JPH025598Y2 - - Google Patents
Info
- Publication number
- JPH025598Y2 JPH025598Y2 JP1982093288U JP9328882U JPH025598Y2 JP H025598 Y2 JPH025598 Y2 JP H025598Y2 JP 1982093288 U JP1982093288 U JP 1982093288U JP 9328882 U JP9328882 U JP 9328882U JP H025598 Y2 JPH025598 Y2 JP H025598Y2
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- layer
- resin
- resin layer
- conductive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 19
- 238000012546 transfer Methods 0.000 claims description 17
- 239000011888 foil Substances 0.000 claims description 12
- 239000003973 paint Substances 0.000 claims description 11
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 description 28
- 229920005989 resin Polymers 0.000 description 28
- 229920003023 plastic Polymers 0.000 description 10
- 239000004033 plastic Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 8
- -1 polypropylene Polymers 0.000 description 8
- 239000004743 Polypropylene Substances 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000002985 plastic film Substances 0.000 description 7
- 229920001155 polypropylene Polymers 0.000 description 7
- 238000007756 gravure coating Methods 0.000 description 6
- 239000000976 ink Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229920006267 polyester film Polymers 0.000 description 6
- 229920000178 Acrylic resin Polymers 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 4
- 239000011231 conductive filler Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 238000007751 thermal spraying Methods 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- 229920000298 Cellophane Polymers 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000005038 ethylene vinyl acetate Substances 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 2
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000012461 cellulose resin Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000007763 reverse roll coating Methods 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Non-Insulated Conductors (AREA)
Description
【考案の詳細な説明】
本考案は電磁波による障害から各種機器を遮蔽
する、あるいは各種機器から発生する電磁波の漏
洩を防ぐ為の電磁波シールド用の転写箔に関す
る。更に詳しくは剥離シートであるプラスチツク
シート又はフイルム基材の全面或いは部分的に剥
離層を形成し、以下順に金属等の導電性フイラー
からなる導電性樹脂層を設け、次に感熱感圧接着
性樹脂からなる接着層を配してなる転写箔によ
り、従来のシールド材では得られなかつた性能、
加工性を期待し得る電磁波シールド用転写箔を提
供するものである。[Detailed Description of the Invention] The present invention relates to a transfer foil for electromagnetic shielding, which is used to shield various types of equipment from interference caused by electromagnetic waves, or to prevent leakage of electromagnetic waves generated from various types of equipment. More specifically, a release layer is formed on the entire surface or part of a plastic sheet or film base material that is a release sheet, and then a conductive resin layer made of a conductive filler such as metal is provided in this order, and then a heat-sensitive pressure-sensitive adhesive resin is formed. The transfer foil, which has an adhesive layer made of
The present invention provides a transfer foil for electromagnetic shielding that can be expected to have good workability.
エレクトロニクスの発展に伴い各種の電磁波障
害が顕在化し身近なところではテレビの画像障
害、ラジオの雑音障害の増加、コンピユーターを
含むデーター処理装置や事務機など電子機器の誤
動作等、その危検性も重大なものとなつており、
また近年軽量性、経済性優れた電気絶縁性から、
金属材料からプラスチツクへの移行が著しいが、
このプラスチツクは電磁波をシールド出来ない材
料であり、とくにプラスチツクのシールド対策は
急務となつている。従来の一般的なプラスチツク
への電磁波シールド対策は亜鉛溶射と導電性塗料
のスプレーコートやハケによる塗布でプラスチツ
クへ導電性を付与しシールド対策としているが、
これら溶射、スプレー等の場合の欠点として導電
層はムラが発生しやすく均一な塗布は困難であ
り、特に亜鉛溶射の場合、被コーテイング材との
接着を上げる為に表面処理を必要とし量産性に乏
しく騒音、亜鉛蒸気による労働環境の悪い点ま
た、溶射の為の装置が非常に高価であるといつた
欠点を有したものであり、また、導電性塗料をス
プレー、ハケ塗りする場合、溶剤を含有する為、
乾燥の問題、引火の危険性等の欠点を有してい
た。 With the development of electronics, various types of electromagnetic interference have become more apparent, and the risks of these interferences are becoming more serious in our daily lives, such as image disturbances on televisions, an increase in radio noise disturbances, and malfunctions of electronic equipment such as computers, data processing equipment, and office machines. It has become a thing,
In recent years, due to its lightweight, economical and excellent electrical insulation properties,
There has been a remarkable shift from metal materials to plastics,
This plastic is a material that cannot shield electromagnetic waves, and measures to shield plastic are particularly urgent. Conventional general electromagnetic shielding measures for plastics include zinc thermal spraying and the application of conductive paint by spray coating or brushing to make the plastic conductive.
The disadvantage of thermal spraying, spraying, etc. is that the conductive layer is prone to unevenness and is difficult to apply uniformly.In particular, zinc thermal spraying requires surface treatment to improve adhesion to the material to be coated, making mass production difficult. The work environment is poor due to poor noise and zinc vapor, and the equipment for thermal spraying is very expensive. Because it contains
It had drawbacks such as drying problems and the risk of catching fire.
その他の手法として、直接プラスチツクを導電
化する方法として、導電性のカーボンブラツク、
金属粉、金属繊維等の導電性フイラーをプラスチ
ツクに練り込む方法が開発されている。この手法
はいつさいの二次加工が不要であるといつた大き
な特徴を有するが、電磁波シールドに適応するに
は、体積比抵抗でおよび10Ω以下の高導電性を必
要とし、この程度の導電性を得るには、導電性フ
イラーをかなり高充填せねばならず、プラスチツ
クの持つ加工性、強度等の劣化を招く等の欠点、
また均一分散が困難であるなどの問題点を有する
ものであつた。 Other methods to directly make plastic conductive include conductive carbon black,
Methods have been developed to incorporate conductive fillers such as metal powders and metal fibers into plastics. This method has the great feature that it does not require any secondary processing, but in order to be applied to electromagnetic shielding, it requires volume specific resistance and high conductivity of 10Ω or less. In order to obtain this, it is necessary to fill the conductive filler to a fairly high level, which leads to disadvantages such as deterioration of the workability and strength of plastics.
Further, there were other problems such as difficulty in uniform dispersion.
本考案は以上の様な事情を鑑みてなされたもの
で、導電性塗料を塗布形成してなる導電性樹脂層
を電磁波シールド材として転写箔をプラスチツク
板、あるいは成形物に熱転写し、シールド特性を
付与するものであり、ムラのない均一な導電性樹
脂層の形成が可能となり、また二次加工用途によ
つては部分的に導電性樹脂層の肉厚を増減するこ
とも導電性塗料をグラビア塗布、シンクスクリー
ン塗布等の手法により自由に出来る為、可能とな
り、逆に転写し形成された導電性樹脂層は、剥離
層が保護層となり表面に存在するので、亜鉛溶
射、導電性塗料のスプレーコート、ハケ塗りにお
いては問題となつていた脱落による電子機器への
障害は改善されるものであり、経済性に優れ、取
扱いを容易なものにする電磁波シールド用材料で
ある。 The present invention was developed in view of the above circumstances, and uses a conductive resin layer formed by coating a conductive paint as an electromagnetic wave shielding material, and thermally transfers transfer foil onto a plastic plate or molded object to improve shielding properties. It is possible to form a uniform conductive resin layer without unevenness, and depending on the secondary processing application, it is also possible to partially increase or decrease the thickness of the conductive resin layer. This is possible because it can be done freely using techniques such as coating and sink screen coating, and on the other hand, the conductive resin layer that is transferred and formed is present on the surface with a peeling layer as a protective layer, so it cannot be used for zinc spraying or conductive paint spraying. It is a material for electromagnetic shielding that is economical and easy to handle, since it solves the problem of damage to electronic equipment due to falling off, which has been a problem in coating and brushing.
次に本考案を図を用いて説明する。第1図は本
考案に係わる転写箔の一実施例の断面を示し1は
プラスチツクフイルムまたはシート基材、2は剥
離層、3は導電性樹脂層、4は接着剤層である。
1のプラスチツクフイルムシート基材としては例
えばセロフアン、ポリアミド、ポリエステル、ポ
リプロピレン、ポリエチレン、ポリカーボネー
ト、ポリ塩化ビニル、ポリ塩化ビニリデン、ポリ
ビニルアルコール、ポリビニルアセタール、ポリ
スチレン、ポリ酢酸ビニル等、またそれらを貼り
合せたものや紙、不織布と貼り合わせたものが使
用でき、また更に、紙等に分子量4000以上のポリ
エチレングリコールを塗布したものも使用でき
る。 Next, the present invention will be explained using figures. FIG. 1 shows a cross section of one embodiment of a transfer foil according to the present invention, and 1 is a plastic film or sheet base material, 2 is a release layer, 3 is a conductive resin layer, and 4 is an adhesive layer.
Examples of the plastic film sheet base material 1 include cellophane, polyamide, polyester, polypropylene, polyethylene, polycarbonate, polyvinyl chloride, polyvinylidene chloride, polyvinyl alcohol, polyvinyl acetal, polystyrene, polyvinyl acetate, etc., and materials bonded together. Materials laminated with paper, paper, or non-woven fabric can be used, and paper or the like coated with polyethylene glycol having a molecular weight of 4000 or more can also be used.
次に2の剥離層は熱可塑性樹脂、天然ゴム、合
成ゴム等を主成分とした塗工剤を全面あるいは部
分的にグラビアコート法、ロールコート法、シル
クスクリーン印刷法等のコーテイング法によつて
塗布、乾燥し形成したものであり、前記シート基
材1と剥離性を有し、導電性樹脂層3と接着性を
有したものを使用し、転写の後は導電性樹脂層3
の保護皮膜としての働きもするものである。 Next, the second release layer is coated entirely or partially with a coating agent mainly composed of thermoplastic resin, natural rubber, synthetic rubber, etc., using a coating method such as gravure coating, roll coating, or silk screen printing. It is formed by coating and drying, and a material that has releasability with the sheet base material 1 and adhesiveness with the conductive resin layer 3 is used, and after transfer, the conductive resin layer 3
It also functions as a protective film.
導電性樹脂層3は銀、銅、ニツケル、アルミニ
ウム、鉄等の金属及びこれらの合金からなる金属
粉、或は金属繊維また、カーボンブラツク、グラ
フアイト粉、カーボン繊維等を導電性フイラーと
して、合成樹脂に分散してなる導電性塗料をグラ
ビアコート法、ロールコート法、シルクスクリー
ン印刷法により塗布形成したものであり、体積比
抵抗10Ω以下の高導電性を有するものである。導
電性が10Ω以上の場合、十分な電磁波シールド特
性を得ることが出来ず、導電性は高いほどシール
ド性は向上する。 The conductive resin layer 3 is made of metal powders made of metals such as silver, copper, nickel, aluminum, iron, and alloys thereof, or metal fibers, carbon black, graphite powder, carbon fibers, etc., as a conductive filler. It is formed by applying a conductive paint dispersed in a resin using a gravure coating method, a roll coating method, or a silk screen printing method, and has high conductivity with a volume specific resistance of 10Ω or less. If the conductivity is 10Ω or more, sufficient electromagnetic shielding properties cannot be obtained, and the higher the conductivity, the better the shielding properties.
また厚味は5μ以上を必要とし、5μ以下ではピ
ンホール等の発生を招く恐れがあり、好ましくは
5〜100μ程度の厚味である。 Further, the thickness needs to be 5μ or more, and if it is less than 5μ, pinholes etc. may occur, so the thickness is preferably about 5 to 100μ.
この導電性塗料に使用できる合成樹脂として
は、ポリアミド、ポリエステル、酢酸ビニル樹
脂、アクリル樹脂等である。 Synthetic resins that can be used in this conductive paint include polyamide, polyester, vinyl acetate resin, acrylic resin, and the like.
接着剤層4としては上記導電性樹脂層3と強い
接着性を有し被転写体に対して適した感熱又は感
圧接着性樹脂を適宜用いる。 As the adhesive layer 4, a heat-sensitive or pressure-sensitive adhesive resin that has strong adhesion to the conductive resin layer 3 and is suitable for the object to be transferred is appropriately used.
例えば被転写体がポリオレフイン樹脂である場
合は塩素化ポリプロピレン、塩素化ポリエチレ
ン、塩素化EVA(エチレン酢酸ビニル共重合体)
スチレン系エラストマー等が使用出来、被転写体
がポリスチロールである場合はアクリル樹脂、塩
化ビニール−酢酸ビニル共重合体等が使える。
尚、第3図に示すように剥離層2を部分的に形成
せしめ、導電性樹脂層3をシート基材1と剥離性
を有し、剥離層2及び接着剤層4と強く接着する
ものを選ぶことにより、被転写体に転写した場
合、導電性樹脂層3を表面に露出させた部分を任
意に設けることにより2次加工、アツセンブリの
際、他の導電材との導通状態での接合を容易にす
ることも可能である。また第2図の様にインキ層
5を設けることにより任意の印字、模様等、意匠
性を付写することも可能である。 For example, if the material to be transferred is polyolefin resin, use chlorinated polypropylene, chlorinated polyethylene, or chlorinated EVA (ethylene-vinyl acetate copolymer).
A styrene elastomer or the like can be used, and if the object to be transferred is polystyrene, an acrylic resin, vinyl chloride-vinyl acetate copolymer, etc. can be used.
In addition, as shown in FIG. 3, the release layer 2 is partially formed, and the conductive resin layer 3 is made of a material that has releasability with the sheet base material 1 and strongly adheres to the release layer 2 and the adhesive layer 4. When transferred to a material to be transferred, by optionally providing an exposed portion of the conductive resin layer 3 on the surface, it is possible to connect the conductive resin layer 3 in a conductive state with other conductive materials during secondary processing and assembly. It is also possible to make it easier. Furthermore, by providing an ink layer 5 as shown in FIG. 2, it is also possible to add any design such as printing or patterns.
インキとしては塩化ビニル−酢酸ビニル共重合
体系、塩化ゴム系、エチレン−酢酸ビニル系樹
脂、セルロース系樹脂等を主体としたインキが使
用出来る。 As the ink, inks based on vinyl chloride-vinyl acetate copolymer, chlorinated rubber, ethylene-vinyl acetate, cellulose resin, etc. can be used.
本考案はプラスチツクからなる板状物及び成形
物を被転写体とし、導電性樹脂を感熱又は感圧転
写することにより、電磁波シールド特性を付写す
る転写箔を提供するものであり、均一で高い導電
性を有した導電性樹脂層による優れた電磁波シー
ルド性、樹脂皮膜に保護された優れた表面強度を
有し、作業性に優れ、高い生産性を可能とするも
のである。 The present invention provides a transfer foil that imprints electromagnetic wave shielding properties by heat-sensitive or pressure-sensitive transfer of conductive resin onto plate-shaped objects and molded objects made of plastic. It has excellent electromagnetic shielding properties due to the conductive resin layer and excellent surface strength protected by the resin film, and has excellent workability and enables high productivity.
以下に、実施例について述べる。 Examples will be described below.
〈実施例 1〉
ポリエステルフイルム(厚さ12μ)にゴム系樹
脂を主成分とした塗料をグラビアコート法によ
り、5μ厚に均一に塗布形成しその上に銅粉(平
均粒径5μ)100重量部、カーボンブラツク5重量
部、アクリル樹脂30重量部、乳酸3重量部、トル
エン溶剤100重量部を混合分散し導電性塗料をリ
バースロールコート法にて塗布形成し50μ厚の導
電性樹脂層を設け更に、アクリル樹脂を主成分と
した塗料をグラビアコート法により、5μ厚に塗
布形成せしめ、電磁波シールド用転写箔を得た。<Example 1> A paint mainly composed of rubber resin was applied uniformly to a thickness of 5μ by gravure coating on a polyester film (thickness 12μ), and 100 parts by weight of copper powder (average particle size 5μ) was added on top. , 5 parts by weight of carbon black, 30 parts by weight of acrylic resin, 3 parts by weight of lactic acid, and 100 parts by weight of toluene solvent were mixed and dispersed, and a conductive paint was applied using a reverse roll coating method to form a conductive resin layer with a thickness of 50μ. A transfer foil for electromagnetic shielding was obtained by applying a paint containing acrylic resin as a main component to a thickness of 5 μm using a gravure coating method.
この電磁波シールド用転写箔を5m/m厚の
ABS樹脂板に密着させ、約200℃に加熱したシリ
コンロールでポリエステルフイルム側から加熱加
圧した後、ポリエステルフイルムを剥すと、
ABS樹脂板には、剥離層以下、接着剤層までが
一体となつて転移し、耐セロテープ性も良好な接
着が得られた。尚、導電性樹脂層の体積比抵抗は
10-3Ω−cmであり、得られた電磁波シールド処理
ABS樹脂板をMIL−STD−285に準じてシールド
特性を評価したところ100KHzの低周波帯では
56dB,500MHzでは、85dBの遮蔽効果を示した。 This transfer foil for electromagnetic shielding is 5m/m thick.
After applying heat and pressure from the polyester film side with a silicone roll heated to about 200℃ after adhering it to an ABS resin plate, when the polyester film is peeled off,
The adhesive layer below the release layer was transferred to the ABS resin plate as one, and adhesive with good cellophane tape resistance was obtained. In addition, the volume specific resistance of the conductive resin layer is
10 -3 Ω-cm, and the resulting electromagnetic shielding treatment
When we evaluated the shielding characteristics of ABS resin plates according to MIL-STD-285, in the low frequency band of 100KHz,
At 56dB and 500MHz, it showed a shielding effect of 85dB.
〈実施例 2〉
ポリエステルフイルム(厚さ12μ)にアクリル
系樹脂を主成分とした塗料をグラビアコート法に
より、7μの厚さに均一に塗布形成して剥離層と
し、次にセルロース系樹脂をバインダーとした白
インキで文字を印刷し、次いでニツケル粉(平約
粒径3μ)50重量部、オレイン酸5重量部、トル
エン溶剤30重量部、キシレン溶剤80重量部を混合
分散して成る導電性塗料をリバースロールコート
法で塗布して30μ厚の導電性樹脂層を設け、次に
塩素化ポリプロピレン樹脂を主成分とした接着剤
をグラビアコート法により3μ厚に塗布形成し、
電磁波シールド用転写箔を得た。<Example 2> A paint containing acrylic resin as the main component was uniformly applied to a polyester film (thickness 12μ) to a thickness of 7μ using the gravure coating method to form a release layer, and then cellulose resin was applied as a binder. Conductive paint made by printing characters with white ink, then mixing and dispersing 50 parts by weight of nickel powder (average particle size 3μ), 5 parts by weight of oleic acid, 30 parts by weight of toluene solvent, and 80 parts by weight of xylene solvent. A conductive resin layer with a thickness of 30 μm was formed by applying it using a reverse roll coating method, and then an adhesive mainly composed of chlorinated polypropylene resin was applied to a thickness of 3 μm using a gravure coating method.
A transfer foil for electromagnetic shielding was obtained.
尚、導電性樹脂層は10-2Ω−cmの体積比抵抗を
有するものであつた。 The conductive resin layer had a volume resistivity of 10 -2 Ω-cm.
この電磁波シールド用転写箔を2m/m厚のポ
リプロピレン樹脂板へ密着させ、ポリエステルフ
イルム側から約220℃に加熱したシリコンロール
にて加熱、加圧した後、ポリエステルフイルムを
剥がすと表面保護層となつた剥離層以下、インキ
層、導電性樹脂層、接着剤層が完全に一体となつ
て転移し、ポリプロピレン樹脂板への接着性は、
耐セロテープテストによつても良好な強度を有す
ものであつた。また、得られた電磁波シード処理
ポリプロピレン板をMIL−STD−285に準じてシ
ールド特性を評価したところ100KHzの周波数で
は60dB、500MHzでは80dBといつた良好な電磁
波シールド特性を示した。 This transfer foil for electromagnetic shielding is adhered to a 2m/m thick polypropylene resin plate, heated and pressed from the polyester film side with a silicone roll heated to approximately 220℃, and then the polyester film is peeled off to form a surface protective layer. Below the release layer, the ink layer, conductive resin layer, and adhesive layer are completely integrated and transferred, and the adhesion to the polypropylene resin plate is as follows.
It also had good strength in the cellophane tape resistance test. Furthermore, when the electromagnetic wave seeded polypropylene plate obtained was evaluated for shielding characteristics according to MIL-STD-285, it showed good electromagnetic wave shielding characteristics of 60 dB at a frequency of 100 KHz and 80 dB at 500 MHz.
尚、実施例1で被転写基材として使用した
ABS樹脂板及び、実施例2のポリプロピレン板
の転写前のシールド特性は、100KHz、500MHzの
電磁波でも、0dBであり、シールド性は有さない
ものであつた。 In addition, the material used as the transfer substrate in Example 1
The shielding properties of the ABS resin board and the polypropylene board of Example 2 before transfer were 0 dB even with electromagnetic waves of 100 KHz and 500 MHz, and did not have shielding properties.
第1図、第2図及び第3図は本考案に係わる転
写箔の一実施例の断面を示したものである。
1……プラスチツクフイルム・シート基材、2
……剥離層、3……導電性樹脂層、4……接着剤
層、5……インキ層。
FIGS. 1, 2, and 3 show a cross section of an embodiment of a transfer foil according to the present invention. 1...Plastic film/sheet base material, 2
... Peeling layer, 3 ... Conductive resin layer, 4 ... Adhesive layer, 5 ... Ink layer.
Claims (1)
剥離できる剥離層を形成した後、10Ω−cm以下の
体積比抵抗を有する厚み5μ以上の導電性塗料層
を設け、更にこの上に感熱又は感圧接着剤層を設
けて成ることを特徴とする電磁波シールド用転写
箔。 After forming a release layer that can be peeled off from the base material on the entire surface or part of the sheet base material, a conductive paint layer with a thickness of 5μ or more having a volume resistivity of 10Ω-cm or less is provided, and then a heat-sensitive Or a transfer foil for electromagnetic shielding, characterized in that it is provided with a pressure-sensitive adhesive layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9328882U JPS58195498U (en) | 1982-06-22 | 1982-06-22 | Transfer foil for electromagnetic shielding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9328882U JPS58195498U (en) | 1982-06-22 | 1982-06-22 | Transfer foil for electromagnetic shielding |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58195498U JPS58195498U (en) | 1983-12-26 |
JPH025598Y2 true JPH025598Y2 (en) | 1990-02-09 |
Family
ID=30224018
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9328882U Granted JPS58195498U (en) | 1982-06-22 | 1982-06-22 | Transfer foil for electromagnetic shielding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58195498U (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61225527A (en) * | 1985-03-29 | 1986-10-07 | Takenaka Komuten Co Ltd | Clean room |
JP3475386B2 (en) * | 1997-09-01 | 2003-12-08 | Necトーキン株式会社 | Electromagnetic interference suppressor |
US6114088A (en) * | 1999-01-15 | 2000-09-05 | 3M Innovative Properties Company | Thermal transfer element for forming multilayer devices |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4111191Y1 (en) * | 1964-06-25 | 1966-05-25 | ||
JPS4821200B1 (en) * | 1968-08-30 | 1973-06-27 | ||
JPS49129190A (en) * | 1973-04-15 | 1974-12-11 | ||
JPS5610484A (en) * | 1979-07-05 | 1981-02-02 | Toppan Printing Co Ltd | Manufacture of partially evaporated transfer printing sheet |
JPS56159195A (en) * | 1980-05-13 | 1981-12-08 | Dainippon Printing Co Ltd | Manufacture of transfer sheet with partially evaporated layer |
JPS5734951A (en) * | 1980-08-09 | 1982-02-25 | Matsushita Electric Ind Co Ltd | Transcribing foil |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4821200U (en) * | 1971-07-20 | 1973-03-10 |
-
1982
- 1982-06-22 JP JP9328882U patent/JPS58195498U/en active Granted
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4111191Y1 (en) * | 1964-06-25 | 1966-05-25 | ||
JPS4821200B1 (en) * | 1968-08-30 | 1973-06-27 | ||
JPS49129190A (en) * | 1973-04-15 | 1974-12-11 | ||
JPS5610484A (en) * | 1979-07-05 | 1981-02-02 | Toppan Printing Co Ltd | Manufacture of partially evaporated transfer printing sheet |
JPS56159195A (en) * | 1980-05-13 | 1981-12-08 | Dainippon Printing Co Ltd | Manufacture of transfer sheet with partially evaporated layer |
JPS5734951A (en) * | 1980-08-09 | 1982-02-25 | Matsushita Electric Ind Co Ltd | Transcribing foil |
Also Published As
Publication number | Publication date |
---|---|
JPS58195498U (en) | 1983-12-26 |
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