JPH0355531B2 - - Google Patents

Info

Publication number
JPH0355531B2
JPH0355531B2 JP22017286A JP22017286A JPH0355531B2 JP H0355531 B2 JPH0355531 B2 JP H0355531B2 JP 22017286 A JP22017286 A JP 22017286A JP 22017286 A JP22017286 A JP 22017286A JP H0355531 B2 JPH0355531 B2 JP H0355531B2
Authority
JP
Japan
Prior art keywords
copper
copper alloy
core material
outer skin
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP22017286A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6376774A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP22017286A priority Critical patent/JPS6376774A/ja
Publication of JPS6376774A publication Critical patent/JPS6376774A/ja
Publication of JPH0355531B2 publication Critical patent/JPH0355531B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40Making wire or rods for soldering or welding
    • B23K35/402Non-consumable electrodes; C-electrodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Laminated Bodies (AREA)
  • Powder Metallurgy (AREA)
JP22017286A 1986-09-18 1986-09-18 耐熱高導電性銅合金クラツド材 Granted JPS6376774A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22017286A JPS6376774A (ja) 1986-09-18 1986-09-18 耐熱高導電性銅合金クラツド材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22017286A JPS6376774A (ja) 1986-09-18 1986-09-18 耐熱高導電性銅合金クラツド材

Publications (2)

Publication Number Publication Date
JPS6376774A JPS6376774A (ja) 1988-04-07
JPH0355531B2 true JPH0355531B2 (enrdf_load_stackoverflow) 1991-08-23

Family

ID=16747013

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22017286A Granted JPS6376774A (ja) 1986-09-18 1986-09-18 耐熱高導電性銅合金クラツド材

Country Status (1)

Country Link
JP (1) JPS6376774A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8129036B2 (en) * 2008-05-13 2012-03-06 Hamilton Sundstrand Space Systems International, Inc. High strength and high thermal conductivity heat transfer apparatus
US10300531B2 (en) 2016-02-10 2019-05-28 Luvata Ohio, Inc. Methods of manufacturing composite materials, composite wires, and welding electrodes
CN109825733B (zh) * 2019-03-11 2021-02-19 中南大学 一种弥散强化铜合金的短流程制备方法
CN114959343B (zh) * 2022-05-30 2024-03-29 河南科技大学 一种氧化铝弥散强化铜基复合材料的锻造成型方法、复合坯

Also Published As

Publication number Publication date
JPS6376774A (ja) 1988-04-07

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