JPS6350283Y2 - - Google Patents
Info
- Publication number
- JPS6350283Y2 JPS6350283Y2 JP1982030618U JP3061882U JPS6350283Y2 JP S6350283 Y2 JPS6350283 Y2 JP S6350283Y2 JP 1982030618 U JP1982030618 U JP 1982030618U JP 3061882 U JP3061882 U JP 3061882U JP S6350283 Y2 JPS6350283 Y2 JP S6350283Y2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- copper foil
- conductive
- adhesive tape
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 10
- 239000002390 adhesive tape Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000011889 copper foil Substances 0.000 claims description 7
- 239000002245 particle Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- -1 acrylic ester Chemical class 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
- Non-Insulated Conductors (AREA)
Description
本考案は電気伝導性を有する導電性粘着テープ
に関するものである。従来より導電性粘着テープ
は静電遮蔽の必要上、あるいは外装部を接地電位
に維持するために電気的装置や回路要素用の外装
材料として多用されている。その構成は、導電性
粒子を混合した粘着剤を金属箔や、導電性プラス
チツクシート上に塗布したものからなつている。
ところが、粘着剤中に銀粉やカーボンブラツクな
どの導電性粒子を均一に混合することは非常に困
難であるばかりでなく、致命的な欠点はこれによ
つて粘着力がいちじるしく低下することである。
この状況は、ビニルテープなどの一般の粘着テ
ープに、わずかに塵埃が付着するだけで粘着力が
低下し、被着体上に粘着させ得なくなることと同
様である。
本考案は以上の欠点に鑑みなされたもので粘着
剤層中に導電性粒子を混合させる必要のない構成
からなる。
本考案によれば、JIS Ｃ−2170に基ずく粘着力
100〜400g／19mmをもつ一方において、テープ基
材表面より粘着剤層を介して導電性の被着体に通
電したときの電気抵抗が10-1オーム／cm2〜10-3オ
ーム／cm2程度の低抵抗性の導電性粘着テープが得
られる。
本考案を第１図、第２図にて説明する。
図において１はテープ基材であり、片面を電気
化学的に粗化した厚さ５〜70μの銅箔よりなる。
粗化とは電気化学的に銅の表面に極めて不規則
な微細な凹凸を設けたものであり、その突起部の
高さは平均１〜20μ、突起部の底辺の面積は平均
10〜500μ2程度のものであり、プリント配線板の
材料である銅張り積層板に用いるものが適してい
る。
２は粘着剤であり、天然ゴム、ポリクロロプレ
ン、ブタジエンースチレン共重合体、ポリイソブ
チレン、アクリル酸エステル系ゴム、ポリビニル
エーテル系ゴム、などに必要に応じてロジンエス
テル、テルペン樹脂、クマロン樹脂などの粘着付
与剤を加えたものを用いる。粘着剤は通常の粘着
テープの製造に用いられる塗布装置により銅箔の
粗化面に塗布される。
この場合導電性を向上せしめるため、導電性粒
The present invention relates to a conductive adhesive tape having electrical conductivity. Conventionally, conductive adhesive tapes have been widely used as exterior materials for electrical devices and circuit elements for the purpose of electrostatic shielding or for maintaining exterior parts at ground potential. Its structure consists of a metal foil or conductive plastic sheet coated with an adhesive mixed with conductive particles.
However, it is not only very difficult to uniformly mix conductive particles such as silver powder or carbon black into the adhesive, but also a fatal drawback is that this significantly reduces the adhesive strength. This situation is similar to the case where even a small amount of dust adheres to a general adhesive tape such as a vinyl tape, and the adhesive strength decreases, making it impossible to adhere it to an adherend. The present invention was devised in view of the above-mentioned drawbacks, and has a structure that does not require mixing conductive particles into the adhesive layer. According to this invention, the adhesive strength based on JIS C-2170
100 to 400 g/19 mm, while the electrical resistance when electricity is applied from the tape base surface through the adhesive layer to the conductive adherend is 10 -1 ohm/cm 2 to 10 -3 ohm/cm 2 A conductive adhesive tape with a relatively low resistance can be obtained. The present invention will be explained with reference to FIGS. 1 and 2. In the figure, reference numeral 1 denotes a tape base material, which is made of copper foil with a thickness of 5 to 70 μm and one side of which has been electrochemically roughened. Roughening is electrochemically creating extremely irregular fine irregularities on the surface of copper.The height of the protrusions is on average 1 to 20μ, and the area of the base of the protrusions is on average
It has a diameter of about 10 to 500μ2, and is suitable for use in copper-clad laminates, which are materials for printed wiring boards. 2 is an adhesive, which includes natural rubber, polychloroprene, butadiene-styrene copolymer, polyisobutylene, acrylic ester rubber, polyvinyl ether rubber, etc., and optionally rosin ester, terpene resin, coumaron resin, etc. Use one with a tackifier added. The adhesive is applied to the roughened surface of the copper foil using a coating device used in the manufacture of ordinary adhesive tapes. In this case, conductive particles are used to improve conductivity.
【表】
比較例
実施例１に用いた粗化銅箔の代りに厚さ35μの
表面平滑な銅箔を用いて粘着テープを作成し試験
に供した。結果を第２表に示したが実施例に比べ
電気抵抗の小さなものは得られなかつた。[Table] Comparative Example Instead of the roughened copper foil used in Example 1, a 35μ thick copper foil with a smooth surface was used to prepare an adhesive tape and test it. The results are shown in Table 2, and it was not possible to obtain a product with lower electrical resistance than in the Examples.
【表】
以上詳述した如く、本考案の導電性粘着テープ
は、通常の粘着剤をそのまま使用し得るので、優
れた粘着特性と導電性とを具備させることが可能
になつた。[Table] As described in detail above, the conductive adhesive tape of the present invention can be provided with excellent adhesive properties and conductivity because ordinary adhesives can be used as is.
図面はいずれも本考案の実施例を示し第１図は
セパレータを有する粘着テープの断面図、第２図
は背面処理をした粘着テープの断面図である。
１……銅箔、２……粘着剤、３……セパレー
タ、４……背面処理剤。
The drawings all show embodiments of the present invention; FIG. 1 is a sectional view of an adhesive tape having a separator, and FIG. 2 is a sectional view of an adhesive tape with a back surface treatment. 1... Copper foil, 2... Adhesive, 3... Separator, 4... Back treatment agent.
Claims (1)
箔の粗化面に形成された突起部の最大高さを越え
ない厚みに塗布された粘着剤とからなる導電性粘
着テープ。 A conductive adhesive tape comprising a copper foil whose surface has been electrochemically roughened and an adhesive coated to a thickness that does not exceed the maximum height of protrusions formed on the roughened surface of the copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3061882U JPS58135445U (en) | 1982-03-03 | 1982-03-03 | conductive adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3061882U JPS58135445U (en) | 1982-03-03 | 1982-03-03 | conductive adhesive tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58135445U JPS58135445U (en) | 1983-09-12 |
| JPS6350283Y2 true JPS6350283Y2 (en) | 1988-12-23 |
Family
ID=30042324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3061882U Granted JPS58135445U (en) | 1982-03-03 | 1982-03-03 | conductive adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58135445U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004235194A (en) * | 2003-01-28 | 2004-08-19 | Mitsubishi Gas Chem Co Inc | Auxiliary sheet for boring holes with carbon-dioxide gas laser |
| WO2008139994A1 (en) * | 2007-05-09 | 2008-11-20 | Hitachi Chemical Company, Ltd. | Conductor connection member, connection structure, and solar cell module |
| US9660131B2 (en) | 2007-05-09 | 2017-05-23 | Hitachi Chemical Company, Ltd. | Method for connecting conductor, member for connecting conductor, connecting structure and solar cell module |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009041526A1 (en) * | 2007-09-26 | 2009-04-02 | Hitachi Chemical Company, Ltd. | Conductor-connecting member, method for producing the same, connection structure, and solar cell module |
| CN103763893B (en) * | 2014-01-14 | 2016-04-13 | 广州方邦电子股份有限公司 | Electromagnetic shielding film and comprise the manufacture method of wiring board of screened film |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4111191Y1 (en) * | 1964-06-25 | 1966-05-25 | ||
| JPS5478735A (en) * | 1977-12-07 | 1979-06-23 | Fujikura Ltd | Bonding of metallic tape |
-
1982
- 1982-03-03 JP JP3061882U patent/JPS58135445U/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4111191Y1 (en) * | 1964-06-25 | 1966-05-25 | ||
| JPS5478735A (en) * | 1977-12-07 | 1979-06-23 | Fujikura Ltd | Bonding of metallic tape |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4595284B2 (en) * | 2003-01-28 | 2010-12-08 | 三菱瓦斯化学株式会社 | Auxiliary sheet for drilling with carbon dioxide laser |
| JP2004235194A (en) * | 2003-01-28 | 2004-08-19 | Mitsubishi Gas Chem Co Inc | Auxiliary sheet for boring holes with carbon-dioxide gas laser |
| JP5115553B2 (en) * | 2007-05-09 | 2013-01-09 | 日立化成工業株式会社 | Conductor connection member, connection structure, and solar cell module |
| CN103545402A (en) * | 2007-05-09 | 2014-01-29 | 日立化成工业株式会社 | Conductor connection member, connection structure, and solar cell module |
| CN102270669A (en) * | 2007-05-09 | 2011-12-07 | 日立化成工业株式会社 | Conductor connection member, connection structure, and solar cell module |
| CN102332478A (en) * | 2007-05-09 | 2012-01-25 | 日立化成工业株式会社 | Conductor connection member, connection structure, and solar cell module |
| JP2012186486A (en) * | 2007-05-09 | 2012-09-27 | Hitachi Chem Co Ltd | Manufacturing method of solar cell module, conductor connection member for solar cell module, and solar cell module |
| CN102723381A (en) * | 2007-05-09 | 2012-10-10 | 日立化成工业株式会社 | Conductor connection member, connection structure, and solar cell module |
| WO2008139994A1 (en) * | 2007-05-09 | 2008-11-20 | Hitachi Chemical Company, Ltd. | Conductor connection member, connection structure, and solar cell module |
| JPWO2008139994A1 (en) * | 2007-05-09 | 2010-08-05 | 日立化成工業株式会社 | Conductor connection member, connection structure, and solar cell module |
| CN102723381B (en) * | 2007-05-09 | 2015-08-19 | 日立化成株式会社 | Conductor connection member |
| TWI547539B (en) * | 2007-05-09 | 2016-09-01 | Hitachi Chemical Co Ltd | A conductor connection member, a connection structure, and a solar battery Module |
| US9660131B2 (en) | 2007-05-09 | 2017-05-23 | Hitachi Chemical Company, Ltd. | Method for connecting conductor, member for connecting conductor, connecting structure and solar cell module |
| TWI602899B (en) * | 2007-05-09 | 2017-10-21 | 日立化成股份有限公司 | A conductor connection member, a connection structure, and a solar battery module |
| US10032952B2 (en) | 2007-05-09 | 2018-07-24 | Hitachi Chemical Company, Ltd. | Connecting structure and solar cell module |
| US10186627B2 (en) | 2007-05-09 | 2019-01-22 | Hitachi Chemical Company, Ltd. | Conductor connection member, connection structure, and solar cell module |
| TWI655266B (en) * | 2007-05-09 | 2019-04-01 | 日立化成股份有限公司 | Conductor connecting member, connection structure and solar battery module |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58135445U (en) | 1983-09-12 |
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