JPH0352128B2 - - Google Patents
Info
- Publication number
- JPH0352128B2 JPH0352128B2 JP60206791A JP20679185A JPH0352128B2 JP H0352128 B2 JPH0352128 B2 JP H0352128B2 JP 60206791 A JP60206791 A JP 60206791A JP 20679185 A JP20679185 A JP 20679185A JP H0352128 B2 JPH0352128 B2 JP H0352128B2
- Authority
- JP
- Japan
- Prior art keywords
- alumina
- substrate
- film
- less
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 89
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 53
- 238000000034 method Methods 0.000 claims description 24
- 230000003746 surface roughness Effects 0.000 claims description 22
- 229910010293 ceramic material Inorganic materials 0.000 claims description 15
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 6
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 4
- 239000000725 suspension Substances 0.000 claims description 4
- 239000010408 film Substances 0.000 description 43
- 238000005498 polishing Methods 0.000 description 31
- 239000000463 material Substances 0.000 description 15
- 239000000919 ceramic Substances 0.000 description 13
- 229910000838 Al alloy Inorganic materials 0.000 description 12
- 238000004544 sputter deposition Methods 0.000 description 12
- 239000010409 thin film Substances 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 239000013078 crystal Substances 0.000 description 9
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 239000011148 porous material Substances 0.000 description 6
- 239000000956 alloy Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 238000001513 hot isostatic pressing Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000003966 growth inhibitor Substances 0.000 description 1
- JEGUKCSWCFPDGT-UHFFFAOYSA-N h2o hydrate Chemical compound O.O JEGUKCSWCFPDGT-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Magnetic Record Carriers (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20679185A JPS6266419A (ja) | 1985-09-18 | 1985-09-18 | 磁気ディスク用基板及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20679185A JPS6266419A (ja) | 1985-09-18 | 1985-09-18 | 磁気ディスク用基板及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6266419A JPS6266419A (ja) | 1987-03-25 |
| JPH0352128B2 true JPH0352128B2 (de) | 1991-08-09 |
Family
ID=16529152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20679185A Granted JPS6266419A (ja) | 1985-09-18 | 1985-09-18 | 磁気ディスク用基板及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6266419A (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02154309A (ja) * | 1988-12-07 | 1990-06-13 | Tdk Corp | 薄膜磁気ヘッド用基板の製造方法 |
| JPH0577287U (ja) * | 1992-03-26 | 1993-10-22 | 浩一 松岡 | 靴下用編地の収容装置 |
| JP2515842Y2 (ja) * | 1992-08-07 | 1996-10-30 | 浩一 松岡 | 靴下編地収容器 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4838107A (de) * | 1971-09-13 | 1973-06-05 | ||
| JPS60138730A (ja) * | 1983-12-27 | 1985-07-23 | Kyocera Corp | 磁気デイスク用基板 |
-
1985
- 1985-09-18 JP JP20679185A patent/JPS6266419A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4838107A (de) * | 1971-09-13 | 1973-06-05 | ||
| JPS60138730A (ja) * | 1983-12-27 | 1985-07-23 | Kyocera Corp | 磁気デイスク用基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6266419A (ja) | 1987-03-25 |
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