JPH0351113Y2 - - Google Patents
Info
- Publication number
- JPH0351113Y2 JPH0351113Y2 JP1983151746U JP15174683U JPH0351113Y2 JP H0351113 Y2 JPH0351113 Y2 JP H0351113Y2 JP 1983151746 U JP1983151746 U JP 1983151746U JP 15174683 U JP15174683 U JP 15174683U JP H0351113 Y2 JPH0351113 Y2 JP H0351113Y2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- magnet
- workpiece
- magnetic
- chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15174683U JPS6061187U (ja) | 1983-09-29 | 1983-09-29 | 磁性物品のチヤツク装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15174683U JPS6061187U (ja) | 1983-09-29 | 1983-09-29 | 磁性物品のチヤツク装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6061187U JPS6061187U (ja) | 1985-04-27 |
JPH0351113Y2 true JPH0351113Y2 (enrdf_load_stackoverflow) | 1991-10-31 |
Family
ID=30336185
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15174683U Granted JPS6061187U (ja) | 1983-09-29 | 1983-09-29 | 磁性物品のチヤツク装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6061187U (enrdf_load_stackoverflow) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5426263U (enrdf_load_stackoverflow) * | 1977-07-25 | 1979-02-21 |
-
1983
- 1983-09-29 JP JP15174683U patent/JPS6061187U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6061187U (ja) | 1985-04-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3868764A (en) | Multiple magnetic alignment of semiconductor devices for bonding | |
TW201703957A (zh) | 切削裝置 | |
JPS618234A (ja) | 電気部品を配向するヘツド及び方法 | |
JPH0351113Y2 (enrdf_load_stackoverflow) | ||
CN216421545U (zh) | 一种便捷的焊线辅助夹具结构 | |
JPH05220634A (ja) | 部品組立装置 | |
JP4152201B2 (ja) | バックアップ装置および表面実装機 | |
GB1529857A (en) | Semiconductors | |
JP3416919B2 (ja) | チップを収納したパッケ−ジのキャップ仮止め用治具とキャップ接合装置およびその方法 | |
JPH0631457A (ja) | マイクロパラレルシーム接合装置 | |
JPS62195141A (ja) | ペレツト移送装置 | |
JPH06104347A (ja) | 半導体パッケージのキャップ仮止め用治具 | |
CN210040278U (zh) | 一种电池盖板加工装置 | |
JPS59117231A (ja) | 平面合せ機構 | |
JPS595250U (ja) | ワ−ク交換装置 | |
JPH01182210A (ja) | 電子部品のマガジン装▲填▼装置 | |
JPS56130935A (en) | Inspecting device | |
JPS6120396A (ja) | 予備はんだ付け装置 | |
JP2513670Y2 (ja) | 水平搬送ic搬送装置のデバイスコンタクトユニット | |
JP2557433B2 (ja) | ペレットマウント装置 | |
JPH0429563Y2 (enrdf_load_stackoverflow) | ||
JPH02212031A (ja) | マグネットチャック | |
JPS60142027U (ja) | 自動組立装置 | |
JPH06112340A (ja) | シーム接合装置 | |
JPS6245136A (ja) | 支持治具およびこの支持治具を組み込んだワイヤボンデイング装置 |