JPH0350627Y2 - - Google Patents
Info
- Publication number
- JPH0350627Y2 JPH0350627Y2 JP1987067349U JP6734987U JPH0350627Y2 JP H0350627 Y2 JPH0350627 Y2 JP H0350627Y2 JP 1987067349 U JP1987067349 U JP 1987067349U JP 6734987 U JP6734987 U JP 6734987U JP H0350627 Y2 JPH0350627 Y2 JP H0350627Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- case
- connection
- external conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 35
- 238000005192 partition Methods 0.000 claims description 18
- 238000003780 insertion Methods 0.000 description 11
- 230000037431 insertion Effects 0.000 description 11
- 238000005476 soldering Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000000630 rising effect Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229920005669 high impact polystyrene Polymers 0.000 description 1
- 239000004797 high-impact polystyrene Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987067349U JPH0350627Y2 ( ) | 1987-05-02 | 1987-05-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987067349U JPH0350627Y2 ( ) | 1987-05-02 | 1987-05-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63176286U JPS63176286U ( ) | 1988-11-15 |
JPH0350627Y2 true JPH0350627Y2 ( ) | 1991-10-29 |
Family
ID=30906175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987067349U Expired JPH0350627Y2 ( ) | 1987-05-02 | 1987-05-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0350627Y2 ( ) |
-
1987
- 1987-05-02 JP JP1987067349U patent/JPH0350627Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS63176286U ( ) | 1988-11-15 |
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