JPH0353548Y2 - - Google Patents
Info
- Publication number
- JPH0353548Y2 JPH0353548Y2 JP545687U JP545687U JPH0353548Y2 JP H0353548 Y2 JPH0353548 Y2 JP H0353548Y2 JP 545687 U JP545687 U JP 545687U JP 545687 U JP545687 U JP 545687U JP H0353548 Y2 JPH0353548 Y2 JP H0353548Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrical connection
- connection box
- cover
- main cover
- organic solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003960 organic solvent Substances 0.000 claims description 16
- 238000003780 insertion Methods 0.000 claims description 10
- 230000037431 insertion Effects 0.000 claims description 10
- 238000003466 welding Methods 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 230000013011 mating Effects 0.000 claims description 4
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229920005994 diacetyl cellulose Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- RIOOIQBUNJDFON-UHFFFAOYSA-N methyl 2-methylprop-2-enoate oxolane Chemical compound O1CCCC1.COC(C(=C)C)=O RIOOIQBUNJDFON-UHFFFAOYSA-N 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Landscapes
- Connection Or Junction Boxes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP545687U JPH0353548Y2 (US20020095090A1-20020718-M00002.png) | 1987-01-20 | 1987-01-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP545687U JPH0353548Y2 (US20020095090A1-20020718-M00002.png) | 1987-01-20 | 1987-01-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63117219U JPS63117219U (US20020095090A1-20020718-M00002.png) | 1988-07-28 |
| JPH0353548Y2 true JPH0353548Y2 (US20020095090A1-20020718-M00002.png) | 1991-11-22 |
Family
ID=30787058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP545687U Expired JPH0353548Y2 (US20020095090A1-20020718-M00002.png) | 1987-01-20 | 1987-01-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0353548Y2 (US20020095090A1-20020718-M00002.png) |
-
1987
- 1987-01-20 JP JP545687U patent/JPH0353548Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63117219U (US20020095090A1-20020718-M00002.png) | 1988-07-28 |
