JPH03505551A - Transfer fixture and method for printed circuit boards - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] Transfer for printed circuit board Fixtures and methods [Related applications] This application is based on Patent Application No. 214.380 filed on July 1, 1988 and ``Apparatus and apparatus for manufacturing printed circuit boards'' filed on the same day by the same inventor as the application. This is a continuation-in-part of U.S. patent application Ser. these The applications have the same assignee. These applications are incorporated herein by reference. Ru.

[Industrial application field]

The present invention provides uniform adhesion of one to the other over the secondary and 3-dimensional surfaces of the substrate. A pressure transmission device that brings uniform transfer pressure of the conductor to the substrate to obtain and Regarding the method. The conductor is preferably a printed circuit placed on a mold release agent.

[Conventional technology]

The field of technology involves the transfer of conductors into substrates used to form circuit boards. Concerns forming circuit boards by techniques other than blow molding. The relevant technology The field is primarily concerned with the lamination of multilayer circuit boards.

For example, U.S. Pat. No. 4,029,845 relates to thermosetting resins, in which and pressure are used to form composite circuit boards. This document molds the substrate It only discloses that it will mold printed circuit elements on its substrate. This is not taught. This document describes how to use printed circuit boards without explaining its teachings. It refers to the additional steps involved in manufacturing.

U.S. Pat. No. 4,180.608 uses heat and heat to form composite printed circuit boards. It teaches that pressure and pressure can be used. However, in this literature, the main A single layer of resin carrier is used rather than a printed circuit as in the invention. lamination The plate is formed as taught in the art.

As an example of a method and apparatus for reserving molded structural parts, U.S. Patent No. 3.642.41 No. 5, No. 3.669,806 and No. 4.243.368 are plastic teaches a diaphragm used to form sheet materials. pressure is a fluid It is transmitted using No. 3,669,806, this document states that It does not teach adhesion of conductors to substrates.

No. 3,669.806, the technology ensures the interlocking of the constituent materials. However, it does not teach the present invention.

U.S. Pat. No. 4,148,597 describes the application of fluid pressure to silicone rubber molds. teaches the use of fluid pressure molds to form profiles. US Patent No. 3 ．． No. 255,476 teaches a press for irregular shaped products.

U.S. Patent No. 4,729,730 uses superplastic alloys as pressure transmission materials. teaches a pressure transmission device for use.

The device is designed to prevent the alloy material from spreading upon failure of the device. Said Cite all documents as references.

The present invention overcomes the shortcomings of the prior art and is suitable for substrates, especially substrates with complex shapes. relates to laminating printed circuits onto materials.

[Summary of the invention]

The present invention (a) a first cap substantially confining a mold that is a mirror image of a substrate surface in at least two dimensions; a first surface plate having a fluid-filled bellows with a bite; (b) a second cavity having dimensions such that a portion of the thickness of the base material protrudes; Surface plate: (C) a pressure means for compressing the conductor overlaid on the substrate surface; and (d) comprising at least a laminating means for adhering the conductor to the substrate surface; This invention relates to a uniform pressure transmission device for uniformly laminating conductors on the surface of a two-dimensional base material.

The present invention also provides (a) a first cap substantially confining a mold that is a mirror image of a substrate surface in at least two dimensions; a first surface plate having a fluid-filled bellows with a bite; (b) a second cavity having dimensions such that a portion of the thickness of the base material protrudes; Surface plate; (c) pressure means for compressing the printed circuit placed on the substrate surface; and (d) consisting of a laminating means for adhering the printed circuit to the substrate surface; Uniform pressure transmission for uniformly laminating printed circuits on at least two-dimensional substrate surfaces. Regarding the sending device.

The present invention further provides for inserting substantially a portion of the thickness of the substrate into the cavity of the surface plate; A conductor is placed on the surface of the material to substantially form a mold that is a mirror image of the surface of the substrate in at least two dimensions. Other surface plates with fluid-filled bellows containing other cavities that limit Apply uniform pressure to the conductor and base material surface using for uniformly laminating conductors on at least two-dimensional substrate surfaces Regarding the method.

The present invention also includes inserting a substantial portion of the thickness of the substrate into the cavity of the surface plate, and Place a printed circuit on a surface to create a mold that is a mirror image of the substrate surface in at least two dimensions. Others have bellows filled with fluid containing other cavities that are qualitatively restrictive. Use a surface plate to apply uniform pressure to the printed circuit and substrate surface, and then a printed circuit on a substrate surface in at least two dimensions; This invention relates to a method for uniformly stacking lint circuits.

The present invention further provides a first surface plate having a cylinder having a plurality of diaphragms. Thus, one diaphragm separates the internal volume of the cylinder, and the other diaphragm separates the internal volume of the cylinder. is placed in the form of a mold at the end of the cylinder adjacent to another surface plate, and the mold has at least a secondary is a mirror image of the original substrate surface and is implemented in the cavity at the end of the cylinder. Qualitatively limited, the cylinder volume located adjacent to one surface plate is assembled and the fluid medium occupying this volume is heated, pressurized, and then heat and pressure are applied. arranged to be transferred to another volume adjacent to the end of the cylinder; One surface plate contains another cavity dimensioned to protrude part of the thickness of the substrate. It consists of a small amount of laminating means for adhering the conductor to the substrate. Uniform pressure transmission device for uniformly layering conductors on at least two-dimensional base material surface related.

The present invention also provides a first surface plate having a cylinder having a plurality of diaphragms. one diaphragm separates the internal volume of the cylinder, and the other diaphragm separates the internal volume of the cylinder. placed in the form of a mold at the end of a cylinder adjacent to another surface plate, the mold being at least two dimensional is a mirror image of the substrate surface, and substantially in the cavity at the end of the cylinder. The cylinder volume located adjacent to one surface plate is assembled , and the fluid medium occupying this volume is heated, pressurized, and then heat and pressure are applied to the system. Arranged to transfer to another volume adjacent to the end of the Linder, the other The surface plate may also contain another cavity dimensioned to protrude part of the thickness of the substrate. It also consists of a laminating means for adhering the printed circuit to the substrate. A uniform method for evenly laminating printed circuits on at least two-dimensional substrate surfaces. It relates to a pressure transmission device.

The present invention also provides that substantially the thickness of the substrate in at least two dimensions is in the cavity of the surface plate. Insert the part, place the conductor on the substrate surface, and have the cylinder connected to it. another surface plate, the cylinder containing a plurality of diaphragms, one of which is a mold, which is a mirror image of the substrate surface to form the conductor and the substrate surface. Applying uniform pressure to the surface, it allows the rimmed cylinder volume, separate surface plate and heating and pressurizing the fluid in a separate diaphragm, thereby Apply heat and pressure to the conductor volume and diaphragm, and then apply the conductor to the substrate surface. In order to uniformly laminate conductors on the surface of at least two-dimensional substrates, Regarding the method of

The present invention also provides that substantially the thickness of the substrate in at least two dimensions is in the cavity of the surface plate. Insert the part, place the printed circuit on the substrate surface, and attach the cylinder to it. another surface plate having a cylinder containing a plurality of diaphragms, the cylinder having a plurality of diaphragms; One of these is a mold, which is a printing process using something that is a mirror image of the surface of the substrate. Provides uniform pressure on the channel and substrate surface, thereby increasing the circumscribed cylinder volume , heats and pressurizes the fluid in another surface plate and another diaphragm, thereby Apply heat and pressure to the taken cylinder volume and diaphragm, and a substrate surface in at least two dimensions, consisting of laminating a lint circuit onto the substrate surface; This invention relates to a method for uniformly stacking printed circuits.

[Brief explanation of the drawing]

The invention is illustrated with the aid of schematic diagrams and drawings showing test results of the apparatus and method of the invention. Ru. These drawings are merely illustrative. These do not limit the invention .

Figure 1 also shows the bellows and diaphragm used to transmit pressure. It is.

Figure 2 shows the cylinder and diaphragm assembly used to transmit pressure. This shows the combination.

FIG. 3 shows a printed circuit on a substrate.

Figures 4A and 4B illustrate Applicant's earlier press and transfer method. The $4B diagram also shows pins for aligning the conductor on the base material. This indicates the use of

FIG. 5 is manufactured using the press and method shown in FIGS. 4A and 5A. This figure shows the results of an adhesion test conducted on a conductive surface bonded to a substrate. .

FIG. 6 shows a press and transfer method of the present invention.

Figure 7 shows the results obtained for a composite plate manufactured according to the press and method shown in Figure 6. This figure shows the results of an adhesion test.

[Detailed description of the invention]

In order to obtain uniform solder bond strength, the present invention utilizes a conductor or Uniform pressure transfer device for transferring printed circuits to substrates and on methods. The difficulty in obtaining uniform transfer pressure is that the substrate is two-dimensional. It is even greater when it is three-dimensional rather than .

Applicant's invention is based on a silicone or or other elastomeric diaphragms. This diaphragm is fluid, flowing bellows containing elastic powder, gel or deformable elastomeric powder, preferably is placed at the bottom of the metal bellows. The contents of the bellows are pressurized and the diaphragm The particles uniformly form vertical or nearly vertical protrusions on the substrate. pressure cadmium transfer medium The body can be heated using rod heaters or by heat transfer between platens.

This technique creates bags filled with hot, pressurized fluid or jet fluid that can rupture. The danger of use by workers is removed.

Another aspect involves using a cylinder with a lower diaphragm. S The lower part of the linder contains the fluid described above. The top of the cylinder was pumped contains fluid and is connected to the lower part or is separated from the lower section.

The invention involves molding a silicone mold at the end of the cylinder. Book The invention also includes placing a substantial portion of the thickness of the substrate in the cavity of the surface plate. do.

The conductor can include circuitry alone or in combination with other components. for example adhesives, solder masks, graphics and/or transfer media. Ru.

Lamination of conductor on base material At least the adhesive covers the peeling surface that carries the circuit covered by the adhesive. contact with a substrate such that the circuit is adjacent to the surface of the substrate separated from the substrate. Figure 3 or using the apparatus shown in FIG. Apply pressure, which causes the adhesive to react. In other words, the circuit can be traced away from the peeled surface. spread and adhere to the substrate surface. In some cases, partial hardening and/or only reactions need be carried out. The peeled surface is then separated from the composite structure. be separated.

The peeling surface and the base material surface are about 100°C to about 230°C1, preferably 140°C to 19 Contact is made at a temperature in the range of 0°C. Approximately 200psi - approximately 1,200psi on both sides , preferably in the range of 500 psi to 700 psi, enough to cause deformation of the component. should be brought into contact with moderate pressure. A pressure of 600 psi is preferred. Depending on the case Alternatively, the substrate may be preheated to prevent deformation. The pressure is about 0.25-5 It can be applied for 3 minutes, preferably 3 minutes.

In another embodiment, when the composites are molded, they are removed from some of the printed circuits during lamination. is subjected to sufficient pressure to cause such compression. This is further It increases the density of the tracks and improves their conductivity. With this kind of compression. i.e. , the fine edges achieved when printing electrical circuits are maintained. preferably is compressed by 25-40% of the original printed electrical path thickness.

With respect to simplicity, ease of operation, practical use and performance, the present invention It overcomes shortcomings in circuit manufacturing.

Base material surface The substrate may be any known dielectric, i.e., insulating or non-conductive substrate. stomach. The related applications cited above describe suitable examples that can be used in the present invention. A detailed list of substrates is provided. Suitable substrates include thermosetting and thermoplastic materials. and those manufactured from mixtures thereof. Preferred substrates are shown below. vinegar. These have two-dimensional or three-dimensional surfaces.

Thermoplastic materials generally require more complex chemistries than traditional thermoset printed circuit board laminates. physical, thermal and mechanical behavior. This is important when selecting materials for printed circuit applications. Make the choice very critical. Currently, there are only one or two types of resin systems. exhibiting desirable property values, which generally make them good candidates for printed circuit supports. It lacks the balance of overall characteristics. Resin deficiencies are easily revealed during assembly operations This typically results in substrate warping, bubbling, dimensional instability and printed circuit delamination. Ru.

In order to meet this demand, the present inventors developed an resin called polyarylsulfone resin. Use engineering resin. These resins have excellent dimensional stability and warpage resistance. Highly desirable for circuit board applications where adhesive and adhesive circuits and substrates are required. It shows a good balance of characteristics.

Polyarylsulfone resins inherently have high heat deflection temperatures, excellent dimensional stability, Characterized by creep resistance, low AC dielectric loss properties and high mechanical strength.

Typical characteristic values of polyaryl sulfone resin Typical properties tensile strength psi 13.400 elongation at break % 2.2 Tensile modulus ps i 892, 000 bending strength psi 19,3 00 Heating deflection temperature 00 215 Density gm/ cc 1.55AC dielectric constant dielectric constant 60 Hz 3.861 KHz 　　　　　　　　　　3.85 Dissipation factor 60 Hz 0.00421 KHz 0.0035 withstand voltage l/8# test piece Porto/mil 398-550 injection molding Polyarylsulfone resins are easily processed using standard injection molding machines and methods be done. For optimal performance, the resin is dried in a dehumidifying hopper dryer or or dry in an air-circulating oven. The temperature at the air inlet is 149-1 Preferably use a hopper dryer at 63°C with an outlet temperature of 135°C or higher. stomach. When using a shelf dryer, it is necessary to spread the pellets to a depth of 1 to 2 cm. be. In all cases, the pellets were heated to a minimum temperature of 135°C for 3-4 hours. It is important to reach and maintain this degree. The dried resin is immediately molded and and must be handled carefully to prevent re-absorption of moisture.

Due to the rheological properties of polyarylsulfone resins, they are typically used in printed wiring boards, For filling thin and complex wall sections in chip carriers and related equipment. Provides excellent flow. The resin has a material temperature in the range of 360-382℃ (wave Soldering grade) is easily processed.

For molding resins that can be wave soldered, typically 110 to 1 A molding temperature of 57°C is used. Clean polyarylsulfone resin scrap Powder again if it is properly dried and stored free of dirt. It can be crushed and used for manufacturing.

Polyarylsulfones are dimensionally stable materials both before and after the transfer process. Provides free molding. The transferred circuit is transferred to resin at the same time. It shows a strong adhesive force and the adhesive force is maintained until the next wave soldering process. hold

Used with thermoplastics and/or thermosets to produce printed circuit boards. Additives that may be used include reinforcing and/or non-reinforcing fillers such as Tonite, asbestos, tar, alumina, clay, mica, glass beads, aluminum umed silica, gypsum, etc.; and reinforcing fibers such as aramid, boron, carbon, etc. Contains graphite and glass. Glass fiber is Chogged Strand in the form of milled or milled strands, ribbons, threads, filaments or matte fabrics It is the most widely used reinforcing agent. mixtures of reinforcing and non-reinforcing fillers, For example, using a mixture of glass fiber and talc or wollastonite. I can do it. These reinforcing agents are used in amounts of about 10 to about 80% by weight, while non- Reinforcing fillers are used in amounts up to 50% by weight. Other additives include stabilizers, pigments, Includes flame retardants, plasticizers, processing aids, coupling agents, lubricants, mold release agents, etc.

These additives are used in amounts to achieve the desired results.

polyaryl sulfone Polyarylsulfone is a preferred thermoplastic polymer substrate of the present invention. it is The following formula (In the formula, R6s is independently hydrogen, c, -c, alkyl, c, -c.

cycloalkyl, Inspection.

(Here, R688 and R5 are independently hydrogen or 01 to C, and Aln is independently is an integer from 1 to 3, and the structural unit (I) and the structural unit (I[) and/or The ratio to the sum of (III) is larger than l). It is a high quality thermoplastic polymer. These structural units are bonded to each other with 10-bonds. There is.

Preferred polymers of the present invention have the following formula: Contains the structural unit represented by

Another preferred polyaryl sulfone of the present invention contains a structural unit represented by the following formula: do. These structural units are bonded to each other through 10-bonds.

Polyarylsulfones can have random or regular structures . The polyarylsulfones of the present invention have a reduced viscosity (N-methane) of about 0.4 to 2.5. (measured at 25°C in tilpyrrolidone or other suitable solvent).

Lamination equipment One aspect of the invention is a bellows that helps apply uniform pressure to the surface of the substrate. It concerns the use of.

This surface can be two-dimensional or three-dimensional. hand as shown in Figure 1. The arranged bellows ensure uniform transfer of the conductor or printed circuit onto the mold release agent. Helps apply pressure to the substrate. Applying such uniform transfer pressure This is particularly difficult when the circuit substrate is three-dimensional. In the schematic diagram of Figure 1 As shown, hot platen 10 has bellows 11 coupled thereto. bellows can be manufactured from metal filled with conventional fluids. Bellows, of course In addition to the above-mentioned fluids, it also includes flowable powders, gels, or deformable elastomeric powders. It may also contain powder. The diaphragm 12 has a bellows connection. diaphragm The membrane is confined within the cavity and is a mirror image of the substrate surface to which the electrical circuit is coupled. Constructed from a silicone elastomer mold. Preferably the base is silicone. or another elastomer with the same profile as the two-dimensional or three-dimensional substrate. can be a sexual diaphragm. During compression, the mold moves transversely to the direction of compression. is positioned such that pressure is avoided to the extent that uniform pressure is applied to the substrate surface.

That is, the type is substantially limited.

A silent disc 13 with a cavity J4 is also shown in FIG. into the cavity Substantially a portion of the substrate 15 is inserted. The substrate deforms or transversely during compression. The substrate should protrude as much as necessary so that it cannot move. Therefore Thus, the cavity substantially confines the substrate.

FIG. 1 further shows a mold release agent 16 located between the diaphragm 12 and the base material 15. show.

In operation, substrate 15 is inserted into cavity 14.

Preferably, the hot platen 10 has a mold release agent 16 between the diaphragm or the mold 12 and the base material 15. After the bellows 11 is placed on the heating plate 13, the bellows 11 approaches the hot platen 13. The bellows are A uniform pressure is applied to the diaphragm or mold 12, which then presses against the surface of the substrate 15. Apply uniform pressure to the The heat that can be supplied by any conventional equipment is Provides uniform adhesion with the surface of the substrate. In addition, the pressure cadence transfer medium is a rod-shaped heater. heating, especially around the substrate surface, using a heater or by heat transfer between surface plates. can do. Groups supported by release or transfer media or paper The essential components are conductors and adhesives. Preferably other components are present . These are the graphics or Includes instructions, solder masks, printed circuits and adhesives. Components of the former is an informative or educational text applied to the substrate. This transfer The medium facilitates the manufacture of circuit boards in a rapid manner. However, one or more structures The components can be applied separately to the substrate. For example, text can be placed directly on the circuit board. or multilayer transfer of circuits to the same substrate.

In another aspect of the invention, a cylinder is used to apply uniform pressure to the substrate surface. and diaphragm combinations are used. This is shown in Figure 2. Ru.

As is clear from this figure, the hot platen 17 has a cylinder 18 fixed to it. Ru. The cylinder contains two diaphragms. One of the diaphragms is a cylinder an independent pressurized fluid separating the pressurized fluid contained in the portion 20 of the tank 18; The fluid can be a polyglycol.

Fluid enters at 21, exits at 22, and can be recirculated. Of course, this The fluid can be heated using conventional equipment, not shown. Diaph The ram 23 is placed at the distal end of the cylinder providing the second portion 24 of the cylinder 18. Ru. This second part may be a flowable powder, a gelling fluid, silica gel or a deformable elastomer. Contains stomerable powder. This latter medium is passed through the diaphragm from the top of the cylinder. transfer the pressure exerted through the membrane 19. The diaphragm 23 is placed at the terminal position of the conductor 18. The diaphragm is preferably as in the embodiment described above. composed of silicone elastomer and having the same contour as the surface of the substrate 15 Ru. A mold release agent 16 is overlaid on the substrate 15 prior to bonding. Of course I'll peel it off. The media or paper that is used is removed after the printed circuit is laminated onto the substrate as in the previous embodiment. be done. As in the previous embodiment, the substrate 15 is located in the cavity 2 located in the hot platen 26. It is inserted in 5.

In operation, substrate 15 is inserted into hot platen 26 . The release paper is on the surface of the base material 15 placed in alignment with Cylinder 18 approaches the substrate. The diaphragm is When in contact with the material 15, the pressurized fluid in the section 20 of the cylinder 18 causes pressure and and heat act. This heat and pressure is transferred to the cylinder via an independent diaphragm 19. -18 to the medium in section 24. This is then applied to the base material 15. Applying uniform pressure over the entire surface and uniformly around the surface of the substrate, especially around the substrate 15 to help laminate printed circuits.

Throughout, embodiments of the invention provide rupturable hot pressurized or jet fluids. The technology provides a non-hazardous technique in which workers use bags filled with Ru.

Visible Transferring a circuit onto a flat or three-dimensional substrate to the extent that the surface is “developable” You can perform

For example, three-dimensional circuits can be transferred to injection molded substrates. .

The use of the process for the circuit printing process and the injection molded substrate Such a tertiary with high volume allows cost-effective utilization of the efficiency of use. It is intended for original type equipment.

In particular, flat or shallow three-dimensional circuit boards can be effectively manufactured using this method. can. We also modified the method somewhat to create a series of molded plastic chip carriers. can be tooled and manufactured. These plastic tip carriers The layer utilizes a pre-formed thermoplastic substrate and a trans7 air process. to provide a conductor, which is then used to facilitate wiring connections and soldering. It is plated on the surface.

These chip carriers are made from the same resin systems used in circuit boards. and when they are used together, the chip carrier and the circuit board There is no thermal inconsistency between

Automotive applications include molding circuits onto the inner roof of automobiles that contain interior lighting circuits. Ru.

〔Example〕

The present invention will now be described using examples of the above teachings. These examples are illustrative only. However, it is not exclusive.

The present invention is not limited thereto. Unless otherwise specified, concentrations are expressed in % by weight.

Example 1 The following ingredients were mixed together at room temperature: (I) Polyhydroxyether known as phenoxy PKFE 1 ．． 81% by weight, (I[) 3,4-epoxy resin known as epoxy ERL-4221 Chlorhexylmethyl 3.4-epoxycyclohexylcarboxylate 2.7 5% by weight, and (n[) known as butylcarpitol acetate. Diethylene glycol monobutyl ether acetate 8.47% by weight.

The following ingredients were added to this mixture: (■) METZ EG200ED (Metz Metalurgtca 82.62% by weight of silver powder known as Known as ETZ 50S (manufactured by Metz Metalurgica 1) Silver flakes 4.35% by weight.

In more detail, diethylene glycol monobutylene is added to the phenoxy resin while stirring. dissolved in ether acetate. Add epoxy to this mixture while continuing to stir. Added resin. Then, while continuing to stir, add silver powder to the mixture; Dispersion was performed up to a Hegman grind of 6. Then silver Add flakes, also dispersed to a grind of 6 or more. viscosity of mixture Pruxfield RVT using No. 6 spindle at lt20rpm When measured using a viscometer at 24°C, it was 35,000 cps. 2 ．． The viscosity ratio of 5/2Qrpm is 4.

The conductive metal and binder are mixed together and thoroughly homogenized to produce the ink. Ta.

This conductive ink was applied to VNS super matte release paper (S, D) using conventional techniques. , made by Warren Co.) and screen pre-printed to a thickness of approximately 1 mil after drying. I tried it.

Dry the printed paper for 10 minutes at 96°C in a forced convection oven and add the following ingredients: Manufactured adhesive containing: Product name Chemical name NEW (weight%) Phenoxy PKFE Polyhydroxy ether 18.99 regimen 2040 Melamine Formaldehyde o, 95 Butyl Carpitot Diethylene Glycol Mono 75. 96 acetate Butyl ether acetate black 5APL Nigrosin Black 0.91 Benzoic Acid Benzoin Acid 0.05CABO5IL Silica 3.86 Manufacturing of adhesive Diethylene glyco by high speed mixing of polyhydroxy ether or phenoxy resin All resin particles were dissolved in monobutyl ether acetate. . Melamine formaldehyde resin was then added. Nigrosin Black and Rest The aromatic acid was mixed together and then added with high shear stirring. Next is the large surface area. The silica was then added with high shear mixing. The entrained air was removed in vacuo.

No. 5 spindle at 20 rprn to 24°C using an RVT viscometer. The viscosity of the adhesive composition was 35,000 cps, measured at 2. The viscosity ratio at 5/20 rpm was 4.

The preferred adhesive is aligned to the top of the already dried printed circuit conductor surface. and screen printed. The adhesive-coated circuit is then heated to 96°C. The adhesive coating was placed in a controlled convection oven for 10 minutes to dry, but was not completely cured. It was.

The base material is the following formula N-methyl-pyrrolidinone C at 25°C. Reduced viscosity measured in 0.2 g/100+ff) is 0.61 d12/g The composition was prepared from a composition containing 78% by weight of the polymer. This composition further 10% by weight mica and 10% by weight Owens obtained from Corning. Contains chopped glass fiber.

The base composition was injection molded in a conventional manner. 6×6 play whose thickness is 0.06″ molded. The melt temperature is 3770C and the molding temperature is 305”F. It was. The injection speed was 35 mm/s, and the injection molding pressure was 100 bar for 7 seconds. It was le.

The base sheet was steam polished using methylene chloride for about 1 second. The base material is a conductor (when dry) 4 and 6 using release paper containing a film thickness of 1.0 to 1.2 mils). Place it in a compression platen press such as The dry film thickness was 0.6-0.8 mil). A die as shown in each figure is placed on one of the surface plates. Installed with yafram or bellows. Next, after peeling off the release paper, apply 1 Molding was performed at 600 psi for 3 minutes at 77°C.

The circuit board was then cured in an oven at 150° C. for 30 minutes.

After curing, the circuit board can be soldered manually using a soldering iron or at a transport speed of 6 feet. / minute, wave soldering set at 246℃ can be soldered using a machine. can.

The electrical resistance of the serpentine square pattern was measured using a milliohmmeter. ■Mill Consistent values were obtained in the range of 5 to 10 mΩ per square. Figure 4A, 4th Using the initial press shown in Figure B and the inventive press shown in Figure 6. A comparative test was conducted. In each test, a substrate with a two-dimensional surface was was placed in it.

The projected thickness was 20 mils. Release paper or transformer with printed circuit Sphar paper and adhesive were placed on top. Plates and transfer media on top It was compressed by closing. Lamination was performed at a pressure of 600 ps and a temperature of 177°C. The test was carried out under the conditions of 3 minutes and 3 minutes. Next, remove the release paper and remove the circuitized base. The material was cured at 150°C for 30 minutes. After curing, the circuit board is hand soldered using a soldering iron. or wave soldering at a conveying speed of 6 feet/min and a temperature of 246°C. can be soldered using a machine.

To measure adhesion, a copper wire (0.05/inch diameter) was placed 1/4 inch straight on the circuit board. It was soldered onto the diameter pad. After cooling, the wire was tested in a Chatillon tensile tester. It was pulled from a plate flanged onto a UTSM type base. AME this line Attach it to the end of the TEKACCU force gauge ■. Next, connect the circuit board to Cha Low on the tillon tester #l setting and line and 1/16 inch base. The maximum force to break the bond between a 1/4 inch pad on the board was measured. Traditional Samples obtained using the press showed the non-uniform test results of FIG. of the present invention The method obtained showed the uniform results of FIG.

Figure 5 shows average tensile strength of 25-06 Qbs (510.5 psi), failure of base material. This shows a rate of 13%. However, Figure 7 shows an average tensile strength of 48.1 (lbs. C9B0.6psi), indicating a failure rate of the base material of 91%.

Although these results are very impressive, each figure represents a different Shows test results at position.

Sixteen circuits were tested. Tensile strength measurements for each circuit bond are shown with adhesion measurements for the soldered wires shown in the upper left corner. vinegar. Regarding the destruction rate, "P" or "S" respectively indicate plugs (plastic plates). ) or snap (circuit interface) destruction rate. In Figure 5 , conventional techniques exhibit minimal bond strength around the perimeter of the circuit board. ing. However, compared to the test results of FIG. 5, FIG. 6 of the present invention shows that the circuit board It shows excellent and uniform adhesive strength throughout.

Example 2 Example 1 is repeated except that both sides of the circuit board are laminated with printed circuits. Ta.

Example 3 Example 1 except that the surface of the circuit board on which the circuit is applied is three-dimensional. repeated.

Although the present invention has been described with specific embodiments, it will be appreciated by those skilled in the art in view of the foregoing. It will be appreciated that many alternatives and variations are apparent. This is an analogy Even if the circuit can be soldered without this procedure, the printed circuit may Plating the path may also be included. This also includes the constant that the base material confines the mold. It may also include reversing the arrangement of the surface plates so that they are on top of the plate.

Further, both sides of the base material may be processed. Therefore, the present invention is defined as ” and includes all alternatives and modifications within the spirit and scope of the invention described in be.

FIG. 6 FIG. 2 FIG. 44 FIG. 48 FIG. 7 Improved Transfer Law International Search Report

Claims (1)

[Claims] 1) (a) a first substantially confining mold that is a mirror image of the substrate surface in at least two dimensions; a first surface plate having a fluid-filled bellows with a cavity; (b) a second cavity containing a second cavity dimensioned to protrude a portion of the thickness of the base material; Surface plate; (c) pressure means for compressing the conductor overlaid on the substrate surface; and (d) comprising at least a laminating means for adhering the conductor to the substrate surface; Uniform pressure transmission device for uniformly layering conductors on the surface of two-dimensional substrates. 2) The transmission device according to claim 1, wherein the base material surface is three-dimensional. 3) The transmission device according to claim 1, wherein the mold is made of silicone rubber. 4) The transmission device according to claim 1, wherein the base material is plastic. 5) The transmission device according to claim 4, wherein the base material is a thermoplastic plastic. 6) The transmission device according to claim 4, wherein the plastic is polyarylsulfone. 7) The transmission device according to claim 1, wherein the bellows is made of metal. 8) The fluid contained in the bellows is a liquid-flowable powder, gel or deformable elastomer. 2. The device of claim 1, wherein the tomer powder is a tomer powder. 9) The device of claim 1, wherein the conductor is a printed circuit. 10) (a) a first substantially confining mold that is a mirror image of the substrate surface in at least two dimensions; a first surface plate having a fluid-filled bellows with one cavity; (b) A second constant containing a second cavity sized to protrude part of the thickness of the base material. Board; (c) pressure means for compressing the printed circuit placed on the substrate surface; and (d) consisting of a laminating means for adhering the printed circuit to the substrate surface; Uniform pressure transmission for uniformly laminating printed circuits on at least two-dimensional substrate surfaces. sending device. 11) Insert substantially part of the thickness of the base material into the cavity of the surface plate and place it on the surface of the base material. Place the conductor and substantially limit the type to be a mirror image of the substrate surface in at least two dimensions Using another surface plate with a fluid-filled bellows containing a cavity of Applying uniform pressure to the body and the surface of the base material, and then laminating the conductor on the surface of the base material A method for uniformly laminating a conductor on the surface of an at least two-dimensional base material, comprising: 12) The method according to claim 11, wherein the substrate surface is three-dimensional. 13) A method according to claim 11, wherein the lamination is carried out using heat. 14) The method according to claim 11, wherein the mold is made of silicone rubber. 15) The method according to claim 11, wherein the substrate is made of plastic. 16) The method according to claim 15, wherein the substrate is made of thermoplastic. 17) The method according to claim 15, wherein the plastic is polyarylsulfone. 18) The method according to claim 11, wherein the bellows is a metal bellows. 19) The fluid may be a liquid flowable powder, a gel or a deformable elastomer powder. The method according to claim 11. 20) The method of claim 11, wherein the conductor is a printed circuit. 21) Insert substantially part of the thickness of the base material into the cavity of the surface plate and place it on the surface of the base material. Place a printed circuit and substantially control a mold that is a mirror image of the substrate surface in at least two dimensions. Other surface plates with fluid-filled bellows containing other cavities that limit to apply uniform pressure to the printed circuit and substrate surface, and a printing process on the surface of a substrate in at least two dimensions, consisting of laminating the A method for uniformly layering tracts. 22) A first surface plate having a cylinder having a plurality of diaphragms, the one One diaphragm separates the internal volume of the cylinder, and the other diaphragm separates the inner volume of the cylinder. placed in the form of a mold at the end of the cylinder adjacent to the mirror image of the surface and substantially confined in the cavity at the end of the cylinder and a cylinder volume located adjacent to one surface plate is assembled, and The fluid medium occupying this volume is heated and pressurized, then the heat and pressure are applied to the cylinder The other surface plate is arranged to be transferred to another volume adjacent to the end of the Contains another cavity sized to protrude part of the thickness of the base material. , and further comprising lamination means for adhering the conductor to the substrate. Uniform pressure transmission device for uniformly laminating conductors on the surface of dimensional base materials. 23) The device according to claim 22, wherein the substrate surface is three-dimensional. 24) The device according to claim 22, wherein the mold is made of silicone rubber. 25) The device according to claim 22, wherein the substrate is plastic. 26) The device according to claim 25, wherein the substrate is a thermoplastic. 27) The device according to claim 25, wherein the substrate is polyarylsulfone. 28) The device of claim 22, wherein the fluid is a polyglycol. 29) The apparatus of claim 22, wherein the fluid is recirculated. 30) If the transfer medium is a free-flowing powder, gelling fluid, silicone gel or 23. The device of claim 22, wherein the device is a shapeable elastomeric powder. 31) The device of claim 22, wherein the conductor is a printed circuit. 32) A first surface plate having a cylinder having a plurality of diaphragms, the one One diaphragm separates the internal volume of the cylinder, and the other diaphragm separates the inner volume of the cylinder. placed in the form of a mold at the end of the cylinder adjacent to the mirror image of the surface and substantially confined in the cavity at the end of the cylinder and a cylinder volume located adjacent to one surface plate is assembled, and The fluid medium occupying this volume is heated and pressurized, then the heat and pressure are applied to the cylinder The other surface plate is arranged to be transferred to another volume adjacent to the end of the Contains another cavity sized to protrude part of the thickness of the base material. , as well as a laminating means for adhering the printed circuit to the substrate. Uniform pressure transmission for uniformly laminating printed circuits on at least two-dimensional substrate surfaces Device. 33) Inserting at least a substantial portion of the thickness of the two-dimensional substrate into the cavity of the surface plate. on another surface plate with a cylinder attached to it and placing the conductor on the substrate surface. The cylinder contains multiple diaphragms, one of which is a mold. , it is a mirror image of the base material surface using a conductor and a uniform surface of the base material. Pressure is applied and thereby the rimmed cylinder volume, another surface plate and another die The fluid in the yaphram is heated and pressurized, thereby increasing the volume of the rimmed cylinder and Applying heat and pressure to the diaphragm and laminating the conductor on the surface of the base material. A method for uniformly laminating a conductor on the surface of an at least two-dimensional base material, comprising: 34) The method according to claim 33, wherein the substrate surface is three-dimensional. 35) The method according to claim 33, wherein the mold is a silicone rubber mold. 36) The method according to claim 33, wherein the substrate is plastic. 37) The method according to claim 36, wherein the substrate is a thermoplastic. 38) The method of claim 36, wherein the plastic is polyarylsulfone. 39) The method of claim 33, wherein the fluid is a polyglycol. 40) The method of claim 33, wherein the fluid is recirculated. 41) If the transfer medium is a free-flowing powder, gelling fluid, silicone gel or 34. The method of claim 33, wherein the elastomeric powder is a shapeable elastomeric powder. 42) The method of claim 33, wherein the conductor is a printed circuit. 43) Inserting at least a substantial portion of the thickness of the two-dimensional substrate into the cavity of the surface plate. another with a cylinder attached to it and a printed circuit placed on the substrate surface. a surface plate in which the cylinder contains a plurality of diaphragms, one of which Printed circuits and molds that are mirror images of the substrate surface Applying a uniform pressure to the substrate surface, the rimmed cylinder volume, another constant heating and pressurizing the fluid in the disc and another diaphragm, thereby Applying heat and pressure to the cylinder volume and diaphragm, and printing cycle Printing on a substrate surface in at least two dimensions, consisting of laminating a path onto the substrate surface A method for uniformly layering circuits.