) Verfahren zur herstellung eines mit einem prägemuster versehenen metallischen endlosbandes.
US3725215A (en) Filler masking of small apertures
KR19980083162A (ko) 리드프레임의 식각방법
JPH08186373A (ja) プリント配線板の製造方法
KR100203331B1 (ko) 리드프레임의 제조방법
US5210006A (en) Process for preparing mounting tapes for automatic mounting of electronic components
JP2004204251A (ja) 金属エッチング製品及びその製造方法
JPH0529395A (ja) Ｔａｂテープの製造方法
JPS6333582A (ja) エツチング加工方法
DE1954973C (de) Verfahren zur Herstellung von mit einem Metallkern versehenen gedruck ten Schaltungen
JPH0846113A (ja) 部分メッキされた半導体用リードフレームの形成方法
KR100616302B1 (ko) 인쇄회로기판의 제조방법

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees