JPS5811629B2 - Manufacturing method of electrode connector for liquid crystal display tube - Google Patents

Manufacturing method of electrode connector for liquid crystal display tube

Info

Publication number
JPS5811629B2
JPS5811629B2 JP10753078A JP10753078A JPS5811629B2 JP S5811629 B2 JPS5811629 B2 JP S5811629B2 JP 10753078 A JP10753078 A JP 10753078A JP 10753078 A JP10753078 A JP 10753078A JP S5811629 B2 JPS5811629 B2 JP S5811629B2
Authority
JP
Japan
Prior art keywords
resin
weight
insulating film
conductive
flexible insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10753078A
Other languages
Japanese (ja)
Other versions
JPS5535326A (en
Inventor
芝弘
村田勝弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Graphite Industries Ltd
Original Assignee
Nippon Graphite Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Graphite Industries Ltd filed Critical Nippon Graphite Industries Ltd
Priority to JP10753078A priority Critical patent/JPS5811629B2/en
Publication of JPS5535326A publication Critical patent/JPS5535326A/en
Publication of JPS5811629B2 publication Critical patent/JPS5811629B2/en
Expired legal-status Critical Current

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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

【発明の詳細な説明】 本発明は、液晶表示管用電極コネクターの製造方法に%
す、特に導電部分と絶縁部分とを交互に層状一体に、か
つ精密寸法をもって成形せしめた直方体型シリコーンゴ
ム成形体の電極コネクターにおけるような精密成形工程
を全く含まない、特殊な導電性ヒートシール組成物と、
極めて薄いかつ均一な厚さを有する可撓性絶縁フィルム
基板と、簡単なプレス及び高周波発生装置とを使用し、
導電部分のピッチが微細かつ正確な取り付は容易にして
安価な液晶表示管用電極コネクターの製造方法に関する
ものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for manufacturing an electrode connector for a liquid crystal display tube.
In particular, a special conductive heat seal composition that does not involve any precision molding process like the electrode connector of a rectangular parallelepiped silicone rubber molded body in which conductive parts and insulating parts are formed in alternating layers and integrally with precise dimensions. things and
Using a flexible insulating film substrate with an extremely thin and uniform thickness, a simple press and a high frequency generator,
The present invention relates to a method of manufacturing an electrode connector for a liquid crystal display tube that is easy and inexpensive to attach conductive parts with fine pitches and accurate attachment.

従来の液晶表示管用電極コネクターの製造方法は、まず
シリコーンゴムとカーボンブラック等の導電性粉末とを
混合し、導電性のゴム原料を作り、これを、所望の厚み
を有する形状に成形する。
In the conventional manufacturing method of an electrode connector for a liquid crystal display tube, first, silicone rubber and conductive powder such as carbon black are mixed to form a conductive rubber raw material, and this is molded into a shape having a desired thickness.

次に別にシリコーンゴムのみで所望の厚みに絶縁部分を
成形したものを作っておき、これらの接合面にシリコー
ン接着剤を塗布した後、この導電性のシリコーンゴムか
らなる導電部分と絶縁性のシリコーンゴムからなる絶縁
部分とを貼り付け、プレス等で一定の厚みとした後、所
望の大きさに切断して電極コネクターを得るものである
Next, a separate insulating part made of silicone rubber is molded to the desired thickness, and after applying silicone adhesive to the joint surfaces of these parts, the conductive part made of this conductive silicone rubber and the insulating silicone An electrode connector is obtained by attaching an insulating part made of rubber, pressing it to a certain thickness, and then cutting it to a desired size.

しかしながら、従来のこの方法は、導電性ゴムを作る時
、非常にバラツキが犬きく、シかも導電性の良好なゴム
が得られず、したがって、細い電極コネクター構造のも
のが製作出来ない。
However, with this conventional method, when producing conductive rubber, there is a great deal of variation, and it is difficult to obtain rubber with good conductivity, and therefore it is not possible to produce thin electrode connector structures.

また、導電部分のピッチが例えば0.1〜0,2闘の微
細なものの成形は極めて困難である。
Furthermore, it is extremely difficult to mold a conductive part having a fine pitch of, for example, 0.1 to 0.2 mm.

しかも、コストが非常に高くなっている。Moreover, the cost is extremely high.

本発明は以上の欠点を除去するためになされたもので、
比較的簡単な製造工程によって所望の厚みを有する形状
に成形し、しかも導電部分のピッチが微細であり、かつ
低コストの液晶表示管用電極コネクターが得られる製造
方法を提供しようとするものである。
The present invention has been made to eliminate the above-mentioned drawbacks.
To provide a manufacturing method capable of forming an electrode connector for a liquid crystal display tube at a low cost by molding it into a shape having a desired thickness through a relatively simple manufacturing process, having a fine pitch of conductive parts, and at a low cost.

本発明においては先づ、(a)F2度0.1〜40μの
黒鉛粉末、銀粉末、および粒度0.1μ以下のカーボン
ブラックの1種又は2種以上から成る微粉末10〜70
重量%と、(b)クロロプレン系合成ゴム、ポリアミド
樹脂、エチレン酢酸ビニル共重合体樹脂、ポリメチルメ
タクリレート樹脂の1種又は2種以上の熱可塑性高分子
結合剤10〜65重量%ト、(c)イソホロン、ジペン
テン、アセトフェノン、クロルトルエン、シエチルカル
ヒトール、トルエンの1種又は2種以上の溶剤26〜6
0重量%とを混合し溶解分散せしめた見掛は比重1.1
〜1.7、粘度100〜500ポイズの懸濁液(a+b
+c)を調製する。
In the present invention, first, (a) 10 to 70 fine powders made of one or more of graphite powder with an F2 degree of 0.1 to 40μ, silver powder, and carbon black with a particle size of 0.1μ or less;
(b) 10 to 65% by weight of a thermoplastic polymer binder of one or more of chloroprene synthetic rubber, polyamide resin, ethylene vinyl acetate copolymer resin, and polymethyl methacrylate resin, (c ) One or more solvents of isophorone, dipentene, acetophenone, chlorotoluene, ethylcalcitol, and toluene 26-6
When mixed with 0% by weight and dissolved and dispersed, the apparent specific gravity is 1.1.
~1.7, viscosity 100-500 poise suspension (a+b
Prepare +c).

しかして、この懸濁液を用いて、所望の寸法を有する可
撓性絶縁フィルム基板の少なくとも一方の全面にスクリ
ーン又はグラビア印刷塗布する下獄と、該工程(支)に
て形成した印画塗布面を50〜150℃の温度で5〜1
5分間乾燥せしめる工程(B)と、該工程(B)にて得
られた導電性ヒートシール組成物被着可撓性絶縁フィル
ム基板を前記塗布面を交互にして層状に所望枚数堆積し
、1〜30kg/antの圧力を上下に加えると共に、
100KH2から10MHzの高周波をかけて前記導電
性ヒートシール組成物を熱再活性させ、前記可撓性絶縁
フィルム基板を一体に積層成形させ、冷却後解圧を行な
う工程(C)と、該工程(C)にて得られた交互に導電
性層と絶縁層とからなる多層成形体を所望形状寸法に切
断する工程(D)との結合(A+B+C十D)から成る
ものである。
Using this suspension, a screen or gravure printing coating is applied to at least one entire surface of a flexible insulating film substrate having desired dimensions, and a print coating surface formed in this step is coated. 5-1 at a temperature of 50-150℃
Step (B) of drying for 5 minutes, and depositing a desired number of flexible insulating film substrates coated with the conductive heat sealing composition obtained in step (B) in a layered manner with the coated surfaces alternately; While applying pressure of ~30 kg/ant vertically,
A step (C) of thermally reactivating the conductive heat-sealing composition by applying a high frequency of 100 KH2 to 10 MHz, integrally laminating the flexible insulating film substrate, and depressurizing after cooling; This process consists of combining (A+B+C+D) with step (D) of cutting the multilayer molded body made of alternating conductive layers and insulating layers obtained in step C) into a desired shape and size.

また、本発明においては、前記の微粉末(a)10〜7
0重量%と、同じく前記の熱可塑性高分子結合剤(b)
10〜65重量%と、さらにテルペン系樹脂、フェノー
ル系樹脂、脂肪族炭化水素樹脂の1種又は2種以上の粘
着付与剤(d)0.1〜20重量%と、前記の溶剤(c
)10〜60重量%とを混合し溶解分散せしめた見掛は
比重1.1〜1.7、粘度100〜500ポイズの懸濁
液を(a+b+c+d)調製する。
In addition, in the present invention, the above-mentioned fine powder (a) 10 to 7
0% by weight and the same thermoplastic polymeric binder (b) as described above.
10 to 65% by weight, further 0.1 to 20% by weight of one or more tackifiers (d) of terpene resins, phenolic resins, and aliphatic hydrocarbon resins, and the above-mentioned solvent (c).
) 10 to 60% by weight are mixed and dissolved and dispersed to prepare a suspension (a+b+c+d) with an apparent specific gravity of 1.1 to 1.7 and a viscosity of 100 to 500 poise.

すなわち、前記の熱可塑性高分子結合剤(b)と粘着付
与剤(d)とを併用して懸濁液を調製するものである。
That is, a suspension is prepared by using the thermoplastic polymer binder (b) and the tackifier (d) together.

しかしてこの懸濁液を用いて、所望の寸法を有する可撓
性絶縁フィルム基板の少なくとも一方の全面にスクリー
ン又はグラビア印刷塗布する工程(A)と、該工程(A
)にて形成した印画塗布を50〜150℃の温度で5〜
15分間乾燥せしめる工程刊と、該工程、(B)にて得
られた導電性ヒートシール組成物被着可撓性絶縁フィル
ム基板を前記塗布面を交互にして層状に所望枚数堆積し
、1〜30kg/cm2の圧力を上下に加えると共に、
100KHzから10MHzの高周波をかけて前記導電
性ヒートシール組成物を熱再活性させ、前記可撓性絶縁
フィルム基板を一体に積層成形させ、冷却後解圧を行な
う工程(C)と、該工程(C)にて得られた交互に導電
性層と絶縁層とから成る多層成形体を所望形状寸法に切
断する工程(2)との結合(A+B+C+D)から成る
ものである。
However, using this suspension, a step (A) of applying screen or gravure printing to at least one entire surface of a flexible insulating film substrate having desired dimensions;
) at a temperature of 50 to 150°C.
After drying for 15 minutes, a desired number of flexible insulating film substrates coated with the conductive heat-sealing composition obtained in step (B) are deposited in a layered manner with the coated surfaces alternated. While applying pressure of 30 kg/cm2 vertically,
A step (C) of thermally reactivating the conductive heat-sealing composition by applying a high frequency of 100 KHz to 10 MHz, integrally laminating the flexible insulating film substrate, and depressurizing after cooling; This process consists of combining (A+B+C+D) with step (2) of cutting the multilayer molded product obtained in step C) consisting of alternating conductive layers and insulating layers into desired shapes and dimensions.

しかして本発明に係る前記(a)の黒鉛、銀及びカーボ
ンブラックの粉末の組成における数量限定、すなわち、
lO〜70重量係の上限及び下限を越える場合には、印
刷による塗布に用いる懸濁液の安定性及び印刷性のいわ
ゆる「のり」と「稠度」が共に良くなく、特に上限を越
える場合は、接着力が十分に得られず、不可である。
However, the quantity limitation in the composition of the graphite, silver and carbon black powder (a) according to the present invention, namely,
If the upper and lower limits of 10 to 70 weight ratio are exceeded, the stability of the suspension used for application by printing and the so-called "glue" and "consistency" of printability are not good, especially when the upper limit is exceeded. Adhesive strength is not sufficient and is not acceptable.

又、下限未満では抵抗値が高くなり、導電性が十分でな
く、不可である。
Moreover, if it is less than the lower limit, the resistance value becomes high and the conductivity is insufficient, so it is not acceptable.

又、前記粉末a)の粒度に対しては銀、黒鉛の場合40
μを越えると前記懸濁液の安定性印刷のいわゆる「のり
」および付着性が十分得られず不可である。
In addition, the particle size of the powder a) is 40 in the case of silver and graphite.
If it exceeds μ, the stability of the suspension cannot be obtained because the so-called "glue" and adhesion of printing cannot be sufficiently obtained.

又、下限を0.1μにしたのは通常工業的には入手可能
であり、懸濁液の粘度、稠度並びに印刷性等から勘案し
て好適なためである。
Further, the lower limit is set to 0.1 μ because it is usually commercially available and is suitable in view of the viscosity, consistency, printability, etc. of the suspension.

又、前記カーボンブラックの場合、0.1μ以下とした
のは0.1μを越える粒度のものは工業的に入手困難な
ためである。
Further, in the case of the carbon black, the particle size is set to 0.1μ or less because it is difficult to obtain particles with a particle size exceeding 0.1μ industrially.

又、カーボンブラックの場合0.1μ以下としたのは前
記銀、黒鉛の場合と異なり、粒子同志が鎖のように結合
しているため粒子が細かくても印刷性が好適である。
In addition, in the case of carbon black, unlike the cases of silver and graphite, the particles are bonded together like a chain, so that printability is suitable even if the particles are fine.

次に、クロロプレン系合成ゴム及び熱可塑性樹脂(b)
のうち、クロロプレン系合成ゴムとしては、例えば、ネ
オプレン系ゴムに層する昭和高分子株式会社製商品名ビ
ニロール2200、ビニロール2700等を使用するこ
とが出来る。
Next, chloroprene-based synthetic rubber and thermoplastic resin (b)
Among these, as the chloroprene-based synthetic rubber, it is possible to use, for example, vinylol 2200, vinylol 2700, and the like manufactured by Showa Kobunshi Co., Ltd., which are layered on neoprene rubber.

次にポリアミド樹脂としては、ダイマー酸とアルキレン
ポリアミンとの縮合反応を行わせて得られたもので平均
分子量約700〜7000程度、軟化点110゜〜18
5℃、溶融粘度(2000℃における粘度)1.8〜4
0ポイズのもので、実際には富士化成工業株式会社製商
品名トーマイド及びこれに相当する東部化成株式会社製
商品名グツドマイトのポリアミド樹脂のものも部用出来
る。
Next, the polyamide resin is obtained by performing a condensation reaction between dimer acid and alkylene polyamine, and has an average molecular weight of about 700 to 7000 and a softening point of 110 to 18.
5℃, melt viscosity (viscosity at 2000℃) 1.8-4
Polyamide resins with 0 poise, such as Tomide (trade name, manufactured by Fuji Kasei Kogyo Co., Ltd.) and equivalent product name (Gutdomite, manufactured by Tobu Kasei Co., Ltd.), can also be used.

又、エチレン酢酸ビニル共重合体樹脂としては、例えば
、昭和高分子化学株式会社製商品名ビニロール5E−L
等、又、ポリメチルメタクリレート樹脂としては、例え
ば、三菱レーヨン株式会社製商品名ダイヤナールLR−
866等を使用することが出来る。
In addition, as the ethylene vinyl acetate copolymer resin, for example, Vinyroll 5E-L manufactured by Showa Kobunshi Kagaku Co., Ltd.
In addition, as the polymethyl methacrylate resin, for example, the product name DIANAL LR- manufactured by Mitsubishi Rayon Co., Ltd.
866 etc. can be used.

次に前記クロロプレン系合成ゴム及び熱可塑性樹脂(b
)における数量限定、すなわち、10〜65重量係の下
限未満になると、粘度が低くなり稠度も不十分で印刷性
も悪くなり、又、耐着力がなく、不可である。
Next, the chloroprene-based synthetic rubber and thermoplastic resin (b
), that is, if the quantity is less than the lower limit of 10 to 65 weight coefficients, the viscosity will be low, the consistency will be insufficient, the printability will be poor, and there will be no adhesive strength, so it is not acceptable.

上限を越えると、稠度が高すぎ、樹脂の溶解性が悪くな
り、又、印刷性が悪くなり不可である。
If the upper limit is exceeded, the consistency will be too high, the solubility of the resin will be poor, and the printability will be poor, making it impossible.

次に、前記の粘着付与剤(d、)のうち、テルペン系樹
脂としては、例えば、日本ゼオン株式会社製商品名クイ
ントンU−185(軟化点85℃、比重0.99)、フ
ィントンA−100(軟化点100°C1比重0.97
)、脂肪族炭化水素樹脂としては、例えば、三井石油化
学工業株式会社製三井ハイレツツ(平均分子量1200
、軟化点100℃、比重0.97)を用いることが出来
る。
Next, among the above-mentioned tackifiers (d), examples of the terpene resin include Quinton U-185 (softening point: 85°C, specific gravity: 0.99), manufactured by Nippon Zeon Co., Ltd., and Finton A-100. (Softening point 100°C1 specific gravity 0.97
), as the aliphatic hydrocarbon resin, for example, Mitsui Hiretsu (average molecular weight 1200) manufactured by Mitsui Petrochemical Industries, Ltd.
, a softening point of 100° C., and a specific gravity of 0.97).

次に、前記粘度付与剤(d)の組成における数量決定、
すなわち、0.1〜20重量係の上限を越えると、稠度
が高すぎ、樹脂の溶解性が悪くなり、又、印刷性が悪く
なり不可である。
Next, determining the quantity in the composition of the viscosity imparting agent (d),
That is, if the upper limit of 0.1 to 20 weight ratio is exceeded, the consistency will be too high, the solubility of the resin will be poor, and the printability will be poor, making it impossible.

下限を越えると、粘着付与効果が生ぜず不可である。If the lower limit is exceeded, no tackifying effect will be produced and it is not acceptable.

次に、前記(b)のクロロプレン系合成ゴム及び熱可塑
性樹脂と、(d)粘着付与剤との溶剤(c)の数量限定
、すなわち、25〜60重量係の上限を越えると、見掛
は比重及び粘度が共に低下しすぎ不可であり、下限を越
えると、逆に見掛は比重及び粘度が上昇し、溶解性が悪
くなるので不可である。
Next, if the limited quantity of the solvent (c) for the chloroprene-based synthetic rubber and thermoplastic resin (b) and the tackifier (d) exceeds the upper limit of 25 to 60% by weight, the apparent Both specific gravity and viscosity are not acceptable because they are too low, and if the lower limit is exceeded, the specific gravity and viscosity will increase in appearance and the solubility will be poor, so this is not acceptable.

以上、前記懸濁液の各調製原料(a) 、 (b) 、
(c)又は(a) 、 (b) 、 (c) 、 (
d)をそれぞれ各所定量ずつ混合し、均一に溶解分散せ
しめた見掛は比重1.1〜1.7、粘度100〜500
ポイズの懸濁液(a+b+c)又は(a+b+c+d)
を潜るが、この場合、この懸濁液の見掛は比重が、1.
1未満では黒鉛、銀、カーボンブラック(a)と、クロ
ロプレン系合成ゴムおよび熱可塑性樹脂b)とのさらに
粘着付与剤(d)との成分が不足で耐着性が悪くなる傾
向を示し、又、1.7を越えると稠度が上昇し不可であ
る。
As mentioned above, each preparation raw material (a), (b),
(c) or (a), (b), (c), (
d) are mixed in predetermined amounts and uniformly dissolved and dispersed to give an apparent specific gravity of 1.1 to 1.7 and viscosity of 100 to 500.
Poise suspension (a+b+c) or (a+b+c+d)
In this case, the apparent specific gravity of this suspension is 1.
If it is less than 1, the components of graphite, silver, carbon black (a), chloroprene synthetic rubber and thermoplastic resin b), and tackifier (d) tend to be insufficient, resulting in poor adhesion resistance. , exceeding 1.7, the consistency increases and is not acceptable.

粘度も前記の下限未満は耐着性、印刷の「のり」等の稠
度が不足し、上限を越えると稠度が高すぎ印刷性がかえ
って悪くなり不可である。
If the viscosity is less than the above-mentioned lower limit, the adhesion resistance and consistency of "glue" in printing will be insufficient, and if it exceeds the upper limit, the consistency will be too high and the printability will deteriorate, which is unacceptable.

次に、この懸濁液を用いて印刷塗布する絶縁フィルム基
板としては、天然ゴム、合成ゴム、塩化ビニル樹脂、ポ
リプロピレン樹脂、ポリアミドイミド樹脂、ポリウレタ
ン樹脂、ポリエステル樹脂等の板や、フィルムで、可撓
性のある薄くかつ厚さ均一なフィルム基板を使用するこ
とが出来る。
Next, the insulating film substrate to which this suspension is applied by printing may be a board or film made of natural rubber, synthetic rubber, vinyl chloride resin, polypropylene resin, polyamideimide resin, polyurethane resin, polyester resin, etc. A thin, flexible film substrate with uniform thickness can be used.

このフィルムの厚さは、最小0.01〜0.03mm程
度からさらに大きいところまで所望に選択して使用する
ことが出来る。
The thickness of this film can be selected as desired from a minimum of about 0.01 to 0.03 mm to a larger thickness.

これらの絶縁フィルム基板上への印刷による塗布は、前
記懸濁液を印刷インキとして用い、スクリーン又はグラ
ビア印刷にて容易に行なうことが出来る〔工程(A)〕
Application by printing onto these insulating film substrates can be easily carried out by screen or gravure printing using the suspension as a printing ink [Step (A)]
.

次に、この印刷塗布工程(A)にて得た塗布被着面を温
度50〜150℃で約5〜15分市程度乾燥を行なう〔
工程(B)〕。
Next, the coated surface obtained in this printing coating step (A) is dried for approximately 5 to 15 minutes at a temperature of 50 to 150°C.
Process (B)].

この場合50℃より低い温度では乾燥が不十分であり、
150℃を越えると基板等にも悪影響をおよぼす。
In this case, drying is insufficient at temperatures lower than 50°C.
If the temperature exceeds 150°C, it will have an adverse effect on the substrate, etc.

乾燥時間も5〜15分間が適当である。A suitable drying time is 5 to 15 minutes.

なお、後述の導電性層の厚みは、この場合における懸濁
液の組成、濃度により所望に応じて得ることができる。
The thickness of the conductive layer, which will be described later, can be determined as desired depending on the composition and concentration of the suspension in this case.

次にこの乾燥工程田)によって懸濁液を塗布乾燥して得
た導電性ヒートシール組成物被着可撓性絶縁フィルム基
板を前記塗布面を交互にして層状に所望枚数堆積し、1
〜30kg/fflの圧力を上下に加えると共に、10
0 KHzから10MHzの高周波をかけ前記導電性ヒ
ートシール組成物を熱再活性させ、これらの絶縁フィル
ム基板を一体化すなわち、積層成形させ冷却後、解圧さ
せる(頂(C) )。
Next, a desired number of flexible insulating film substrates coated with the conductive heat-sealing composition obtained by applying and drying the suspension in this drying process are deposited in layers with the coated surfaces alternately.
While applying pressure of ~30 kg/ffl up and down,
The conductive heat-sealing composition is thermally reactivated by applying a high frequency of 0 KHz to 10 MHz, and these insulating film substrates are integrated, that is, laminated, and after cooling, the pressure is released (top (C)).

すなわち高周波加熱による接着を行なうのである。That is, bonding is performed by high frequency heating.

前記の加圧圧縮がiky/ff1未満では圧着の効果が
充分でなく不可であり、30kg/crILを越えると
基板自体に対しても種類によっては悪影響を及ぼし、そ
の必要性に乏しい。
If the pressure compression is less than iky/ff1, the crimping effect will not be sufficient, and if it exceeds 30 kg/crIL, it will have an adverse effect on the substrate itself depending on the type, and it is not necessary.

又、高周波数が100 KHz未満ではヒートシール組
成物の熱再活性が不十分で接着強度に悪影響を与え、1
0MH2を越えると、かえって種類によってはフィルム
基板自体にも悪影響を与える恐れがあり、樹脂等の溶融
から見ても必要性に乏しい。
In addition, if the high frequency is less than 100 KHz, the thermal reactivation of the heat seal composition is insufficient and the adhesive strength is adversely affected.
If it exceeds 0MH2, it may even have an adverse effect on the film substrate itself depending on the type, and is not necessary from the viewpoint of melting the resin.

なお、冷却は特別の場合を除き室温にて放冷すればよく
加圧を解かないで冷却するのが好適であるのは前述の通
りである。
As mentioned above, except in special cases, cooling may be performed by allowing it to cool at room temperature, and it is preferable to cool it without releasing the pressure.

次に、この積層成形工程(C)にて得られた導電層と絶
縁層との多層物、すなわち積層成形体を所望する大きさ
又は形状に切断し〔工程(D)〕、液晶表示管用電極コ
ネクターを得る。
Next, the multilayer product of the conductive layer and the insulating layer obtained in the lamination molding step (C), that is, the laminated molded product, is cut into a desired size or shape [step (D)], and an electrode for a liquid crystal display tube is cut into a desired size or shape. Get the connector.

以上の如く、本発明による液晶表示管用電極コネクター
のピッチは、絶縁フィルム基板の厚み及び導電性ヒート
シール組成物の塗布層の厚みによって所望に応じて自由
に変えることはもらろん、導電部分のピッチが、例えば
、0.1〜0.2關の微細なものの成形も極めて簡単で
ある。
As described above, the pitch of the electrode connector for a liquid crystal display tube according to the present invention can be freely changed as desired depending on the thickness of the insulating film substrate and the thickness of the coating layer of the conductive heat-sealing composition. It is also extremely easy to mold objects with a fine pitch of, for example, 0.1 to 0.2.

又、導電部分をスクリーン印刷にて塗布することが出来
るため、通電はどの部分も均一で良好であり、かつ、接
着強度は完全に十分保証される。
Further, since the conductive portion can be applied by screen printing, the conduction of electricity is uniform and good in all parts, and the adhesive strength is completely and sufficiently guaranteed.

図面の簡単な説明すると、印刷塗布工程(A)を経て、
乾燥工程CB)にて得られた導電性ヒートシール組成物
被着可撓性絶縁フィルム板の斜視図を第1図に示し、同
じくその正面図を第2図に示す。
To briefly explain the drawing, after the printing coating process (A),
A perspective view of the conductive heat-sealing composition-covered flexible insulating film plate obtained in the drying step CB) is shown in FIG. 1, and a front view thereof is shown in FIG. 2.

可撓性絶縁フィルム基板1とこれに被着された導電性懸
濁液組成物の塗布乾燥層2との接合面を数字記号3で示
す。
The bonding surface between the flexible insulating film substrate 1 and the coated dry layer 2 of the conductive suspension composition adhered thereto is indicated by the numeral 3.

Aは可撓性絶縁基板1の横(長さ)寸法で、実際には1
0〜600mm程度であり、Bはこの基板1の縦寸法で
、実際には10〜6000〜600市程Cはこの基板1
の厚さで、実際には0.01〜3,0市程度である。
A is the horizontal (length) dimension of the flexible insulating substrate 1, which is actually 1
It is about 0 to 600 mm, and B is the vertical dimension of this board 1, and actually 10 to 6000 to 600 mm. C is the length of this board 1.
The actual thickness is about 0.01 to 3.0 mm.

Dは導電性懸濁液組成物の塗布乾燥層2の厚さであり、
実際には0.01〜0.5重液度である。
D is the thickness of the coated dry layer 2 of the conductive suspension composition,
Actually, it is 0.01 to 0.5 heavy liquid degree.

Eは本発明によりできあがったコネクター11の縦寸法
で、実際には1〜10闘程度であり、Fは同じくコネク
ター11の横寸法で、実際には1〜10市程度であり、
Gは同じくコネクター11の長さで、実際には10〜5
00市程度である。
E is the vertical dimension of the connector 11 made according to the present invention, which is actually about 1 to 10 mm, and F is the horizontal dimension of the connector 11, which is actually about 1 to 10 mm.
G is also the length of connector 11, which is actually 10 to 5
It is around 00 cities.

第3図は積層成形工程0を示し、第1図および第2図に
示す導電性ヒートシール組成物被着可撓性絶縁フィルム
基板を前記塗布被着面を交互にして層状に所望枚数積層
堆積し、これを、高周波発生による誘電加熱装置を設け
た圧縮プレス4(加圧P)にかけ、熱圧着すなわちいわ
ゆるヒートシールする。
FIG. 3 shows the lamination molding process 0, in which a desired number of flexible insulating film substrates coated with the conductive heat sealing composition shown in FIGS. Then, this is applied to a compression press 4 (pressure P) equipped with a dielectric heating device that generates high frequency waves to perform thermocompression bonding, that is, so-called heat sealing.

これにより第4図に示す多層成形体5を得る。As a result, a multilayer molded body 5 shown in FIG. 4 is obtained.

これから切断工程(口によって第5図に示す長方形のコ
ネクター12を切削する(切削または切断装置は図示せ
ず)。
This is followed by a cutting step (cutting by means of a spout into the rectangular connector 12 shown in FIG. 5 (cutting or cutting equipment not shown).

本発明に係る電極コネクター12は、第5図および第6
図に示すように所望の一定間隔で導電部分6と絶縁部分
7とか交互に積層され一体に成形されている。
The electrode connector 12 according to the present invention is shown in FIGS.
As shown in the figure, conductive portions 6 and insulating portions 7 are alternately laminated at desired regular intervals and integrally formed.

これを、例えば、第6図に示すように液晶表示管用電極
11上に載置して、電極コネクター12として作用させ
る。
For example, as shown in FIG. 6, this is placed on the electrode 11 for a liquid crystal display tube to function as an electrode connector 12.

すなわら、第6図では、液晶部分10から導出された絶
縁板8の端縁部9の電極11上に、電極コネクター12
の導電部分6が来るように接触させる。
That is, in FIG. 6, an electrode connector 12 is placed on the electrode 11 on the edge portion 9 of the insulating plate 8 led out from the liquid crystal portion 10.
contact so that the conductive portion 6 of the

以下さらに本発明を実施例について説明する。The present invention will be further described below with reference to Examples.

実施例 1 前記(a)の黒鉛粉末45重量係、前記(b)のネオプ
レン系合成ゴムとして、昭和高分子株式会社製商品名ビ
ニロール2200を25重量係、前記(c)の溶剤イソ
ホロン30重量係を混合攪拌均一に溶解分散せしめ、見
掛は比重1.1、粘度300ポイズの導電性懸濁液組成
物(a+b+c)を調製した。
Example 1 45 parts by weight of the graphite powder in the above (a), 25 parts by weight of vinylol 2200 (trade name, manufactured by Showa Kobunshi Co., Ltd.) as the neoprene synthetic rubber in the above (b), 30 parts by weight of the solvent isophorone in the above (c) were uniformly dissolved and dispersed by mixing and stirring to prepare a conductive suspension composition (a+b+c) having an apparent specific gravity of 1.1 and a viscosity of 300 poise.

次に、これを用いて厚み1朋のクロロプレンゴム板1の
一方の全面にスクリーン印刷法により、200μの厚み
に塗布し、被着せしめる〔工程(A)〕。
Next, this is applied to a thickness of 200 μm by screen printing on one entire surface of a 1 mm thick chloroprene rubber plate 1 [Step (A)].

この塗布面を100’Cの温度で約5分間乾燥した〔工
程山)〕。
This coated surface was dried at a temperature of 100'C for about 5 minutes [Step 1].

次に、前記工程(A+B )にて得られた導電性ヒート
シール組成物被着クロロプレンゴム板(第1図および第
2図)を幾層にも塗布面が非塗布面と接触するように重
ね、さらに最上段にクロロプレンゴム板1を重ねて、第
3図に示すように、5kg/crAの圧力を加え、80
0 KHzの高周波をかけ熱圧着を行った〔工程(C)
〕。
Next, the chloroprene rubber plates coated with the conductive heat-sealing composition obtained in the step (A+B) (Figures 1 and 2) are stacked in several layers so that the coated side is in contact with the non-coated side. , further stack the chloroprene rubber plate 1 on the top layer, apply a pressure of 5 kg/crA as shown in Fig. 3, and press 80
Thermocompression bonding was performed using a high frequency of 0 KHz [Step (C)
].

次に、この多層成形体を第4図及び第5図に示すように
所望する形成に切断切削した〔工程(Di)。
Next, this multilayer molded body was cut into a desired shape as shown in FIGS. 4 and 5 [Step (Di)].

前記工程(A+B+C+D)にて得た電極コネクター1
2のヒートシールした部分、すなわち導電部分6は完全
な導電性を有し、抵抗値のバラツキは±5係内であった
Electrode connector 1 obtained in the above step (A+B+C+D)
The heat-sealed portion of No. 2, that is, the conductive portion 6, had perfect conductivity, and the variation in resistance value was within ±5 coefficients.

また、この時の接着強度は十分であった。Moreover, the adhesive strength at this time was sufficient.

導電部分6のピッチは1.15yxmであった。なお、
前記懸濁液の組成のネオプレン系合成ゴム(b)の代り
にポリアミド樹脂、エチレン酢酸ビニル共重合体樹脂、
ポリメチルメタクリレート樹脂等の熱可塑性高分子結合
剤を用いても、略々同様の結果を得た。
The pitch of the conductive portions 6 was 1.15 yxm. In addition,
Polyamide resin, ethylene vinyl acetate copolymer resin,
Substantially similar results were obtained using a thermoplastic polymer binder such as polymethyl methacrylate resin.

一方、又、前記クロロプレンゴム板1の代りに、塩化ビ
ニル樹脂、ポリプロピレン樹脂、ポリアミドイミド樹脂
、ポリウレタン樹脂等の板やフィルムで可撓性のある基
板を用いても、略々同様の結果を得た。
On the other hand, almost the same results can be obtained by using a flexible substrate made of vinyl chloride resin, polypropylene resin, polyamideimide resin, polyurethane resin, etc., in place of the chloroprene rubber plate 1. Ta.

実施例 2 前記(a)の黒鉛粉末35重量係及びカーボンブラック
粉末5重量係、前記実施例1の(b)合成ゴム20重量
%、前記(d)の粘着付与剤としてのテルペン系樹脂(
日本ゼオン株式会社製商品名クイントンU−185)1
0重量係、前記(c)の溶剤イソホロン30重量係を混
合し均一に溶解分散せしめ、見掛は比重1.1、粘度4
00ポイズの導電性懸濁液組成物(a+b+c+d)を
調製した。
Example 2 35% by weight of graphite powder and 5% by weight of carbon black powder in (a), 20% by weight of synthetic rubber in (b) in Example 1, and terpene resin as a tackifier in (d) (
Product name: Quinton U-185) 1 manufactured by Nippon Zeon Co., Ltd.
0 weight ratio and 30 weight ratio of isophorone from the above (c) were mixed and uniformly dissolved and dispersed, with an apparent specific gravity of 1.1 and viscosity of 4.
A conductive suspension composition (a+b+c+d) of 00 poise was prepared.

次に、これを用いて、厚み0.5−のクロロプレンゴム
板1の一方の全面にスクリーン印刷法により200μの
厚みに塗布し、被着せしめる〔工程(A)〕。
Next, using this, it is coated on one entire surface of a 0.5-thick chloroprene rubber plate 1 to a thickness of 200 μm by screen printing [Step (A)].

この塗布面を100℃の温度で約10分間乾燥した〔工
程(B)〕。
This coated surface was dried at a temperature of 100° C. for about 10 minutes [Step (B)].

次に、前記工程(A+B)にて得られた導電性ヒートシ
ール組成物被着クロロプレンゴムを幾層にも重ね、さら
に最上段にクロロプレンゴム板を第3図に示すように、
重ねて、5kg/cm3の圧力を加え、700KH2の
高周波をかけ熱圧着を行った〔工程(C)〕。
Next, the conductive heat-sealing composition-coated chloroprene rubber obtained in step (A+B) was stacked in several layers, and a chloroprene rubber plate was placed on the top layer as shown in FIG.
They were overlapped and thermocompression bonded by applying a pressure of 5 kg/cm3 and a high frequency of 700 KH2 [Step (C)].

次に、この多層成形体を第4図及び第5図に示すように
、所望する形状に切断した〔工程(D)。
Next, this multilayer molded body was cut into a desired shape as shown in FIGS. 4 and 5 [Step (D)].

前記工程(A+B+C+D)にて得た電極コネクター1
2のヒートシールした部分、すなわち導電部分6は完全
な導電性を有し、抵抗値のバラツキは±5%内であった
Electrode connector 1 obtained in the above step (A+B+C+D)
The heat-sealed portion of No. 2, that is, the conductive portion 6, had perfect conductivity, and the variation in resistance value was within ±5%.

また、この時の接着強度は十分であった。Moreover, the adhesive strength at this time was sufficient.

導電部分6のピッチは0.65mmであった。The pitch of the conductive portions 6 was 0.65 mm.

なお、前記ネオプレン系合成ゴム(b)の代りにポリア
ミド樹脂、エチレン酢酸ビニル共重合体樹脂、ポリメチ
ルメタクリレート樹脂等の熱可塑性高分子結合剤を用い
ても、略々同様の結果を得た。
In addition, substantially the same results were obtained even when a thermoplastic polymer binder such as polyamide resin, ethylene vinyl acetate copolymer resin, polymethyl methacrylate resin, etc. was used in place of the neoprene synthetic rubber (b).

実施例 3 前記(a)の銀粉末38重景係、前記実施例1の(b)
合成ゴム19重量係、前記(c)の溶剤イソホロン43
重量係を混合攪拌し均一に溶解分散せしめ、見掛は比重
1.6、粘度190ポイズの導電性懸濁液組成物(a+
b+c)を調製した。
Example 3 Silver powder 38-layer of the above (a), (b) of the above Example 1
Synthetic rubber 19 weight ratio, solvent (c) above isophorone 43
A conductive suspension composition (a+
b+c) was prepared.

次に、これを用いて厚み0.1mmのポリエステル樹脂
フィルム基板1の一方の全面にスクリーン印刷法により
、50μの厚みに塗布し、被着せしめる〔工程(A)〕
Next, this is applied to one entire surface of a polyester resin film substrate 1 with a thickness of 0.1 mm to a thickness of 50 μm by screen printing method [Step (A)]
.

この塗布面を100℃Cの温度で約5分間乾燥した〔工
程(B)〕。
This coated surface was dried at a temperature of 100° C. for about 5 minutes [Step (B)].

次に、前記工程(A十B)にて得られた導電性ヒートシ
ール組成物被着ポリエステル樹脂フィルムを幾層にも重
ね、さらに最上段にポリエステル樹脂フィルムを重ねて
、5kg/cm2の圧力を加え、500KH2の高周波
をかけ熱圧着を行った〔工程(C)〕。
Next, the conductive heat-sealing composition-coated polyester resin film obtained in the step (A-B) was stacked in several layers, and the polyester resin film was further stacked on the top layer, and a pressure of 5 kg/cm2 was applied. In addition, thermocompression bonding was performed by applying a high frequency of 500KH2 [Step (C)].

次に、この多層成形体を第4図及び第5図に示すように
所望する形状に切断した〔工程CD)。
Next, this multilayer molded body was cut into a desired shape as shown in FIGS. 4 and 5 (Step CD).

前記工程(A+B+C十D)にて得た電極コネクター1
2のヒートシールした部分、すなわち導電部分6は完全
な導電性を有し、抵抗値のバラツキは±5係内であった
Electrode connector 1 obtained in the above step (A+B+C+D)
The heat-sealed portion of No. 2, that is, the conductive portion 6, had perfect conductivity, and the variation in resistance value was within ±5 coefficients.

また、この時の接着強度は十分であった。Moreover, the adhesive strength at this time was sufficient.

導電部分6のピッチは0.15mmであった。The pitch of the conductive portions 6 was 0.15 mm.

なお、前記ネオプレン系合成ゴム(b)の代りにポリア
ミド樹脂、エチレン酢酸ビニル共重合体樹脂、ポリメチ
レンメタクリレート樹脂等の熱可塑性高分子結合剤を用
いても、略略同様の結果を得た。
In addition, substantially the same results were obtained even when a thermoplastic polymer binder such as a polyamide resin, ethylene vinyl acetate copolymer resin, or polymethylene methacrylate resin was used in place of the neoprene synthetic rubber (b).

一方、又、前記ポリエステル樹脂フィルム基板1の代り
に、天然ゴム、合成ゴム、塩化ビニル樹脂、ポリプロピ
レン樹脂、ポリアミドイミド樹脂、ポリウレタン樹脂等
の板やフィルムを用いても、略々同様の結果を得た。
On the other hand, substantially the same results can be obtained by using a plate or film made of natural rubber, synthetic rubber, vinyl chloride resin, polypropylene resin, polyamideimide resin, polyurethane resin, etc. in place of the polyester resin film substrate 1. Ta.

実施例 4 前記(a)の黒鉛粉末35重量%及びカーボンブラック
粉末5重量%、前記(b)のエチレン酢酸ビニル共重合
体樹脂として昭和高分子化学株式会社製商品名ビニロー
ル5E−L25重量%、前記(c)の溶剤イソホロン3
5重量%を混合攪拌し均一に溶解分散せしめ、見掛は比
重1.11粘度300ポイズの導電性懸濁液組成物(a
+b+c)を調製した。
Example 4 35% by weight of graphite powder and 5% by weight of carbon black powder in the above (a), 25% by weight of ethylene vinyl acetate copolymer resin manufactured by Showa Kobunshi Kagaku Co., Ltd. under the trade name Vinyroll 5E-L, Solvent (c) isophorone 3
5% by weight was mixed and stirred to uniformly dissolve and disperse the resulting conductive suspension composition (a
+b+c) was prepared.

次に、これを用いて、厚み0.087+!7+1のポリ
エステル樹脂フィルム1の一方の全面にスクリーン印刷
法により25μの厚みに塗布し被着せしめる〔工程(A
)〕。
Next, using this, the thickness is 0.087+! 7+1 Polyester resin film 1 is coated and adhered to a thickness of 25 μm by screen printing on one entire surface of the polyester resin film 1 [Step (A)
)].

この塗布面を100℃の温度で約10分間乾燥した〔工
程(B)〕。
This coated surface was dried at a temperature of 100° C. for about 10 minutes [Step (B)].

次に、前記工程(A十B )にて得られた導電性ヒート
シール組成物被着ポリエステルフィルムを幾層にも重ね
、さらに最上段にポリエステルフィルムを第3図に示す
ように重ねて、5kg/cm2の圧力を加え、500
KHzの高周波をかけ熱圧着を行なった〔工程(C)〕
Next, the conductive heat-sealing composition-coated polyester film obtained in the above steps (A and B) was stacked in several layers, and a polyester film was further stacked on the top layer as shown in FIG. /cm2 pressure and 500
Thermocompression bonding was performed by applying KHz high frequency [Step (C)]
.

次に、この多層成形体を第4図及び第5図に示すように
、所望する形状に切断した〔工程(D)〕。
Next, this multilayer molded body was cut into a desired shape as shown in FIGS. 4 and 5 [Step (D)].

前記工程(A十B十C+D)にて得られた電極コネクタ
ー12のヒートシールした部分、すなわち導電部分6は
完全な導電性を有し、抵抗値のバラツキは±5%内であ
った。
The heat-sealed portion of the electrode connector 12 obtained in the step (A+B+C+D), that is, the conductive portion 6, had perfect conductivity, and the variation in resistance value was within ±5%.

また、この時の接着強度は十分であった。Moreover, the adhesive strength at this time was sufficient.

導電部分6のピッチは0.1mmであった。なお、前記
エチレン酢酸ビニル共重合体樹脂の代りにネオプレン系
合成ゴム、ポリアミド樹脂、ポリメチルメタクリレート
樹脂等の熱可塑性高分子結合剤を用いても、略々同様の
結果を得た。
The pitch of the conductive portions 6 was 0.1 mm. In addition, substantially the same results were obtained when a thermoplastic polymer binder such as neoprene synthetic rubber, polyamide resin, or polymethyl methacrylate resin was used instead of the ethylene vinyl acetate copolymer resin.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例に%る導電性ヒートシール組
成物被着可撓性絶縁フィルム基板(B工程)を示す拡大
斜視図、第2図は同じくその正面図、第3図は本発明の
一実施例の積層成形工程(C工程)における高周波誘導
加熱と加圧圧縮の過程を説明する斜視図、第4図は積層
成形工程(C)にて得られた多層成形体5の拡大斜視図
、第5図はこの多層成形体5から切削して得られるコネ
クター12の拡大斜視図(D工程)、および第6図は本
発明に%る電極コネクター12を液晶表示管電極部分1
1に適用する場合を模式的に示す拡大斜視図である。 1……可撓性絶縁フイルム基板、2……導電性懸濁液組
成物の塗布乾燥層、3……接合面、4……高周波発生に
よる誘電加熱装置および圧縮プレス、5……多層成形体
、6……導電部分、7……絶縁部分、8……ガラス板等
の絶縁板、9……絶縁板8の端縁部、10……液晶部分
、11……液晶部分9の電極、12……コネクター、A
……可撓性絶縁基板1の横寸法(長さ寸法)10〜60
0mm、B……可撓性絶縁基板1の縦寸法10〜600
mm、 C……可撓性絶縁基板1の厚さ0.01〜3.
0朋、D……導電性懸濁液組成物の塗布層2の厚さ0.
01〜0.5mm、E……コネクター12の縦寸法1〜
10mm、F……コネクター12の横寸法1〜10mm
、G……コネクター12の長さ10〜500mm、P…
…加圧(圧縮プレス)。
FIG. 1 is an enlarged perspective view showing a flexible insulating film substrate (Step B) coated with a conductive heat-sealing composition according to an embodiment of the present invention, FIG. 2 is a front view thereof, and FIG. FIG. 4 is a perspective view illustrating the process of high-frequency induction heating and pressure compression in the lamination molding process (C process) of an embodiment of the present invention, and FIG. FIG. 5 is an enlarged perspective view of the connector 12 obtained by cutting the multilayer molded body 5 (step D), and FIG.
FIG. 1 is an enlarged perspective view schematically showing a case in which the present invention is applied to No. 1; DESCRIPTION OF SYMBOLS 1...Flexible insulating film substrate, 2...Dry coated layer of conductive suspension composition, 3...Joining surface, 4...Dielectric heating device and compression press using high frequency generation, 5...Multilayer molded body , 6... Conductive part, 7... Insulating part, 8... Insulating plate such as a glass plate, 9... End edge of insulating plate 8, 10... Liquid crystal part, 11... Electrode of liquid crystal part 9, 12 ...Connector, A
...The horizontal dimension (length dimension) of the flexible insulating substrate 1 is 10 to 60
0mm, B...Vertical dimension of flexible insulating substrate 1 10-600
mm, C...The thickness of the flexible insulating substrate 1 is 0.01 to 3.
0, D...The thickness of the coating layer 2 of the conductive suspension composition is 0.
01~0.5mm, E... Vertical dimension of connector 12 1~
10mm, F... Horizontal dimension of connector 12 1 to 10mm
, G...The length of the connector 12 is 10 to 500 mm, P...
...Pressure (compression press).

Claims (1)

【特許請求の範囲】 1(a)粒度0.1〜40μの黒鉛粉末、銀粉末、およ
び粒度0.1μ以下のカーボンブラックの1種又は2種
以上から成る微粉末10〜70重量係と、(b)クロロ
プレン系合成ゴム、ポリアミド樹脂、エチレン酢酸ビニ
ル共重合体樹脂、ポリメチルメタクリレート樹脂の1種
又は2種以上の熱可塑性高分子結合剤10〜65重量係
と、(c)イソホロン、ジペンテン、アセトフェノン、
クロルトルエン、ジエチルカルピトール、トルエンの1
種又は2種以上の溶剤25〜60重量%とを混合し溶解
分散せしめた見掛は比重1.1〜1.7、粘度100〜
500ポイズの懸濁液(a+b+c)から成る導電性ヒ
ートシール組成物を、所望の寸法を有する可撓性絶縁フ
ィルム基板の少なくとも一方の全面にスクリーン印刷又
はグラビア印刷塗布する工程(A)と、該印刷塗布工程
(A)にて形成した印画塗布面を50〜150℃と温度
で5〜15分間乾燥せしめる工程旧と、 該乾燥工程(B)にて得られた導電性ヒートシール組成
物被着可撓性絶縁フィルム基板を前記塗布面を交互にし
て層状に所望枚数堆積し、1〜30kg/cm3の圧力
を上下に加えると共に、100KH2〜10MHzの高
周波をかけて前記導電性ヒートシール組成物を熱再活性
させ、前記可撓性絶縁フィルム基板を一体に積層成形さ
せ冷却後解任を行なう工程(0と、 該積層成形工程(0にて得られた交互に導電性層と絶縁
層とから成る多層成形体を所望形状寸法に切断する工程
(D)との結合(A+B+C+D)から成ることを特徴
とする液晶表示管用電極コネクターの製造方法。 2(a)粒度0.1〜40μの黒鉛粉末、銀粉末、およ
び粒度0.1μ以下のカーボンブラックの1種又は2種
以上から成る微粉末10〜70重量%と、(b)クロロ
プレン系合成ゴム、ポリアミド樹脂、エチレン酢酸ビニ
ル共重合体樹脂、ポリメチルメタクリレート樹脂の1種
又は2種以上の熱可塑性高分子結合剤10〜65重量係
と、(C)イソホロン、ジペンテン、アセトフェノン、
クロルトルエン、ジエチルカルピトール、トルエンの1
種又は2種以上の溶剤25〜60重量係と、さらに(d
)テルペン系樹脂、フェノール系樹脂、脂肪族系炭化水
素樹脂の1種又は2種以上の粘着付与剤0.1〜20重
量係とを混合し溶解分散せしめた見掛は比重1.1〜1
.7、粘度100〜500ポイズの懸濁液(a+b+c
+d)から成る導電性ヒートシール組成物を、所望の寸
法を有する可撓性絶縁フィルム基板の少なくとも一方の
全面にンクリーン印刷又はグラビア印刷塗布する工程(
4)と、該印刷塗布工程(支)にて形成した印画塗布面
を50〜150℃の温度で5〜15分間乾燥せしめる工
程[有])と、 該乾燥下mBにて得られた導電性ヒートシール組成物被
着可撓性絶縁フィルム基板を前記塗布面を交互にして層
状に所望枚数堆積し、1〜30kg/cm3の圧力を上
下に加えると共に、100KH2〜10MHzの高周波
をかけて前記導電性ヒートシール組成物を熱再活性させ
、前記可撓性絶縁フィルム基板を一体に積層成形させ冷
却後解圧を行う工程に)と、該積層成形工程(C)にて
得られた交互に導電性層と絶縁層とから成る多層成形体
を所望形成寸法に切断する工程(D)との結合(A+B
+C十D)から成ることを特徴とする液晶表示管用電極
コネクターの製造方法。
[Scope of Claims] 1(a) Fine powder 10 to 70% by weight consisting of one or more of graphite powder with a particle size of 0.1 to 40μ, silver powder, and carbon black with a particle size of 0.1μ or less; (b) a thermoplastic polymer binder of 10 to 65% by weight of one or more of chloroprene synthetic rubber, polyamide resin, ethylene vinyl acetate copolymer resin, and polymethyl methacrylate resin, and (c) isophorone, dipentene. , acetophenone,
Chlortoluene, diethylcarpitol, toluene 1
The apparent specific gravity of 1.1-1.7 and viscosity of 100-100 when mixed with 25-60% by weight of a seed or two or more solvents and dissolved and dispersed.
(A) applying a conductive heat-sealing composition consisting of a 500 poise suspension (a+b+c) on at least one entire surface of a flexible insulating film substrate having desired dimensions by screen printing or gravure printing; The process of drying the print coated surface formed in the print coating process (A) at a temperature of 50 to 150°C for 5 to 15 minutes, and the adhesion of the conductive heat seal composition obtained in the drying process (B) A desired number of flexible insulating film substrates are deposited in layers with the coated surfaces alternated, and a pressure of 1 to 30 kg/cm is applied vertically, and a high frequency of 100 KH to 10 MHz is applied to seal the conductive heat seal composition. A process of heat reactivation, lamination molding of the flexible insulating film substrates together, and removal after cooling (0); A method for manufacturing an electrode connector for a liquid crystal display tube, characterized by comprising a step (A+B+C+D) of combining with a step (D) of cutting a multilayer molded body into a desired shape and size. 2(a) graphite powder with a particle size of 0.1 to 40μ; 10 to 70% by weight of fine powder consisting of one or more types of silver powder and carbon black with a particle size of 0.1 μ or less, and (b) chloroprene synthetic rubber, polyamide resin, ethylene vinyl acetate copolymer resin, polyester One or more thermoplastic polymer binders of 10 to 65% by weight of methyl methacrylate resin, and (C) isophorone, dipentene, acetophenone,
Chlortoluene, diethylcarpitol, toluene 1
25 to 60% by weight of a species or two or more solvents, and further (d
) One or more types of terpene resin, phenolic resin, and aliphatic hydrocarbon resin are mixed with 0.1 to 20% by weight of a tackifier, and the apparent specific gravity is 1.1 to 1.
.. 7. Suspension with a viscosity of 100 to 500 poise (a+b+c
A step of applying the conductive heat-sealing composition consisting of +d) by clean printing or gravure printing on at least one entire surface of a flexible insulating film substrate having desired dimensions (
4), a step of drying the printed coating surface formed in the printing coating step (support) at a temperature of 50 to 150°C for 5 to 15 minutes, and the conductivity obtained in mB under drying. A desired number of flexible insulating film substrates coated with the heat sealing composition are deposited in layers with the coated surfaces alternated, and a pressure of 1 to 30 kg/cm3 is applied vertically, and a high frequency of 100 KH2 to 10 MHz is applied to the conductive film. (a step of thermally reactivating the conductive heat-sealing composition, integrally laminating the flexible insulating film substrate, and decompressing it after cooling); (A+B
1. A method for manufacturing an electrode connector for a liquid crystal display tube, characterized by comprising:
JP10753078A 1978-09-04 1978-09-04 Manufacturing method of electrode connector for liquid crystal display tube Expired JPS5811629B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10753078A JPS5811629B2 (en) 1978-09-04 1978-09-04 Manufacturing method of electrode connector for liquid crystal display tube

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10753078A JPS5811629B2 (en) 1978-09-04 1978-09-04 Manufacturing method of electrode connector for liquid crystal display tube

Publications (2)

Publication Number Publication Date
JPS5535326A JPS5535326A (en) 1980-03-12
JPS5811629B2 true JPS5811629B2 (en) 1983-03-03

Family

ID=14461519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10753078A Expired JPS5811629B2 (en) 1978-09-04 1978-09-04 Manufacturing method of electrode connector for liquid crystal display tube

Country Status (1)

Country Link
JP (1) JPS5811629B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834433A (en) * 1981-08-25 1983-02-28 Optrex Corp Electro-optical element of high reliability and its production
JPS63316885A (en) * 1987-06-19 1988-12-26 キヤノン株式会社 External circuit connection structure for liquid crystal panel
DE19527661C2 (en) * 1995-07-28 1998-02-19 Optrex Europ Gmbh Carrier comprising electrical conductors with an electronic component and method for contacting conductors of a substrate with contact warts of an electronic component

Also Published As

Publication number Publication date
JPS5535326A (en) 1980-03-12

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